[Legacy Report] 2D Materials Advantages and Challenges Towards Applications

#2D #electronics #graphene #and #copper
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Two-dimensional (2D) materials present unique opportunities for next generation ultra-thin electronics. However, practical 2D devices can only be realized after overcoming key challenges: contact resistance, stable doping, and uniform growth.
In this talk I will highlight the recent research our group has implemented to improve contact and doping in BP and MoS2 transistors.   I will then show our work beyond transistor applications using 2D materials, such as graphene-Cu interconnects and hBN-RRAM, that are promising for three-dimensional integrated electronics.


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  • Date: 15 Aug 2017
  • Time: 11:30 AM to 01:30 PM
  • All times are (GMT-08:00) US/Pacific
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  • Santa Clara, California
  • United States
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  Speakers

Ching-Hua (Fiona) Wang of Stanford University

Topic:

2D Materials Advantages and Challenges Towards Applications

Biography:

Address:Palo Alto, United States