Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology
IEEE-EDS Distinguished Lecture
IEEE-Canada | Kitchener-Waterloo EDS Chapter
Speaker: Professor Joachim N. Burghartz, IEEE Fellow
Title: Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology
IEEE-EDS Distinguished Lecture: Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology
Abstract:
Flexible electronics add mechanical flexibility, adaptivity and stretchability as well as large‐area placeability to electronic systems, thus allowing for
conquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large‐area devices and ultra‐thin silicon chips
on flexible substrates is now viewed as an enabler to high‐performance and reliable industrial solutions as well as high‐end consumer applications of
flexible electronics. This talk discusses issues in ultra‐thin chip fabrication, device modeling and circuit design, as well as assembly and interconnects for thin chips embedded in foil substrates. Numerous distinct differences to conventional silicon technology justify the statement that ultra‐thin chips features a new paradigm in silicon technology.
Date and Time
Location
Hosts
Registration
- Date: 08 May 2018
- Time: 10:30 AM to 11:59 AM
- All times are (GMT-05:00) Canada/Eastern
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- University of Waterloo
- 200 University Avenue West
- Waterloo, Ontario
- Canada N2L3G1
- Building: DC
- Room Number: 1302
- Contact Event Host
- Co-sponsored by CH07100 - Kitchener-Waterloo Section Chap, SSC37
Speakers
Prof. Joachim Burghartz of Institut für Mikroelektronik Stuttgart | Institute for Microelectronics Stuttgart
Ultra‐thin Chips ‐ a New Paradigm in Silicon Technology
Flexible electronics add mechanical flexibility, adaptivity and stretchability as well as large‐area placeability to electronic systems, thus allowing for conquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large‐area devices and ultra‐thin silicon chips on flexible substrates is now viewed as an enabler to high‐performance and reliable industrial solutions as well as high‐end consumer applications of flexible electronics. This talk discusses issues in ultra‐thin chip fabrication, device modeling and circuit design, as well as assembly and interconnects for thin chips embedded in foil substrates. Numerous distinct differences to conventional silicon technology justify the statement that ultra‐thin chips features a new paradigm in silicon technology.
Biography:
Joachim N. Burghartz is an IEEE Fellow, an IEEE Distinguished Lecturer, recipient of the 2014 EDS J.J. Ebers Award, and has been an ExCom member of the IEEE Electron Devices Society. He received his MS degree from RWTH Aachen in 1982 and his PhD degree in 1987 from the University of Stuttgart, both in Germany. From 1987 thru 1998 he was with the IBM T. J. Watson Research Center in Yorktown Heights, New York, where he was engaged in early development of SiGe HBT technology and later in research on integrated passive components, particularly inductors, for application to monolithic RF circuits. From 1998 until 2005 he was with TU Delft in the Netherlands as a full professor and from 2001 as the Scientific Director of the Delft research institute DIMES. In fall 2005 he moved to Stuttgart, Germany, to head the Institute for Microelectronics Stuttgart (IMS CHIPS). In addition he is affiliated with the University of Stuttgart as a full professor. More recently, he also became CEO of the IMS Mikro‐Nano Produkte GmbH. Dr. Burghartz has published about 350 reviewed articles and holds more than 30 patents.
Email:
Address:Institut für Mikroelektronik Stuttgart, Allmandring 30 a, Stuttgart, Germany, 70569
Date: Tuesday, May 8, 2018
Time: 10:30AM (ET)
Location: University of Waterloo, DC 1302
All are Welcome!