Flexible Hybrid Electronics: System as Package
According to an IEEE Spectrum report released in 2016, the connected Internet of Things world was, at the time, forecasted to consist of about 30 billion objects by 2020. This number is reduced from the 50 billion connected devices by 2020 forecast in 2010 by Ericsson and Cisco, and from the forecast of one trillion connected devices by 2020 by IBM in 2012. An underlying premise of the successfully connected IoT object world is that those devices are low cost and ubiquitous so that they can be easily deployed, and devices lacking these crucial factors have created a barrier against widespread IoT adoption. Flexible hybrid electronics (FHE) address these issues with two unique factors that traditional technology cannot provide: it uses additive processing to reduce manufacturing cost; and enables placement of devices on conformal, flexible or stretchable surfaces at low cost. Examples for industrial, medical, automotive and consumer markets will show how additive manufacturing, combined with flexible substrates, can deliver on the promise of the “electronics on everything.”
Date and Time
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Registration
- Date: 23 Aug 2018
- Time: 11:30 AM to 02:00 PM
- All times are (GMT-08:00) US/Pacific
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- 2244 Blach Place # 150
- San Jose, California
- United States 95131
- Starts 13 June 2018 11:44 AM
- Ends 20 August 2018 03:00 PM
- All times are (GMT-08:00) US/Pacific
- No Admission Charge
Speakers
Wilfried
Flexible Hybrid Electronics: System as Package
Biography:
Wilfried holds advanced degrees in Manufacturing and Production Planning Systems, Organizational Development, and International Marketing from the University of Linz in Austria. He is Vice President of Engineering at NextFlex.