Manufacturable Heterogeneous Integration of Compliant CMOS Electronics for Interactive Electronic Systems

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Can be CMOS technology expanded further to achieve new features in CMOS electronics while maintaining
and/or strengthening existing attributes? Will the functionalities over cost be advantageous? Can the existing
applications be further strengthened and/or diversified? What potential applications may emerge? He will
discuss rational design of materials, processes and devices to develop robust manufacturing processes through
heterogeneous integration of state-of-the-art CMOS technologies to transform conventional high performance
but rigid CMOS electronics into fully compliant one; various printing techniques (inkjet for interconnects,
3D printing for encapsulation); electrochemical deposition (ECD) for through polymer via (TPV); automated
transfer; Lego like lock and key assembly; non-functionalized household papers and other responsive materials
based sensors and actuators, respectively and finally their roll-to-roll processing to achieve nature inspired
fully compliant in-plane and out-of-plane CMOS electronics for emerging IoE applications. I will also show a
few examples on our extensive work on interactive electronic system and discuss their design criteria as a new
generation of add-on, wearable and implantable electronics.



  Date and Time

  Location

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  • Date: 04 Sep 2018
  • Time: 10:00 AM to 11:30 AM
  • All times are (UTC+02:00) Prague
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  • CTU in Prague, FEE
  • Technicka 2
  • Praha 6, Czech Republic
  • Czech Republic 166 27
  • Room Number: 80
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  Speakers

Prof. Muhammad Mustafa Hussain

Topic:

Manufacturable Heterogeneous Integration of Compliant CMOS Electronics for Interactive Electronic Systems

Can be CMOS technology expanded further to achieve new features in CMOS electronics while maintaining
and/or strengthening existing attributes? Will the functionalities over cost be advantageous? Can the existing
applications be further strengthened and/or diversified? What potential applications may emerge? He will
discuss rational design of materials, processes and devices to develop robust manufacturing processes through
heterogeneous integration of state-of-the-art CMOS technologies to transform conventional high performance
but rigid CMOS electronics into fully compliant one; various printing techniques (inkjet for interconnects,
3D printing for encapsulation); electrochemical deposition (ECD) for through polymer via (TPV); automated
transfer; Lego like lock and key assembly; non-functionalized household papers and other responsive materials
based sensors and actuators, respectively and finally their roll-to-roll processing to achieve nature inspired
fully compliant in-plane and out-of-plane CMOS electronics for emerging IoE applications. I will also show a
few examples on our extensive work on interactive electronic system and discuss their design criteria as a new
generation of add-on, wearable and implantable electronics.

Biography:

Muhammad Mustafa Hussain (PhD, ECE, UT Austin, Dec 2005) is a Professor of Electrical Engineering at King
Abdullah University of Science and Technology (KAUST). He was Program Manager in SEMATECH (2008-2009) and
Process Integration Lead for 22 nm node FinFET CMOS in Texas Instruments (2006-2008). His research is focused on
futuristic electronics which has received support from DARPA, Boeing, Lockheed Martin, GSK-Novartis and SABIC. He
has authored 300+ research papers and patents. He is a Fellow of American Physical Society and Institute of Physics, a
distinguished lecturer of IEEE Electron Devices Society, and an Editor of IEEE T-ED. Scientific American has listed his
research as one of the Top 10 World Changing Ideas of 2014. Applied Physics Letters selected his paper as one of the Top
Feature Articles of 2015. He and his students have received 41 research awards including IEEE Outstanding Individual
Achievement Award 2016, Outstanding Young Texas Exes Award 2015 DOW Chemical Sustainability Challenge Award
2012, etc.