Linda Bal of TechSearch International, Inc

ADAS and eventually autonomous driving require recognition of surrounding conditions by a variety of sensors, then decision-making and operation in response.  There are multiple sensors with overlap in their coverage areas.  The combinations of sensors (radar, LIDAR, ultrasonic, camera, and V2X) vary by integrator, automotive maker, and vehicle model.  What type of semiconductor packages are used for each sensor and what are the future challenges as new package types are adopted?  This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications.

Biography:

Linda Bal is a senior analyst with TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  Linda has more than 25 years of experience in the design, test, and manufacturing of electronic packaging for semiconductors and systems while at Freescale, Motorola, Microelectronics and Computer Technology Corporation (MCC), and Eastman Kodak.  Linda has authored and co-authored numerous publications.  She is co-author of “New Frontiers in Automotive Electronics Packaging,” a major research study published in 2018 by TechSearch International. A member of IEEE and IMAPS, Linda received her BSEE degree from Purdue University.

Email: