Thermal Management Challenges and Opportunities for Heterogeneous Packages

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This Webinar covers two primary thermal aspects related to heterogeneous integration: (a) definition of canonical problems and thermal challenges, and (b) active research areas and results, which have been the focus of the published 2019 Roadmap chapter. The canonical problems have included: 2D chip with stacked memory on a silicon/glass interpose; 3D stacked die with conduction interfaces; 3D stacked die with embedded liquid cooling; optics/photonics cooling; thermal management for harsh environment (military, aerospace, automobile); mobile applications; and voltage regulators. The research and cooling advances encompass Thermal Interface Materials, liquid cooling, single and two-phase liquid cooling, air cooling, materials, and modeling. 

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