Modeling and Simulation for Heterogeneous Integration
eps.ieee.org/education/eps-webinars.html
The Modeling and Simulation chapter of the Heterogeneous Integration Roadmap covers the design, modeling and simulation tools that are key enabling technologies for Heterogeneous Integrated Electronic Systems that will support product development across the chip-package-board-system domains. This Roadmap chapter details the key challenges and potential solutions over 5-, 10-, and 15-year horizons, and explains how these tools will support the knowledge base for heterogeneous integrated electronic systems.
Date and Time
Location
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- Date: 08 Jul 2020
- Time: 08:00 AM to 09:00 AM
- All times are (GMT-08:00) US/Pacific
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- Starts 08 June 2020 07:16 PM
- Ends 08 July 2020 09:00 AM
- All times are (GMT-08:00) US/Pacific
- No Admission Charge
Speakers
Chris of University of Greenwich
Biography:
Prof. Chris Bailey is Director of the Computational Mechanics and Reliability Group at the University of Greenwich, managing a team of 16 academic staff, research fellows and PhD students. The group focuses its research efforts on the development of design and modeling tools for predicting the performance, reliability and maintainability of engineering processes, components and systems. This includes the development of software tools such as PHYSICA, ROMARA and Powerlife. Chris is a member of the NAFEMS Multi-Physics Modelling working group, serves as president of IEEE-EPS, is a member of the INEMI Roadmap team, and chairs the HI Roadmap Working Group on Modeling and Simulation.
Xuejun Fan of Lamar University, Beaumont, Texas
Biography:
Xuejun Fan is a Regents’ Professor of Texas State University System, and Professor at Lamar University, Beaumont, Texas. He is an IEEE Fellow, and an IEEE Distinguished Lecturer. He currently serves as a member-at-large of the IEEE Electronic Packaging Society (EPS) Board of Governors. He gained significant experience in the microelectronics industry between 1997 and 2007 at IME, Philips and Intel. He received the Outstanding Sustained Technical Contribution Award in 2017, and Exceptional Technical Achievement Award in 2011, from the IEEE Electronic Packaging Society. He is also co-chair for the modeling and simulation technical working group of the Heterogeneous Integration Roadmap