Device and Circuit Design for On-Chip ESD Protection

#sscs #cas #isscc #esd #analog
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  • Date: 25 Apr 2024
  • Time: 12:00 PM to 01:00 PM
  • All times are (UTC-05:00) Central Time (US & Canada)
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  • Starts 07 April 2024 12:00 AM
  • Ends 25 April 2024 01:00 PM
  • All times are (UTC-05:00) Central Time (US & Canada)
  • No Admission Charge


  Speakers

Elyse Rosenbaum of University of Illinois, Urbana-Champaign

Topic:

Device and Circuit Design for On-Chip ESD Protection

Circuit designers may view on-chip ESD protection as a nuisance; the protection devices consume valuable Si real estate and increase the loading at IO ports. To start this seminar, I will explain why on-chip protection is required on CMOS ICs and why we cannot (entirely) mitigate the ESD hazard externally. The general principles of on-chip ESD protection network design will be reviewed. The balance of the presentation will focus on recent works from my group. I will argue that by adapting protection devices to advanced process nodes and creating compact models of those protection devices, one can jointly optimize a front-end circuit for ESD reliability and signal integrity, even if the IO is operating at many tens or hundreds of Gb/s.

Biography:

Elyse Rosenbaum is the Melvin and Anne Louise Hassebrock Professor in Electrical and Computer Engineering at the University of Illinois Urbana-Champaign. She received a Ph.D. in electrical engineering from University of California, Berkeley. She is the director of the NSF-supported Center for Advanced Electronics through Machine Learning (CAEML), a joint project of the University of Illinois, North Carolina State University, and Penn State. Her current research interests include CDM-ESD reliability, ESD-robust high-speed I/O circuit design, compact modeling, optimization of heterogeneously integrated system-in-package, and machine learning aided modeling of circuit lifetime distributions.

Dr. Rosenbaum has authored or co-authored over 200 technical papers; she has been an editor for IEEE Transactions on Device and Materials Reliability and IEEE Transactions on Electron Devices. She served as the General Chair of the 2018 International Reliability Physics Symposium. Dr. Rosenbaum was the recipient of a Best Student Paper Award from the IEDM, an Outstanding Paper Award and 2 Best Paper Awards from the EOS/ESD Symposium, a Technical Excellence Award from the SRC, an NSF CAREER award, an IBM Faculty Award, and the ESD Association’s Industry Pioneer Recognition Award. She is a Fellow of the IEEE.