3D Integration in Advanced CMOS and Sensors
As traditional computing technologies continue to scale, cost and process complexity has driven the industry to look for new sources of performance gains. 3D integration has shown to be a disruptive technology that has demonstrated dramatic improvements in system speed, power consumption, and noise reduction. By reducing parasitic losses and improving connectivity, 3D technologies can be used in conjunction with the most advanced 2D technologies and offer a means to harness the full system performance potential. This presentation will review current industry advances, as well as a glimpse into the next generation of 3D.
Speaker Bio
Brian Mattis is the Director of Integration Engineering at Novati Technologies, leading the development and integration of emerging technologies. He provides technology development and product commercialization solutions for companies exploringc, MEMS, BioMEMs, and semiconductor technologies. Prior to Novati, he held device engineering positions at Samsung and Intel, where he helped build the integration for the 45nm, 32nm, and 16nm nodes. Brian has extensive experience in device integration, semiconductor physics, technology pathfinding, and risk analysis. Brian is a founding officer of the IEEE Central Texas MEMS & Sensors Chapter and holds Ph.D., M.S., and B.S. degrees from the University of California, Berkeley in Electrical Engineering, with a minor in Material Science.
Date and Time
Location
Hosts
Registration
- Date: 19 Sep 2017
- Time: 06:00 PM to 08:00 PM
- All times are (GMT-06:00) US/Central
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- Capital Factory
- 701 Brazos Street
- Austin, Texas
- United States 78701
- Room Number: Mobility X
- Click here for Map
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- Co-sponsored by Capital Factory
- Starts 29 August 2017 09:00 AM
- Ends 19 September 2017 07:55 PM
- All times are (GMT-06:00) US/Central
- No Admission Charge
Agenda
6:00 Doors, light food & beverages, networking
7:00-7:50 Presentation
7:50-8:00 Q&A
8:00 End