BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Eastern BEGIN:DAYLIGHT DTSTART:20180311T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20181104T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20191114T193440Z UID:0B67325B-DBB4-43C9-8C43-ABBF093C5BA3 DTSTART;TZID=US/Eastern:20180413T080000 DTEND;TZID=US/Eastern:20180413T163000 DESCRIPTION:The [Center for Signal Integrity](https://harrisburg.psu.edu/ce nter-signal-integrity) at Penn State Harrisburg will host the Twelfth Cent ral Pennsylvania Symposium on Signal Integrity\, Friday\, April 13\, 2018 from 8 a.m. to 4:30 p.m. in the Capital Union Building on campus. Signal i ntegrity involves the quality of electrical signals passing through connec tors used in electronic devices like computers or cellular phones. Note: F ree parking only on the Library Parking lot (https://harrisburg.psu.edu/pl aces/library). Anywhere else on campus\, please get a temporary parking pe rmit from one of the automated kiosks and place it on the dashboard. Regis tration fee includes light breakfast and lunch.\n\nCo-sponsored by: Penn S tate Harrisburg\n\nAgenda: \n8:00 to 8:30\n\nRegistration Breakfast\n\n8:3 0 to 9:30\n\nWelcome and Plenary Speaker 1\, Main Room\n\nDr. Guoan Wong\, University of South Carolina. Title “Toward Fully Electrically Reconfig urable RF and Microwave Technologies with Novel Thin Films and Techniques ”\n\nAbstract: This talk will present the development of frequency agile and fully electrically tunable miniaturized RF and microwave devices with different novel thin films and related techniques (i.e.\, on-chip tuning) enabling multifunctional and adaptive radios. First\, the needs and requi rements for adaptive and reconfigurable frequency control components in ne xt generation wireless devices will be described. Overview of current tuni ng techniques (e.g.\, RF MEMS\, ferroelectric and ferromagnetic films) wil l be briefly discussed and summarized\, followed by the applications of th ese components in adaptive wireless systems.\n\n9:40 to 11:10\n\nWorkshop 1: Keysight\n(Main Room)\n\nOJ Danzy and Russ Kramer\n\nTopic: “The Powe r Integrity Ecosystem…..it’s more than decoupling capacitors”\n\nAbs tract: The paper will cover aspects of the signal integrity and power inte grity efforts in modern day electronic circuits with their high levels of integration. The full SI and PI Eco-System looks at validating the Signal Integrity with the addition of the degradation caused by the Power Deliver y network. The paper will discuss ways to do this.\n\nBio: Russ Kramer rec eived a BSEE and an MSEE from Penn State University Park and an MBA from L oyola University.\n\nWorkshop 2\, Ansys\nChris Mesibov\n\nTopic: “Signal Integrity and the Hardware Development Process”\n\nAbstract: In today ’s high speed digital device development process\, companies are discove ring that SI/PI activities are creeping into most segments of the developm ent process. This presentation’s goal is to demonstrate a typical hardwa re development process and show all the areas in which SI/PI activities ar e present. The outgrowth of this demonstration is familiarization with the elements of the process and typical examples of interactions that SI engi neers experience with subject matter experts (SMEs) and non-engineering fu nctional departments such as purchasing and QC. Understanding the HW devel opment process allows us to identify to our organization that SI engineeri ng is a significant stakeholder in the process. Applying SI/PI in areas wh ere appropriate and implementing simulation in a way that saves the compan y money through meeting schedule objectives\, reducing PCB spins and reduc ed test time.\n\n11:15 to 12:15\n\nPlenary Speaker 2\n\nDr. Piero Triverio \, University of Toronto. Title” Fast Electromagnetic Analysis of 3D Int erconnects Using a Surface Integral Formulation"\n\nAbstract: We present a new surface integral method for Maxwell's equations which is very well su ited for signal integrity analysis. A novel surface admittance operator is used to model skin and proximity effect inside conductive objects of arbi trary shape. The operator is computationally efficient\, since it requires only a surface mesh\, but broadband and Maxwell-accurate. Couplings betwe en different conductive objects are modelled with the method of moments\, accelerated with the adaptive integration method and iterative solution te chniques. Several application examples related to 2D/3D integration will b e presented to show the accuracy\, robustness and scalability of the propo sed method.\n\n12:15 to 1:10\n\nLunch Speaker:\n\nRichard Mellitz\, Samtec Distinguished Engineer\, Title “Effective Return Loss for 112G\nand 56G PAM 4”\n\nAbstract: This presentation proposes using a pulse echo for t ime domain reflectometry (TDR) rather the commonly used step function echo . The echoed pulse response of a single symbol is convolved with the modul ation signal levels to produce an effective reflection coefficient metric at a specified bit error ratio (BER). A conversion to dB results in an eff ective return loss (ERL) in more familiar return loss units. ERL is a sing le value which replaces the commonly used frequency domain return loss (RL ) mask. It makes RL grading simple\, straightforward and meaningful.\n\nRi chard Mellitz is presently a Distinguished Engineer at Samtec\, supporting interconnect signal integrity and industry standards.\n\n1:15 to 2:15\n\n Plenary Speaker 3\n\nJason Ellison\, Senior Staff Signal Integrity Enginee r\, Amphenol ICC\, title “In situ stripline laminate property extraction accounting for effective surface roughness losses”\n\nAbstract: A metho d for extracting the effective copper surface roughness of a laminate in s itu is introduced. The rough copper attenuation as a function of surface r oughness is removed from the total attenuation. The residual loss is fit t o coefficients\, and an error is calculated based on the remaining apparen t surface roughness contribution. When the error is minimized or when the apparent surface roughness contribution is nearest zero\, the effective su rface roughness is found\, and the dielectric attenuation is isolated by s ubtracting the rough copper attenuation from the total attenuation.\n\n2:3 0 to 4:00\n\nWorkshop 3 (Main Room)\n\nChris Scholz\, Rohde & Schwarz USA\ , Inc.\n\nSignal Integrity tools for PAM4 and beyond\n\nAs data rates incr ease and the applications move to higher-order modulation formats\, VNAs b ecome a crucial part of the Signal Integrity Engineers’ toolbox.\n\nIn t his talk we will present the rich set of signal integrity tools available for modern VNAs. Specific topics addressed include estimation of channel c apacity\, channel equalization techniques\, methods to characterize crosst alk\, PAM4 and higher order modulation and advanced de-embedding technique s.\n\nChris Scholz is product manager for vector network analyzers for Roh de & Schwarz North America.\n\nWorkshop 4\n\nTracey Vincent\, CST\n\nLever aging Complete Technology for Connector and other SI applications\n\nTrace y is a Senior Application Engineer with the CST\, part of the Simulia grou p of Dassault Systems. She is located in MA focusing on Signal Integrity a nd Materials Characterization for 3D simulations. She has a Masters Degree in Electrical and Electronic Engineering\, a Masters degree in Numerical Techniques where she wrote a finite element program to solve fields in Fer rimagnetic materials and PhD in Material Science. Tracey was previously em ployed as a design engineer for more years that she cares to admit\n\nRoom : Convocation Room \, Bldg: Building: CUB \, 777 West Harrisburg Pike \, Middletown\, Pennsylvania\, United States\, 17057 LOCATION:Room: Convocation Room \, Bldg: Building: CUB \, 777 West Harris burg Pike \, Middletown\, Pennsylvania\, United States\, 17057 ORGANIZER:awm2@psu.edu SEQUENCE:14 SUMMARY:12th Central PA Symposium On Signal Integrity URL;VALUE=URI:https://events.vtools.ieee.org/m/168354 X-ALT-DESC:Description: <br /><p><span style="font-size: 14pt\;">The <a hre f="https://harrisburg.psu.edu/center-signal-integrity">Center for Signal I ntegrity</a> at Penn State Harrisburg will host the Twelfth&nbsp\; Central Pennsylvania Symposium on Signal Integrity\, Friday\, April 13\, 2018 fro m 8 a.m. to 4:30 p.m. in the Capital Union Building on campus. Signal inte grity involves the quality of electrical signals passing through connector s used in electronic devices like computers or cellular phones. <strong>No te</strong>: Free parking only on the Library Parking lot (https://harrisb urg.psu.edu/places/library). Anywhere else on campus\, please get a tempor ary parking permit from one of the automated kiosks and place it on the da shboard. <strong>Registration fee includes light breakfast and lunch</stro ng>.</span></p><br /><br />Agenda: <br /><table width="0">\n<tbody>\n<tr>\ n<td width="23%">\n<p>8:00 to 8:30&nbsp\;</p>\n</td>\n<td colspan="2" widt h="75%">\n<p><strong>Registration Breakfast</strong></p>\n</td>\n</tr>\n<t r>\n<td width="23%">\n<p>8:30 to 9:30 &nbsp\;</p>\n</td>\n<td colspan="2" width="75%">\n<p><strong>Welcome and Plenary Speaker 1\, Main Room</strong ></p>\n<p><strong>Dr. Guoan Wong</strong>\, University of South Carolina. <strong>Title </strong>&ldquo\;<strong>Toward Fully Electrically Reconfigu rable RF and Microwave Technologies with Novel Thin Films and Techniques&r dquo\;</strong></p>\n<p>Abstract:&nbsp\; This talk will present the develo pment of frequency agile and fully electrically tunable miniaturized RF an d microwave devices with different novel thin films and related techniques (i.e.\, on-chip tuning) enabling multifunctional and adaptive radios.&nbs p\; First\, the needs and requirements for adaptive and reconfigurable fre quency control components in next generation wireless devices will be desc ribed.&nbsp\; Overview of current tuning techniques (e.g.\, RF MEMS\, ferr oelectric and ferromagnetic films) will be briefly discussed and summarize d\, followed by the applications of these components in adaptive wireless systems.</p>\n</td>\n</tr>\n<tr>\n<td width="23%">\n<p>9:40 to 11:10</p>\n </td>\n<td width="40%">\n<p><strong>Workshop 1: Keysight<br /> (Main Room) </strong></p>\n<p><strong>OJ Danzy and Russ Kramer</strong></p>\n<p><stron g>Topic: &ldquo\;The Power Integrity Ecosystem&hellip\;..it&rsquo\;s more than decoupling capacitors&rdquo\;</strong></p>\n<p>&nbsp\;Abstract:&nbsp\ ; The paper will cover aspects of the signal integrity and power integrity efforts in modern day electronic circuits with their high levels of integ ration.&nbsp\; The full SI and PI Eco-System looks at validating the Signa l Integrity with the addition of the degradation caused by the Power Deliv ery network. &nbsp\;The paper will discuss ways to do this.</p>\n<p>&nbsp\ ;Bio: Russ Kramer received a BSEE and an MSEE from Penn State University P ark and an MBA from Loyola University.&nbsp\;</p>\n</td>\n<td width="34%"> \n<p><strong>Workshop 2\, Ansys</strong><br /> &nbsp\;<strong>Chris Mesibo v</strong></p>\n<p><strong>Topic: &ldquo\;Signal Integrity and the Hardwar e Development Process&rdquo\;</strong></p>\n<p>Abstract: In today&rsquo\;s high speed digital device development process\, companies are discovering that SI/PI activities are creeping into most segments of the development process.&nbsp\; This presentation&rsquo\;s goal is to demonstrate a typica l hardware development process and show all the areas in which SI/PI activ ities are present. The outgrowth of this demonstration is familiarization with the elements of the process and typical examples of interactions that SI engineers experience with subject matter experts (SMEs) and non-engine ering functional departments such as purchasing and QC.&nbsp\; Understandi ng the HW development process allows us to identify to our organization th at SI engineering is a significant stakeholder in the process.&nbsp\; Appl ying SI/PI in areas where appropriate and implementing simulation in a way that saves the company money through meeting schedule objectives\, reduci ng PCB spins and reduced test time.</p>\n</td>\n</tr>\n<tr>\n<td width="23 %">\n<p>11:15 to 12:15&nbsp\;</p>\n</td>\n<td colspan="2" width="75%">\n<p ><strong>Plenary Speaker 2</strong></p>\n<p><strong>Dr. Piero Triverio\, U niversity of Toronto. </strong>Title<strong>&rdquo\;</strong><strong> Fast Electromagnetic Analysis of 3D Interconnects Using a&nbsp\; Surface Integ ral Formulation"</strong></p>\n<p>Abstract: We present a new surface integ ral method for Maxwell's&nbsp\; equations which is very well suited for si gnal integrity analysis. A novel surface admittance operator is used to mo del skin and proximity effect inside conductive objects of arbitrary shape . The operator is computationally efficient\, since it requires only a sur face mesh\, but broadband and Maxwell-accurate. Couplings between differen t conductive objects are modelled with the method of moments\, accelerated with the adaptive integration method and iterative solution techniques. S everal application examples related to 2D/3D integration will be presented to show the accuracy\, robustness and scalability of the proposed method. </p>\n</td>\n</tr>\n<tr>\n<td width="23%">\n<p>12:15 to 1:10</p>\n</td>\n< td colspan="2" width="75%">\n<p><strong>Lunch Speaker:</strong></p>\n<p><s trong>Richard Mellitz</strong>\, Samtec Distinguished Engineer\, Title <st rong>&ldquo\;Effective Return Loss for 112G</strong><br /><strong> and 56G PAM 4&rdquo\;</strong></p>\n<p>Abstract: This presentation proposes using a pulse echo for time domain reflectometry (TDR) rather the commonly used step function echo.&nbsp\; The echoed pulse response of a single symbol i s convolved with the modulation signal levels to produce an effective refl ection coefficient metric at a specified bit error ratio (BER).&nbsp\;&nbs p\;A conversion to dB results in an effective return loss (ERL) in more fa miliar return loss units. ERL is a single value which replaces the commonl y used frequency domain return loss (RL) mask. It makes RL grading simple\ , straightforward and meaningful.</p>\n<p><strong>Richard Mellitz</strong> is presently a Distinguished Engineer at Samtec\, supporting interconnect signal integrity and industry standards.</p>\n</td>\n</tr>\n<tr>\n<td wid th="23%">\n<p>1:15 to 2:15</p>\n</td>\n<td colspan="2" width="75%">\n<p><s trong>Plenary Speaker 3</strong></p>\n<p><strong>Jason Ellison\, </strong> Senior Staff Signal Integrity Engineer\, Amphenol ICC\, title &nbsp\;<stro ng>&ldquo\;In situ stripline laminate property extraction accounting for e ffective surface roughness losses&rdquo\;</strong></p>\n<p>&nbsp\;</p>\n<p >Abstract: A method for extracting the effective copper surface roughness of a laminate in situ is introduced. The rough copper attenuation as a fun ction of surface roughness is removed from the total attenuation. The resi dual loss is fit to coefficients\, and an error is calculated based on the remaining apparent surface roughness contribution. When the error is mini mized or when the apparent surface roughness contribution is nearest zero\ , the effective surface roughness is found\, and the dielectric attenuatio n is isolated by subtracting the rough copper attenuation from the total a ttenuation.</p>\n</td>\n</tr>\n<tr>\n<td width="23%">\n<p>2:30 to 4:00</p> \n</td>\n<td width="40%">\n<p><strong>Workshop 3 (Main Room)</strong></p>\ n<p><strong>Chris Scholz\, Rohde &amp\; Schwarz USA\, Inc.</strong></p>\n< p><strong>Signal Integrity tools for PAM4 and beyond</strong></p>\n<p>As d ata rates increase and the applications move to higher-order modulation fo rmats\, VNAs become a crucial part of the Signal Integrity Engineers&rsquo \; toolbox.</p>\n<p>In this talk we will present the rich set of signal in tegrity tools available for modern VNAs. Specific topics addressed include estimation of channel capacity\, channel equalization techniques\, method s to characterize crosstalk\, PAM4 and higher order modulation and advance d de-embedding techniques.</p>\n<p>Chris Scholz is product manager for vec tor network analyzers for Rohde &amp\; Schwarz North America.</p>\n<p>&nbs p\;</p>\n</td>\n<td width="34%">\n<p><strong>Workshop 4</strong></p>\n<p>< strong>Tracey Vincent\, CST</strong></p>\n<p><strong>Leveraging Complete T echnology for Connector and other SI applications</strong></p>\n<p>Tracey is a Senior Application Engineer with the CST\, part of the Simulia group of Dassault Systems. She is located in MA focusing on Signal Integrity and Materials Characterization for 3D simulations. She has a Masters Degree i n Electrical and Electronic Engineering\, a Masters degree in Numerical Te chniques where she wrote a finite element program to solve fields in Ferri magnetic materials and PhD in Material Science. Tracey was previously empl oyed as a design engineer for more years that she cares to admit</p>\n</td >\n</tr>\n</tbody>\n</table>\n<p>&nbsp\;</p> END:VEVENT END:VCALENDAR