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DTSTAMP:20180503T000000Z
UID:BEFEBCFA-0290-4BCB-9482-83CB7EFE0B48
DTSTART;TZID=Canada/Eastern:20180412T124500
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DESCRIPTION:Part 1\n\nAdditive Manufacturing Techniques (3D Printing) for M
 icrowave Devices and Systems\n\n- Introducing three methodologies to 3D-pr
 int RF and microwave components:\n\n- Fused Deposition Modeling (FDM)\n- B
 inder Jetting technique\n- Photo-polymerization\n\n- Designing broadband i
 nterconnects such as SIW and SISW waveguides.\n- Integrating 3D-printing t
 echniques with microwave technologies (SIW and NRD) to create innovative c
 omponents and systems suitable for the Internet of Things (IoT) and the 5G
  applications.\n\nPart 2\n\nIEEE Student Branch\, University of Pavia\, It
 aly\n\n- IEEE: Institute of Electrical and Electronics Engineers\n- IEEE S
 tudent Branch: Goals\, Activities\, Organization\n- IEEE Student Branch\, 
 University of Pavia:\n\nMembers\, Committees\, Activities\, Awards\n\nPart
  3\n\nIEEE Student Branch\, Polytechnique Montréal\n\n- Mission & Vision\
 n- Activities\n- Volunteers\n\nCo-sponsored by: IEEE Montreal\n\nSpeaker(s
 ): Enrico Massoni\, Mihaela Talpos\n\nRoom: M-2101\, Bldg: Pavillon Lasson
 de\, Polytechnique Montréal\, Montreal\, Quebec\, Canada
LOCATION:Room: M-2101\, Bldg: Pavillon Lassonde\, Polytechnique Montréal\,
  Montreal\, Quebec\, Canada
ORGANIZER:reza.prmz@ieee.org
SEQUENCE:14
SUMMARY:Printing the Microwave / IEEE Student Branch of Polytechnique Montr
 éal
URL;VALUE=URI:https://events.vtools.ieee.org/m/171089
X-ALT-DESC:Description: <br /><p>&nbsp\;</p>\n<p><strong>Part 1</strong></p
 >\n<p><strong>Additive Manufacturing Techniques (3D Printing) for Microwav
 e Devices and Systems</strong></p>\n<ul>\n<li>Introducing three methodolog
 ies to 3D-print RF and microwave components:</li>\n</ul>\n<ul>\n<ul>\n<li>
 Fused Deposition Modeling (FDM)</li>\n<li>Binder Jetting technique</li>\n<
 li>Photo-polymerization</li>\n</ul>\n</ul>\n<ul>\n<li>Designing broadband 
 interconnects such as SIW and SISW waveguides.</li>\n<li>Integrating 3D-pr
 inting techniques with microwave technologies (SIW and NRD) to create inno
 vative components and systems suitable for the Internet of Things (IoT) an
 d the 5G applications.</li>\n</ul>\n<p><strong>Part 2</strong></p>\n<p><st
 rong>IEEE Student Branch\, University of Pavia\, Italy</strong></p>\n<ul>\
 n<li>IEEE: Institute of Electrical and Electronics Engineers</li>\n<li>IEE
 E Student Branch: Goals\, Activities\, Organization</li>\n<li>IEEE Student
  Branch\, University of Pavia:</li>\n</ul>\n<p>&nbsp\;&nbsp\;&nbsp\;&nbsp\
 ;&nbsp\;&nbsp\; Members\, Committees\, Activities\, Awards</p>\n<p><strong
 >Part 3</strong></p>\n<p><strong>IEEE Student Branch\, Polytechnique Montr
 </strong><strong>&eacute\;al</strong></p>\n<ul>\n<li>Mission &amp\; Vision
 </li>\n<li>Activities</li>\n<li>Volunteers</li>\n</ul>
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