BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Eastern BEGIN:DAYLIGHT DTSTART:20180311T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20181104T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20180927T191543Z UID:437A9473-A591-478B-89BF-097370D4BE24 DTSTART;TZID=US/Eastern:20180927T114500 DTEND;TZID=US/Eastern:20180927T125000 DESCRIPTION:With more than 15 trillion wire bonds produced annually and vol ume still growing the reliability and productivity of wire bonding makes i t the dominant chip interconnection method. Estimated wire bond interconne ction volume exceeds 90% of market share. But that does not mean that rigo rous attention to details can be ignored. New products must be fully quali fied and periodic testing of the weld intermetallic is an important part o f assuring high quality bonds. Process changes\, materials changes and too l changes must all be tested and reliability confirmed. Long-term aging st udies using accelerated high temperature storage\, thermal cycling and tem perature/humidity tests are not only initial qualification requirements bu t should be a part of any review when materials s and encapsulation change s are required.\n\nWire bonding is a welding process where an intermetalli c weld nugget (an alloy of the wire and the bond pad or substrate surface) is formed by the deformation of the ball or wire (wedge bonding). Ultraso nic energy unlocks easy slip mechanisms within the crystal lattice of the deforming materials allowing deformation at lower force and temperature th an the materials would otherwise require for deformation. Deformation mixe s the wire and substrate to form the initial bond. Subsequently diffusion allows the mixture to resolve into the equilibrium compounds of the phase diagram. The intermetallic compounds each have different physical properti es and behavior. During the life of a wire bond it is normal for transform ations to occur\, where one intermetallic transforms to another because di ffusion has increased (or decreased) the concentration of one of the eleme nts. Transformations can generate large strains in the lattice structure\, even resulting in bond failures at the interface between adjacent interme tallic compounds.\n\nThis talk will discuss the ultrasonic welding mechani sm and its effect on wire bond reliability\n\nRegistration is required if you need parking arrangements. 1 PDH is available for IEEE members\, but y ou must register and sign in at the meeting. Please indicate these when yo u register.\n\nCo-sponsored by: IEEE Lehigh Valley Solid State Circuits So ciety & University of Scranton Student Branch\n\nSpeaker(s): Lee Levine\, \n\nAgenda: \n11:45 Pizza\, Soda\, networking\n\n12:00 - 12:50 Presentatio n\n\nRoom: 233\, Bldg: Loyola Science Building\, University of Scranton\, 313 Monroe Avenue (Parking and Public Safety Pavilion)\, Scranton\, Pennsy lvania\, United States\, 18510 LOCATION:Room: 233\, Bldg: Loyola Science Building\, University of Scranton \, 313 Monroe Avenue (Parking and Public Safety Pavilion)\, Scranton\, Pen nsylvania\, United States\, 18510 ORGANIZER:wandrew.berger@scranton.edu SEQUENCE:7 SUMMARY:Bonding with your Semiconductor: Understanding Ultrasonic Welding URL;VALUE=URI:https://events.vtools.ieee.org/m/175264 X-ALT-DESC:Description: <br /><p><span style="font-size: 12pt\;">With more than 15 trillion wire bonds produced annually and volume still growing the reliability and productivity of wire bonding makes it the dominant chip i nterconnection method. Estimated wire bond interconnection volume exceeds 90% of market share. But that does not mean that rigorous attention to det ails can be ignored. New products must be fully qualified and periodic tes ting of the weld intermetallic is an important part of assuring high quali ty bonds. Process changes\, materials changes and tool changes must all be tested and reliability confirmed. Long-term aging studies using accelerat ed high temperature storage\, thermal cycling and temperature/humidity tes ts are not only initial qualification requirements but should be a part of any review when materials s and encapsulation changes are required.</span ></p>\n<p><span style="font-size: 12pt\;">&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbs p\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;&nbsp\;& nbsp\;&nbsp\; Wire bonding is a welding process where an intermetallic wel d nugget (an alloy of the wire and the bond pad or substrate surface) is f ormed by the deformation of the ball or wire (wedge bonding). Ultrasonic e nergy unlocks easy slip mechanisms within the crystal lattice of the defor ming materials allowing deformation at lower force and temperature than th e materials would otherwise require for deformation. Deformation mixes the wire and substrate to form the initial bond. Subsequently diffusion allow s the mixture to resolve into the equilibrium compounds of the phase diagr am. The intermetallic compounds each have different physical properties an d behavior. During the life of a wire bond it is normal for transformation s to occur\, where one intermetallic transforms to another because diffusi on has increased (or decreased) the concentration of one of the elements. Transformations can generate large strains in the lattice structure\, even resulting in bond failures at the interface between adjacent intermetalli c compounds.</span></p>\n<p><span style="font-size: 12pt\;">This talk will discuss the ultrasonic welding mechanism and its effect on wire bond reli ability</span></p>\n<p><span style="font-size: 12pt\;">Registration is req uired if you need parking arrangements.&nbsp\; 1 PDH is available for IEEE members\, but you must register and sign in at the meeting.&nbsp\; Please indicate these when you register.<br /></span></p><br /><br />Agenda: <br /><p><span style="font-size: 12pt\;">11:45 Pizza\, Soda\, networking</spa n></p>\n<p><span style="font-size: 12pt\;">12:00 - 12:50 Presentation</spa n></p> END:VEVENT END:VCALENDAR