BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Pacific BEGIN:DAYLIGHT DTSTART:20180311T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20181104T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20181024T140950Z UID:EB1DDADF-DF93-4116-BA10-8E779BC272DF DTSTART;TZID=US/Pacific:20181023T184000 DTEND;TZID=US/Pacific:20181023T203000 DESCRIPTION:In days of old\, microwave design was done using laborious hand calculations coupled with intuition and “cut and try” prototyping met hods\; the results were\, and remain\, impressive in their performance and their long-lasting impact on modern communication systems.\n\nThe 1980’ s saw the advent of a number of commercial computer-based products for ana lyzing and simulating the behavior of electromagnetic structures\, with th e goal of easing and speeding the EM design task. Those first tools were a ble to handle structures of very limited complexity\; they were difficult to use\; and they were expensive. Fast-forward to 2018: Today we have a wi de selection of such tools which are able to handle structures of consider ably greater complexity than their earlier cousins\, but so-called “big iron” EM tools can still be a) relatively difficult to use and b) typica lly quite expensive. (Has anyone priced an HFSS or Ansoft simulator seat r ecently?)\n\nOne technique the microwave community has used for many years is that of Mechanical Scale Modeling (“MSM”) in which electrically fu nctional 3D-mechanical-scaled models of EM structures are used to predict the performance of the much smaller structures ultimately built into PCBs and hybrids. Typically used for relatively simple functional blocks\, the technique is essentially an analog simulator that gives one the ability to quickly\, accurately\, and quite inexpensively develop microwave componen ts using larger\, more tractable dimensions and easier-to-measure scaled-d own frequencies.\n\nAn interesting aspect of the MSM approach is that it c an be applied to a broader set of problems than simple microwave component design. In particular\, the author has found it to be a useful\, inexpens ive\, and relatively quick-turn tool for a variety of PCB- and IC-related design tasks\, including package modeling\, inductor design\, and even on- chip IC-level interconnect analysis. Although the author’s original work was done in the 1980’s\, he has found the technique to be useful even u p to the present day – particularly in budget-constrained environments.\ n\nThis talk will focus primarily on the author’s experiences with the M SM technique as applied to IC and package modeling\, including a brief rev iew of the theoretical underpinnings of the method\; its limitations\; act ual hardware models\; and measurement techniques and test results. As time permits\, we may also take a brief look at several “Lessons learned alo ng the way” relating to the design and use of some familiar transmission line structures.\n\n* This talk is an extension of Prof. Rick Campbell’ s IEEE MTT Section\nseminar of last spring (2018)\, in which he described techniques and\nresults using frequency scaling in the design of RF circui try.\n\nSpeaker(s): Fred Weiss\, \n\nAgenda: \n6:40 PM Pizza & Softdrinks\ n7:10 PM Presentation\n\nRoom: 102\, Bldg: Engineering Building\, Portland State University\, 1930 SW Fourth Avenue\, Portland\, Oregon\, United Sta tes\, 97201 LOCATION:Room: 102\, Bldg: Engineering Building\, Portland State University \, 1930 SW Fourth Avenue\, Portland\, Oregon\, United States\, 97201 ORGANIZER:ken.w.mays@gmail.com SEQUENCE:2 SUMMARY:OR MTT-ED Chapter Meeting URL;VALUE=URI:https://events.vtools.ieee.org/m/178948 X-ALT-DESC:Description: <br /><p>In days of old\, microwave design was done using laborious hand calculations coupled with intuition and &ldquo\;cut and try&rdquo\; prototyping methods\; the results were\, and remain\, impr essive in their performance and their long-lasting impact on modern commun ication systems.</p>\n<p>&nbsp\;</p>\n<p>The 1980&rsquo\;s saw the advent of a number of commercial computer-based products for analyzing and simula ting the behavior of electromagnetic structures\, with the goal of easing and speeding the EM design task. Those first tools were able to handle str uctures of very limited complexity\; they were difficult to use\; and they were expensive. Fast-forward to 2018: Today we have a wide selection of s uch tools which are able to handle structures of considerably greater comp lexity than their earlier cousins\, but so-called &ldquo\;big iron&rdquo\; EM tools can still be a) relatively difficult to use and b) typically qui te expensive. (Has anyone priced an HFSS or Ansoft simulator seat recently ?)</p>\n<p>&nbsp\;</p>\n<p>One technique the microwave community has used for many years is that of Mechanical Scale Modeling (&ldquo\;MSM&rdquo\;) in which <em>electrically functional</em> 3D-mechanical-scaled models of E M structures are used to predict the performance of the much smaller struc tures ultimately built into PCBs and hybrids. Typically used for relativel y simple functional blocks\, the technique is essentially an analog simula tor that gives one the ability to quickly\, accurately\, and quite inexpen sively develop microwave components using larger\, more tractable dimensio ns and easier-to-measure scaled-down frequencies.</p>\n<p>&nbsp\;</p>\n<p> An interesting aspect of the MSM approach is that it can be applied to a b roader set of problems than simple microwave component design. In particul ar\, the author has found it to be a useful\, inexpensive\, and relatively quick-turn tool for a variety of PCB- and IC-related design tasks\, inclu ding package modeling\, inductor design\, and even on-chip IC-level interc onnect analysis. Although the author&rsquo\;s original work was done in th e 1980&rsquo\;s\, he has found the technique to be useful even up to the p resent day &ndash\; particularly in budget-constrained environments.</p>\n <p>&nbsp\;</p>\n<p>This talk will focus primarily on the author&rsquo\;s e xperiences with the MSM technique as applied to IC and package modeling\, including a brief review of the theoretical underpinnings of the method\; its limitations\; actual hardware models\; and measurement techniques and test results. As time permits\, we may also take a brief look at several & ldquo\;Lessons learned along the way&rdquo\; relating to the design and us e of some familiar transmission line structures.</p>\n<p>* This talk is an extension of Prof. Rick Campbell&rsquo\;s IEEE MTT Section<br /> seminar of last spring (2018)\, in which he described techniques and<br /> results using frequency scaling in the design of RF circuitry.</p><br /><br />Age nda: <br /><p>6:40 PM Pizza &amp\; Softdrinks<br />7:10 PM Presentation</p > END:VEVENT END:VCALENDAR