BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Toronto
BEGIN:DAYLIGHT
DTSTART:20190310T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:EDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20181104T010000
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:EST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20190125T205900Z
UID:1E3491B9-199F-436F-B336-7EB3C16139ED
DTSTART;TZID=America/Toronto:20190124T170000
DTEND;TZID=America/Toronto:20190124T190000
DESCRIPTION:The emerging era of E-Mobility requires new approaches to maint
 aining thermal control in electrified vehicles. Suppliers must find innova
 tive ways to provide solutions for the demanding requirements of battery a
 nd power electronics cooling. Fast changing system architectures and movin
 g targets for thermal requirements\, keep technology developers on their t
 oes to develop specialized cooling products\, while still achieving the st
 ringent targets for automotive cost\, quality\, and robustness. This prese
 ntation focuses on Dana’s approach to providing customized power electro
 nics cooling products\, leveraging core competencies in heat transfer mode
 ling and design\, precision stamping\, and ultra clean brazing processes.\
 n\nSpeaker(s): Meinrad Machler\, Nick Kalman\n\nBldg: MARC\, McMaster Inno
 vation Park \, 175 Longwood Road S.\, Hamilton\, Ontario\, Canada\, L8P 0A
 1
LOCATION:Bldg: MARC\, McMaster Innovation Park \, 175 Longwood Road S.\, Ha
 milton\, Ontario\, Canada\, L8P 0A1
ORGANIZER:Laith.al-musawi@mohawkcollege.ca
SEQUENCE:1
SUMMARY:Cooling of Power Semiconductors
URL;VALUE=URI:https://events.vtools.ieee.org/m/188857
X-ALT-DESC:Description: <br /><p>The emerging era of E-Mobility requires ne
 w approaches to maintaining thermal control in electrified vehicles. Suppl
 iers must find innovative ways to provide solutions for the demanding requ
 irements of battery and power electronics cooling. Fast changing system ar
 chitectures and moving targets for thermal requirements\, keep technology 
 developers on their toes to develop specialized cooling products\, while s
 till achieving the stringent targets for automotive cost\, quality\, and r
 obustness. This presentation focuses on Dana&rsquo\;s approach to providin
 g customized power electronics cooling products\, leveraging core competen
 cies&nbsp\; in heat transfer modeling and design\, precision stamping\, an
 d ultra clean brazing processes.</p>\n<p>&nbsp\;</p>
END:VEVENT
END:VCALENDAR