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DTSTAMP:20190618T182745Z
UID:4EB6F059-9918-4BF9-83DA-04A3E2B75798
DTSTART;TZID=Europe/Zurich:20190618T173000
DTEND;TZID=Europe/Zurich:20190618T183000
DESCRIPTION:Modern multi-core multi-processor computing systems rely on hig
 h-bandwidth data communication between different units in such distributed
  systems. Chip-to-chip communication over very short distances is now beco
 ming a very demanding topic of research. Due to heat\, yield\, and perform
 ance concerns\, many companies are moving toward multi-chip-module (MCM) S
 oCs.\n\nIn such systems\, the data rate as well as energy consumption are 
 extremely crucial. Due to stringent power budget\, industry is seeking out
  for new design methodologies to implement very dense and energy-efficient
  links. The main focus of this talk is on techniques to implement such hig
 h-performance links over copper. Using novel circuit architectures in conj
 unction with low ISI sensitivity signaling method allows to implement very
  energy-efficient and very high-speed links.\n\nSpeaker(s): Armin Tajalli\
 , \n\nRoom: C 109\, Bldg: ETF\, ETHZ\, Gloriastrasse 35\, Zurich\, Switzer
 land\, Switzerland
LOCATION:Room: C 109\, Bldg: ETF\, ETHZ\, Gloriastrasse 35\, Zurich\, Switz
 erland\, Switzerland
ORGANIZER:mathieu.coustans@gmail.com
SEQUENCE:5
SUMMARY:IEEE SWISS SSCS TALK : Circuits and Signaling Co-Design for Ultra-W
 ideband Communications by Prof. Armin Tajalli
URL;VALUE=URI:https://events.vtools.ieee.org/m/199845
X-ALT-DESC:Description: <br /><p>Modern multi-core multi-processor computin
 g systems rely on high-bandwidth data communication between different unit
 s in such distributed systems. Chip-to-chip communication over very short 
 distances is now becoming a very demanding topic of research. Due to heat\
 , yield\, and performance concerns\, many companies are moving toward mult
 i-chip-module (MCM) SoCs.</p>\n<p>In such systems\, the data rate as well 
 as energy consumption are extremely crucial. Due to stringent power budget
 \, industry is seeking out for new design methodologies to implement very 
 dense and energy-efficient links. The main focus of this talk is on techni
 ques to implement such high-performance links over copper. Using novel cir
 cuit architectures in conjunction with low ISI sensitivity signaling metho
 d allows to implement very energy-efficient and very high-speed links.</p>
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