BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
DTSTART:20190310T030000
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:CDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20191103T010000
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:CST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20190916T210049Z
UID:087EFDF6-C8DC-4F45-89EF-2A380BA6AD3B
DTSTART;TZID=America/Chicago:20190620T113000
DTEND;TZID=America/Chicago:20190620T130000
DESCRIPTION:Talk: Inexpensive System-On-a-Chip devices have radically chang
 ed the application of digital processing to common problems. The Raspberry
  Pi has now become the third most prevalent general purpose computer (afte
 r the PC and Apple devices) in the world. It can also be used to implement
  instruments and serve as a system integration device. Several packaging a
 nd powering options will be shown including\, wall-warts\, SoC Blades\, Po
 wer-Over-Ethernet (PoE)\, Fake PoE and battery powered options. Bring your
  preferred solutions to the discussion.\n\nSpeaker(s): Tom Kaminski\, \n\n
 Agenda: \nShort introductions\n\nLunch (Bring your own)\n\nSpeaker Demos\n
 \nOpen Discussion\n\nRoom: Conference Room\, Bldg: Sector67\, 56 Cory Stre
 et\, Madison\, Wisconsin\, United States\, 53704
LOCATION:Room: Conference Room\, Bldg: Sector67\, 56 Cory Street\, Madison\
 , Wisconsin\, United States\, 53704
ORGANIZER:tjkaminski@ieee.org
SEQUENCE:5
SUMMARY:Madison IEEE June ECN: Packaging SoCs
URL;VALUE=URI:https://events.vtools.ieee.org/m/200051
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;Talk:&lt;/strong&gt; Inexpensive System-
 On-a-Chip devices have radically changed the application of digital proces
 sing to common problems. The Raspberry Pi has now become the third most pr
 evalent general purpose computer (after the PC and Apple devices) in the w
 orld. It can also be used to implement instruments and serve as a system i
 ntegration device. Several packaging and powering options will be shown in
 cluding\, wall-warts\, SoC Blades\, Power-Over-Ethernet (PoE)\, Fake PoE a
 nd battery powered options.&amp;nbsp\; Bring your preferred solutions to the d
 iscussion.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;Short introductions&lt;/p&gt;\n&lt;p&gt;Lun
 ch (Bring your own)&lt;/p&gt;\n&lt;p&gt;Speaker Demos&lt;/p&gt;\n&lt;p&gt;Open Discussion&lt;/p&gt;
END:VEVENT
END:VCALENDAR