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DTSTART:20190310T030000
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DTSTAMP:20191009T184521Z
UID:7BEBF172-821D-4FC7-9E87-6E6022E841B3
DTSTART;TZID=America/Montreal:20191009T133000
DTEND;TZID=America/Montreal:20191009T144500
DESCRIPTION:Co-design and integration of RFIC\, package\, and antennas are 
 critical to enable multiple aspects of 5G communications (backhaul\, last 
 mile\, mobile access) and are particularly challenging at mmWave frequenci
 es. This talk will cover various important aspects of mmWave antenna modul
 e packaging and integration for base station\, backhaul\, and user equipme
 nt applications\, respectively. We will first present a historical perspec
 tive on Si-based mmWave modules and approaches for antenna and IC integrat
 ion including trade-offs. We will focus on the challenges\, implementation
 \, and characterization of a 28-GHz phased-array module with 64 dual polar
 ized antennas for 5G base station applications. We will then introduce a s
 oftware-defined phased array radio based on the 28-GHz hardware. The highl
 y re-configurable phased array radio features beam shaping/steering contro
 l as well as data TX/RX function control from a single Python-based softwa
 re interface. Second\, we will present a W-band phased-array module with 6
 4-element dual-polarization antennas for radar imaging and backhaul applic
 ation. The module consists of a multilayer organic chip-carrier package an
 d a 16-element phased-array TX IC or a 32-element RX IC chipset. Third\, w
 e will describe a compact\, low-power\, 60-GHz switched-beam transceiver m
 odule suitable for handset integration incorporating 4 antennas that suppo
 rts both normal and end-fire directions for a wide link spatial coverage.\
 n\nCo-sponsored by: STARaCom Research Network\n\nSpeaker(s): Xiaoxiong (Ke
 vin) Gu\, \n\nRoom: Level C\, Bldg: New Residence Hall\, McGill University
  \, 3625 Av du Parc \, Montreal\, Quebec\, Canada\, H2X3P8
LOCATION:Room: Level C\, Bldg: New Residence Hall\, McGill University \, 36
 25 Av du Parc \, Montreal\, Quebec\, Canada\, H2X3P8
ORGANIZER:roni.khazaka@mcgill.ca
SEQUENCE:5
SUMMARY:IEEE EMC Distinguished Lecturer: Opportunities\, Challenges and Imp
 lementations of Silicon Integration and Packaging in mmWave Radar and Comm
 unication Applications
URL;VALUE=URI:https://events.vtools.ieee.org/m/205588
X-ALT-DESC:Description: <br /><p>Co-design and integration of RFIC\, packag
 e\, and antennas are critical to enable multiple aspects of 5G communicati
 ons (backhaul\, last mile\, mobile access) and are particularly challengin
 g at mmWave frequencies. This talk will cover various important aspects of
  mmWave antenna module packaging and integration for base station\, backha
 ul\, and user equipment applications\, respectively. We will first present
  a historical perspective on Si-based mmWave modules and approaches for an
 tenna and IC integration including trade-offs. We will focus on the challe
 nges\, implementation\, and characterization of a 28-GHz phased-array modu
 le with 64 dual polarized antennas for 5G base station applications. We wi
 ll then introduce a software-defined phased array radio based on the 28-GH
 z hardware. The highly re-configurable phased array radio features beam sh
 aping/steering control as well as data TX/RX function control from a singl
 e Python-based software interface. Second\, we will present a W-band phase
 d-array module with 64-element dual-polarization antennas for radar imagin
 g and backhaul application. The module consists of a multilayer organic ch
 ip-carrier package and a 16-element phased-array TX IC or a 32-element RX 
 IC chipset. Third\, we will describe a compact\, low-power\, 60-GHz switch
 ed-beam transceiver module suitable for handset integration incorporating 
 4 antennas that supports both normal and end-fire directions for a wide li
 nk spatial coverage.</p>
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