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BEGIN:VEVENT
DTSTAMP:20191128T114503Z
UID:C9AEBA95-D6FC-4C42-9894-B9F0503066D6
DTSTART;TZID=US/Eastern:20191107T090000
DTEND;TZID=US/Eastern:20191107T170000
DESCRIPTION:Thursday\, November 7\, 2019\n\nUniversity Gallery\n\nJames E. 
 Booth Hall (Building 7A)\n\nRochester Institute of Technology\n\nRochester
 \, NY\n\nThe focus of this conference is to bring engineers and researcher
 s together to share information on a wide variety of topics related to mic
 roelectronic devices and systems. The conference will be a joint event tec
 hnically co-sponsored by the Electron Devices Society and the Photonics So
 ciety of the IEEE Rochester Section. The conference will be held at RIT in
  the University Gallery in Booth Hall\; please visit the following link: h
 ttps://maps.rit.edu/\n\nThe conference agenda will begin at 9 AM\, and the
  first invited presentation will follow opening remarks at 9:40 AM. There 
 are six invited talks separated by lunch and an afternoon coffee break. St
 udent presenters will showcase their work at poster sessions during the lu
 nch and reception following the technical presentations.\n\nSee Full Agend
 a Below\n\nInvited Speakers: See details below\n\nWe are exceedingly pleas
 ed to have the following invited speakers for this event.\n\nProf. Shamsul
  Arafin\, The Ohio State University\, “Compound III-V Semiconductor base
 d Classical and Non-Classical Light Emitters at Visible through Mid-Infrar
 ed”\n\nProf. Oussama Moutanabbir\, Ecole Polytechnique de Montreal\, “
 Silicon-Integrated Quantum Electronics and Photonics”\n\nAdam Milton\, D
 irector\, Mohawk Valley Fab\, Cree\, Inc.\, “Cree Wolfspeed SiC Technolo
 gy: Innovation today\, powering the future”\n\nDr. Saurabh Chowdhury\, D
 irector\, Foundry Process Engineering\, Transphorm Inc.\, “650V GaN HEMT
 : Manufacturing and Scaling”\n\nDr. Shelby Nelson\, Mosaic Microsystems\
 , &quot;Thin Glass Substrates for Advanced Packaging Applications&quot;\n\nProf. Kai
  Ni\, Rochester Institute of Technology\, “Ferroelectronics: From Memory
  to Computing”\n\nCall for Posters:\n\nAbstracts are being solicited for
  poster presentations in microelectronics and photonics\, especially those
  which promote research and development activity in Western New York. Abst
 racts must be received by Nov 4th. Submission can be done electronically t
 o the host emails using MS‑Word or pdf formats.\n\nRegister Now!\n\nCo-s
 ponsored by: CH01214 - Rochester Section Chapter\,PHO36\n\nSpeaker(s): .\,
  .\n\nAgenda: \n9 AM Conference Registration &amp; Continental Breakfast\n\n9:
 40 AM Welcome &amp; Opening Remarks\n\n9:50 AM Shamsul Arafin\, Electrical and
  Computer Engineering\, The Ohio State University\n\n“Compound III-V Sem
 iconductor based Classical and Non-Classical Light Emitters at Visible thr
 ough Mid-Infrared”\n\n10:30 AM Coffee Break\n\n10:50 AM Oussama Moutanab
 bir\, Department of Engineering Physics\, École Polytechnique de Montréa
 l\, Montréal\, Canada\n\n“Silicon-Integrated Quantum Electronics and Ph
 otonics”\n\n11:30 AM “Nano-Flash” Poster Previews\n\n12:00 PM Lunch 
 &amp; Poster Presentations\n\n1 PM Adam Milton\, Director\, Mohawk Valley Fab\
 , Cree\, Inc.\, Marcy\, NY\n\n“Cree Wolfspeed SiC Technology: Innovation
  today\, powering the future”\n\n1:40 PM Saurabh Chowdhury\, Director\, 
 Foundry Process Engineering\, Transphorm Inc.\, Goleta\, CA\n\n“650V GaN
  HEMT: Manufacturing and Scaling”\n\n2:20 PM Coffee Break\n\n2:40 PM She
 lby Nelson\, Mosaic Microsystems\, Rochester\, NY\n\n“Thin Glass Substra
 tes for Advanced Packaging Applications”\n\n3:20 PM Kai Ni\, Microsystem
 s Engineering\, Rochester Institute of Technology\n\n“Ferroelectronics: 
 From Memory to Computing”\n\n4:00 PM Closing Remarks\n\n4 – 5 PM Poste
 r Session Reception\n\nBldg: Booth Hall (7A)\, Rochester Institute of Tech
 nology\, University Gallery\, Rochester\, New York\, United States\, 14623
LOCATION:Bldg: Booth Hall (7A)\, Rochester Institute of Technology\, Univer
 sity Gallery\, Rochester\, New York\, United States\, 14623
ORGANIZER:kdhemc@rit.edu
SEQUENCE:40
SUMMARY:43rd IEEE EDS Activities in Western New York Conference
URL;VALUE=URI:https://events.vtools.ieee.org/m/205997
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;&lt;em&gt;Thursday\, November 7\, 2019&lt;/
 em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;em&gt;University Gallery &lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p
 &gt;&lt;strong&gt;&lt;em&gt;James E. Booth Hall (Building 7A)&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;stro
 ng&gt;&lt;em&gt;Rochester Institute of Technology&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;em
 &gt;Rochester\, NY&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;The focus of this co
 nference is to bring engineers and researchers together to share informati
 on on a wide variety of topics related to microelectronic devices and syst
 ems.&amp;nbsp\; The conference will be a joint event technically co-sponsored 
 by the Electron Devices Society and the Photonics Society of the IEEE Roch
 ester Section.&amp;nbsp\; The conference will be held at RIT in the &lt;strong&gt;Un
 iversity Gallery in Booth Hall&lt;/strong&gt;\; please visit the following link:
 &amp;nbsp\; &lt;a href=&quot;https://maps.rit.edu/&quot;&gt;https://maps.rit.edu/&lt;/a&gt;&amp;nbsp\;&lt;/
 p&gt;\n&lt;p&gt;The conference agenda will begin at 9 AM\, and the first invited pr
 esentation will follow opening remarks at 9:40 AM.&amp;nbsp\; There are six in
 vited talks separated by lunch and an afternoon coffee break.&amp;nbsp\; Stude
 nt presenters will showcase their work at poster sessions during the lunch
  and reception following the technical presentations.&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp
 \;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;span style=&quot;font-size: 14pt\;&quot;&gt;See Full Agenda Below&lt;/
 span&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;em&gt;Invited Sp&lt;/em&gt;&lt;/strong
 &gt;&lt;strong&gt;&lt;em&gt;eakers:&lt;/em&gt;&lt;/strong&gt;&amp;nbsp\; See details below&lt;/p&gt;\n&lt;p&gt;We are
  exceedingly pleased to have the following invited speakers for this event
 .&amp;nbsp\;&amp;nbsp\;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Prof. Shamsul Araf
 in\, The Ohio State University\, &amp;ldquo\;Compound III-V Semiconductor base
 d Classical and Non-Classical Light Emitters at Visible through Mid-Infrar
 ed&amp;rdquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Prof. Oussama Moutanabbir\, Ecole Poly
 technique de Montreal\, &amp;ldquo\;Silicon-Integrated Quantum Electronics and
  Photonics&amp;rdquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Adam Milton\, Director\, Mohaw
 k Valley Fab\, Cree\, Inc.\,&lt;/strong&gt;&lt;strong&gt;&amp;nbsp\;&amp;ldquo\;Cree Wolfspeed
  SiC Technology: Innovation today\, powering the future&amp;rdquo\;&lt;/strong&gt;&lt;/
 p&gt;\n&lt;p&gt;&lt;strong&gt;Dr. Saurabh Chowdhury\, Director\, Foundry Process Engineer
 ing\, Transphorm Inc.\, &amp;ldquo\;650V GaN HEMT: Manufacturing and Scaling&amp;r
 dquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Dr. Shelby Nelson\, Mosaic Microsystems\, 
 &quot;&lt;/strong&gt;&lt;strong&gt;Thin Glass Substrates for Advanced Packaging Application
 s&quot;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Prof. Kai Ni\, Rochester Institute of Technolo
 gy\, &amp;ldquo\;Ferroelectronics: From Memory to Computing&amp;rdquo\;&lt;/strong&gt;&lt;/
 p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;em&gt;Call fo
 r Posters:&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;Abstracts are being solicited for poster 
 presentations in microelectronics and photonics\, especially those which p
 romote research and development activity in Western New York.&amp;nbsp\; Abstr
 acts must be received by Nov 4&lt;sup&gt;th&lt;/sup&gt;.&amp;nbsp\; Submission can be done
  electronically to the host emails using MS‑Word or pdf formats.&lt;/p&gt;\n&lt;p
 &gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;em&gt;&lt;span style=&quot;font-size: 18pt\;&quot;&gt;&lt;strong&gt;Register Now!
 &lt;/strong&gt;&lt;/span&gt;&lt;/em&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;9 AM&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp
 \;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&lt;em&gt;Conference R
 egistration &amp;amp\; Continental Breakfast&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;
 \n&lt;p&gt;&lt;strong&gt;9:40 AM &amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbs
 p\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Welcome &amp;amp\; Opening Remarks&lt;/str
 ong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;9:50 AM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Shams
 ul Arafin\, Electrical and Computer Engineering\, The Ohio State Universit
 y&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;
  &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;&amp;ldquo\;Co
 mpound III-V Semiconductor based Classical and Non-Classical Light Emitter
 s at Visible through Mid-Infrared&amp;rdquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p
 &gt;&lt;strong&gt;10:30 AM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &lt;em&gt;Coffee Break&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;
 &lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;10:50 AM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;
 &amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Oussama Moutanabbir\, Department of En
 gineering Physics\, &amp;Eacute\;cole Polytechnique de Montr&amp;eacute\;al\, Mont
 r&amp;eacute\;al\, Canada&amp;nbsp\; &amp;nbsp\; &amp;nbsp\;&amp;nbsp\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;stro
 ng&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp
 \;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &amp;
 ldquo\;Silicon-Integrated Quantum Electronics and Photonics&amp;rdquo\;&lt;/stron
 g&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;11:30 AM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &amp;ldquo\;Nano-Flash&amp;r
 dquo\; Poster Previews&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;12:00 PM&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\
 ;&amp;nbsp\; &lt;em&gt;Lunch &amp;amp\; Poster Presentations&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp
 \;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;1 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\
 ;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Adam Milton\, Director\, Mohawk Valley Fab\, Cree\,
  Inc.\, Marcy\, NY&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\
 ;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &amp;ldquo\;Cree Wolfspeed SiC Technol
 ogy: Innovation today\, powering the future&amp;rdquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp
 \;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;1:40 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\
 ;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Saurabh Chowdhur
 y\, Director\, Foundry Process Engineering\, Transphorm Inc.\, Goleta\, CA
 &lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\
 ;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;
 &amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &amp;ldquo\;650V GaN HEMT: Manufacturing and Scaling&amp;rdq
 uo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;2:20 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;
 &amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbs
 p\;&amp;nbsp\; &lt;em&gt;Coffee Break &lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong
 &gt;2:40 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Shelby Nelson\, Mosaic Microsystem
 s\, Rochester\, NY&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\
 ;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &amp;ldquo\;Thin Glass Substrates for 
 Advanced Packaging Applications&amp;rdquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;
 strong&gt;3:20 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbs
 p\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Kai Ni\, Microsystems Engine
 ering\, Rochester Institute of Technology&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;nbsp\;
 &amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbs
 p\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; &amp;ldquo\;Fer
 roelectronics: From Memory to Computing&amp;rdquo\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/
 p&gt;\n&lt;p&gt;&lt;strong&gt;4:00 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Closing Remarks&lt;/str
 ong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;4 &amp;ndash\; 5 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp
 \; &lt;em&gt;Poster Session Reception&lt;/em&gt;&lt;/strong&gt;&lt;/p&gt;
END:VEVENT
END:VCALENDAR

