BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:US/Eastern
BEGIN:DAYLIGHT
DTSTART:20200308T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:EDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20191103T010000
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:EST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20200124T031312Z
UID:86593E16-FAA5-4B11-828D-346D01A4EAB3
DTSTART;TZID=US/Eastern:20200121T173000
DTEND;TZID=US/Eastern:20200121T193000
DESCRIPTION:Epoxy Technology has investigated the mechanism of thermal cond
 uctivity in electrically conductive adhesives. Utilizing laser flash testi
 ng and SEM cross sections\, we determined how silver flake distribution ef
 fects thermal conductivity. Cure\, interface\, and processing play a signi
 ficant role in thermal management. This reviews a new laser flash sample p
 reparation methodology that provides more accurate measurement of “in-de
 sign” thermal resistance.\n\nSpeaker(s): Brian Bruce\, \n\nAgenda: \n5:3
 0PM Networking\n\n5:45PM Light dinner - pizza\, salad and beverages\n\n6:0
 0PM Opening and Announcements\n\n6:20PM – 7:30PM Technical Presentation 
 and Q&amp;A\n\nMIT Lincoln Laboratory\, 3 Forbes Rd.\, Lexington\, Massachuset
 ts\, United States\, 02421
LOCATION:MIT Lincoln Laboratory\, 3 Forbes Rd.\, Lexington\, Massachusetts\
 , United States\, 02421
ORGANIZER:michael.bannan@ieee.org
SEQUENCE:21
SUMMARY:Advances in Thermal Management with Epoxy Systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/215411
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;Epoxy Technology has investigated the mech
 anism of thermal conductivity in electrically conductive adhesives. Utiliz
 ing laser flash testing and SEM cross sections\, we determined how silver 
 flake distribution effects thermal conductivity. Cure\, interface\, and pr
 ocessing play a significant role in thermal management. This reviews a new
  laser flash sample preparation methodology that provides more accurate me
 asurement of &amp;ldquo\;in-design&amp;rdquo\; thermal resistance.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;
 Agenda: &lt;br /&gt;&lt;p&gt;&lt;strong&gt;5:30PM&lt;/strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;Networking&lt;/p
 &gt;\n&lt;p&gt;&lt;strong&gt;5:45PM&lt;/strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;Light dinner - pizza\, s
 alad and beverages&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;6:00PM&lt;/strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;Ope
 ning and&amp;nbsp\;Announcements&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;6:20PM&amp;nbsp\;&amp;ndash\; 7:30PM&lt;
 /strong&gt;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;Technical Presentation and Q&amp;amp\;A&lt;/p&gt;
END:VEVENT
END:VCALENDAR

