BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Bucharest BEGIN:DAYLIGHT DTSTART:20200329T040000 TZOFFSETFROM:+0200 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:EEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20201025T030000 TZOFFSETFROM:+0300 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:EET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20201231T103446Z UID:B3353D96-93AA-40E0-A0E2-E18A4820A792 DTSTART;TZID=Europe/Bucharest:20201020T074500 DTEND;TZID=Europe/Bucharest:20201020T213000 DESCRIPTION:The TIE contest brings together students from different Univers ities since 1992. Students have a great opportunity by taking part in this contest. A good organization and total transparency during the contest ar e the main coordinates proving professionalism and fair-play among student s keen on electronics packaging.\n\nBeing in close relations with the indu stry\, TIE contestants are widely sought by highly appraised companies for internships and hiring after graduating from their studies. As a result\, many examples of past TIE contestants can be found in high ranking functi ons at important companies around the country and around the world\, often returning to TIE as part of the “Industrial Committee”.\n\nTIE not on ly aims to bring industry and university together\, in a tighter\, more co nstant collaboration but under its slogan\, „Turn your hobby into profes sion!”\, also targets to challenge students to think outside of the box\ , to face them with real-life design challenges and present to them what a re the industry’s expectations from an engineering graduate. Therefore\, besides the student contest\, workshops and presentations held by both fo reign universities\, as well as electronics companies\, go along with the contest every year.\n\nCo-sponsored by: Continental Automotive Timisoara\n \nBldg: On-line event\, Pitesti\, Arges\, Romania LOCATION:Bldg: On-line event\, Pitesti\, Arges\, Romania ORGANIZER:norocel.codreanu@cetti.ro SEQUENCE:7 SUMMARY:TIE 2020 (THE INTERCONNECTION TECHNIQUES IN ELECTRONICS) - THE SPRI NG CONVENTION OF ELECTRONIC PACKAGING COMMUNITY THE 29th EDITION & INTERNA TIONAL PROFESSIONAL STUDENT CONTEST URL;VALUE=URI:https://events.vtools.ieee.org/m/224834 X-ALT-DESC:Description: <br /><p style="background: white\; margin: 0in 0in 7.5pt\;"><span style="color: #616161\; font-family: 'Verdana'\,sans-serif \; font-size: 10.5pt\;">The TIE contest brings together students from diff erent Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and total transparency during t he contest are the main coordinates proving professionalism and fair-play among students keen on electronics packaging.</span></p>\n<p style="backgr ound: white\; margin: 0in 0in 7.5pt\;"><span style="color: #616161\; font- family: 'Verdana'\,sans-serif\; font-size: 10.5pt\;">Being in close relati ons with the industry\, TIE contestants are widely sought by highly apprai sed companies for internships and hiring after graduating from their studi es. As a result\, many examples of past TIE contestants can be found in hi gh ranking functions at important companies around the country and around the world\, often returning to TIE as part of the &ldquo\;Industrial Commi ttee&rdquo\;.</span></p>\n<p style="background: white\; margin: 0in 0in 7. 5pt\; word-spacing: 0px\; box-sizing: border-box\; orphans: 2\; widows: 2\ ; font-variant-ligatures: normal\; font-variant-caps: normal\; -webkit-tex t-stroke-width: 0px\; text-decoration-style: initial\; text-decoration-col or: initial\;"><span style="color: #616161\; font-family: 'Verdana'\,sans- serif\; font-size: 10.5pt\;">TIE not only aims to bring industry and unive rsity together\, in a tighter\, more constant collaboration but under its slogan\, &bdquo\;Turn your hobby into profession!&rdquo\;\, also targets t o challenge students to think outside of the box\, to face them with real- life design challenges and present to them what are the industry&rsquo\;s expectations from an engineering graduate. Therefore\, besides the student contest\, workshops and presentations held by both foreign universities\, as well as electronics companies\, go along with the contest every year.< /span></p> END:VEVENT END:VCALENDAR