BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Europe/Bucharest
BEGIN:DAYLIGHT
DTSTART:20200329T040000
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3
TZNAME:EEST
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20201025T030000
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10
TZNAME:EET
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20201231T092208Z
UID:D1676ED7-97A8-48CE-A264-9868FBAD9B8A
DTSTART;TZID=Europe/Bucharest:20201019T090000
DTEND;TZID=Europe/Bucharest:20201019T193000
DESCRIPTION:TIE+ represents a new contest challenge under the TIE brand\, f
 ocused on virtual prototyping disciplines that support high-complexity PCB
  design. TIE+ will be implemented as an individual challenge\, managed usi
 ng an online platform\, nevertheless contestants will have to present thei
 r subject solutions in a live face-to-face meeting in front of the technic
 al committee.\n\nFor the upcoming sessions\, including this year’s editi
 on the contest’s disciplinary area will be Signal & Power Integrity.\n\n
 The TIE+ concept emerged as a “natural” step forward in the support an
 d promotion of PCB design competence in the Romanian (mainly\, but not res
 tricted to) electronics professional environment.\n\nAs a response to the 
 highly increasing market demand for PCB design professionals to have also 
 expertise in fields like signal integrity\, thermal management and EMC\, t
 he TIE steering and technical committees decided to add a “plus” to th
 e current TIE event by incorporating also the area of virtual prototyping 
 .\n\nThe brief list of the TIE+ objectives would be:\n\n1. The promotion o
 f simulation based PCB design disciplines in universities and company base
 d R&D centers\n\n2. Stimulating the development of future specialist in th
 e field of interconnect simulations in accordance to best-in-class compani
 es demands\n\n3. Create a collaborative-competitive environment where the 
 candidates presents their technical solutions\, but also exchange ideas on
  simulation approaches and get in touch other PCB design professionals\n\n
 Co-sponsored by: Continental Automotive\, Timişoara\n\nBldg: On-line even
 t\, Pitesti\, Arges\, Romania
LOCATION:Bldg: On-line event\, Pitesti\, Arges\, Romania
ORGANIZER:catallin.negrea@gmail.com
SEQUENCE:5
SUMMARY:TIE PLUS 2020 - THE SPRING CONVENTION OF ELECTRONIC PACKAGING COMMU
 NITY & INTERNATIONAL PROFESSIONAL STUDENT CONTEST
URL;VALUE=URI:https://events.vtools.ieee.org/m/224837
X-ALT-DESC:Description: <br /><p><strong>TIE+</strong> represents a new con
 test challenge under the TIE brand\, focused on virtual prototyping discip
 lines that support high-complexity PCB design. TIE+ will be implemented as
  an individual challenge\, managed using an online platform\, nevertheless
  contestants will have to present their subject solutions in a live face-t
 o-face meeting in front of the technical committee.</p>\n<p>For the upcomi
 ng sessions\, including this year&rsquo\;s edition the contest&rsquo\;s di
 sciplinary area will be <strong>Signal &amp\; Power Integrity</strong>.</p
 >\n<p>The TIE+ concept emerged as a &ldquo\;natural&rdquo\; step forward i
 n the support and promotion of PCB design competence in the Romanian (main
 ly\, but not restricted to) electronics professional environment.</p>\n<p>
 As a response to the highly increasing market demand for PCB design profes
 sionals to have also expertise in fields like signal integrity\, thermal m
 anagement and EMC\, the TIE steering and technical committees decided to a
 dd a &ldquo\;plus&rdquo\; to the current TIE event by incorporating&nbsp\;
  also the area of virtual prototyping .</p>\n<p>The brief list of the TIE+
  objectives would be:</p>\n<p>1. The promotion of simulation based PCB des
 ign disciplines in universities and company based R&amp\;D centers</p>\n<p
 >2. Stimulating the development of future specialist in the field of inter
 connect simulations in accordance to best-in-class companies demands</p>\n
 <p>3. Create a collaborative-competitive environment where the candidates 
 presents their technical solutions\, but also exchange ideas on simulation
  approaches and get in touch other PCB design professionals</p>
END:VEVENT
END:VCALENDAR