BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20200308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20201101T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20201216T150922Z UID:1459E977-0F52-4450-B998-40ECD5660EC2 DTSTART;TZID=America/New_York:20200616T120000 DTEND;TZID=America/New_York:20200616T130000 DESCRIPTION:Abstract:\n\nHeterogeneous component integration with seamless and 3D connectivity between digital\, RF\, analog and passive components i n a single package with unlimited bandwidth at lower power is the key to r ealize future electronic and bioelectronic systems. This talk describes th e recent nanomaterial and nanoscale component integration breakthroughs th at are making heterogeneous integration a reality. The need for high power density and efficiency in mobile\, servers\, datacenters and automotive e lectronics is driving advanced packaging technologies for single-stage pow er conversion close to the active devices. Power passive component (induct ors and capacitors) integration is the biggest bottleneck to realize such integrated power modules. Nanomagnetic inductors\, high surface area nanoc apacitors and innovative 3D component designs will be described. The secon d part focuses on material and component integration technologies for high -bandwidth 5G-6G communications. Several packaging advances are critical t o realize such mm wave to THz communications. These include high-gain ante nna arrays in a package with integrated power dividers and combiners\, low -loss THz interconnects with substrate-integrated low-loss waveguides\, in tegrated electromagnetic interference isolation structures between power a mplifier (PA) and low-noise amplifier (LNA) interconnects and integrated n anomagnetic and nanodielectrics for nonreciprocal and tunable components. The last part of the presentation describes nanopackaging technologies to enable bioelectronic systems with seamless integration between neural reco rding arrays\, active devices and wireless interfaces for ultra-miniaturiz ed wearable and implantable bioelectronic systems. Nanoscale packaging for off-chip interconnections\, thermal management\, hermetic coatings and en capsulations will also be highlighted.\n\nBio:\nDr. P. M. Raj ‘s experti se is in packaging of electronic and bioelectronic systems\, with emphasis on nanoscale RF\, power and bioelectronic components\, and active and pas sive integration in ultrathin embedded modules. He is an Associate Profess or in BME and ECE at Florida International University\, and Adjunct Profes sor at Georgia Institute of Technology\, Atlanta. He demonstrated several electronic packaging technologies\, working with the whole electronic ecos ystem\, which include several semiconductor\, packaging and material\, too l\, and end-user companies. He co-lead the development of world’s first 3D glass LTE diversity module\, and 3D glass antenna-integrated package mo dule for 5G mm wave applications. He developed advanced substrate-integrat ed power inductors and power capacitors for integrated power modules and v oltage regulators. His research led to 330 publications\, which include 8 patents. He received more than 25 best-paper awards. He co-advised more th an 30 MS and PhD students who are current leaders and technology pioneers in the electronic packaging industry. He is widely recognized for his cont ributions in integrated passive components and technology roadmapping\, co mponent integration for bioelectronic\, power and RF modules\, and also fo r promoting the role of nanomaterials and nanostructures for electronics p ackaging applications through IEEE NTC and EPS. He received his PhD from R utgers University in 1999 in ceramic engineering\, ME from the Indian Inst itute of Science\, Bangalore and BS from the Indian Institute of Technolog y\, Kanpur (1993).\n\nCo-sponsored by: CH02099- Northern Virginia/Wash Jt Sections and Baltimore Chapters\, ED15\n\nSpeaker(s): Dr. M. P. Raj\, \n\n Virtual Only\, Oakton\, Virginia\, United States\, Virtual: https://events .vtools.ieee.org/m/231042 LOCATION:Virtual Only\, Oakton\, Virginia\, United States\, Virtual: https: //events.vtools.ieee.org/m/231042 ORGANIZER:nfhaddad@aol.com SEQUENCE:8 SUMMARY:Heterogeneous System Component Integration with Nanopackaging URL;VALUE=URI:https://events.vtools.ieee.org/m/231042 X-ALT-DESC:Description: <br /><p>Abstract:</p>\n<p>Heterogeneous component integration with seamless and 3D connectivity between digital\, RF\, analo g and passive components in a single package with unlimited bandwidth at l ower power is the key to realize future electronic and bioelectronic syste ms. This talk describes the recent nanomaterial and nanoscale component in tegration breakthroughs that are making heterogeneous integration a realit y. The need for high power density and efficiency in mobile\, servers\, da tacenters and automotive electronics is driving advanced packaging technol ogies for single-stage power conversion close to the active devices. Power passive component (inductors and capacitors) integration is the biggest b ottleneck to realize such integrated power modules. Nanomagnetic inductors \, high surface area nanocapacitors and innovative 3D component designs wi ll be described. The second part focuses on material and component integra tion technologies for high-bandwidth 5G-6G communications. Several packagi ng advances are critical to realize such mm wave to THz communications. Th ese include high-gain antenna arrays in a package with integrated power di viders and combiners\, low-loss THz interconnects with substrate-integrate d low-loss waveguides\, integrated electromagnetic interference isolation structures between power amplifier (PA) and low-noise amplifier (LNA) inte rconnects and integrated nanomagnetic and nanodielectrics for nonreciproca l and tunable components. The last part of the presentation describes nano packaging technologies to enable bioelectronic systems with seamless integ ration between neural recording arrays\, active devices and wireless inter faces for ultra-miniaturized wearable and implantable bioelectronic system s. Nanoscale packaging for off-chip interconnections\, thermal management\ , hermetic coatings and encapsulations will also be highlighted.</p>\n<p>< br />Bio:<br />Dr. P. M. Raj &lsquo\;s expertise is in packaging of electr onic and bioelectronic systems\, with emphasis on nanoscale RF\, power and bioelectronic components\, and active and passive integration in ultrathi n embedded modules. He is an Associate Professor in BME and ECE at Florida International University\, and Adjunct Professor at Georgia Institute of Technology\, Atlanta. He demonstrated several electronic packaging technol ogies\, working with the whole electronic ecosystem\, which include severa l semiconductor\, packaging and material\, tool\, and end-user companies. He co-lead the development of world&rsquo\;s first 3D glass LTE diversity module\, and 3D glass antenna-integrated package module for 5G mm wave app lications. He developed advanced substrate-integrated power inductors and power capacitors for integrated power modules and voltage regulators. His research led to 330 publications\, which include 8 patents. He received mo re than 25 best-paper awards. He co-advised more than 30 MS and PhD studen ts who are current leaders and technology pioneers in the electronic packa ging industry. He is widely recognized for his contributions in integrated passive components and technology roadmapping\, component integration for bioelectronic\, power and RF modules\, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications t hrough IEEE NTC and EPS. He received his PhD from Rutgers University in 19 99 in ceramic engineering\, ME from the Indian Institute of Science\, Bang alore and BS from the Indian Institute of Technology\, Kanpur (1993).</p> END:VEVENT END:VCALENDAR