BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Turkey BEGIN:DAYLIGHT DTSTART:20380119T061407 TZOFFSETFROM:+0300 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=3TU;BYMONTH=1 TZNAME:+03 END:DAYLIGHT BEGIN:STANDARD DTSTART:20160907T000000 TZOFFSETFROM:+0300 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=1WE;BYMONTH=9 TZNAME:+03 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20200915T191841Z UID:26B3EEB9-9D44-4BB9-A777-3E6B601A396A DTSTART;TZID=Turkey:20200910T100000 DTEND;TZID=Turkey:20200910T230000 DESCRIPTION:Title: Opportunities\, Challenges and Implementations of Silico n Integration and Packaging in mmWave Radar and Communication Applications \n\nSummary: Co-design and integration of RFIC\, package\, and antennas ar e critical to enable multiple aspects of 5G communications (backhaul\, las t mile\, mobile access) and are particularly challenging at mmWave frequen cies. This talk will cover various important aspects of mmWave antenna mod ule packaging and integration for base station\, backhaul\, and user equip ment applications\, respectively. We will first present a historical persp ective on Si-based mmWave modules and approaches for antenna and IC integr ation including trade-offs. We will focus on the challenges\, implementati on\, and characterization of a 28-GHz phased-array module with 64 dual pol arized antennas for 5G base station applications. We will then introduce a software-defined phased array radio based on the 28-GHz hardware. The hig hly re-configurable phased array radio features beam shaping/steering cont rol as well as data TX/RX function control from a single Python-based soft ware interface. Second\, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul appl ication. The module consists of a multilayer organic chip-carrier package and a 16-element phased-array TX IC or a 32-element RX IC chipset. Third\, we will describe a compact\, low-power\, 60-GHz switched-beam transceiver module suitable for handset integration incorporating 4 antennas that sup ports both normal and end-fire directions for a wide link spatial coverage .\n\nBio: Xiaoxiong Gu received the Ph.D. in electrical engineering from t he University of Washington\, Seattle\, USA\, in 2006. He joined IBM Resea rch as a Research Staff Member in January 2007. His research activities ar e focused on 5G radio access technologies\, optoelectronic and mm-wave pac kaging\, electrical designs\, modeling and characterization of communicati on\, imaging radar and computation systems. He has recently worked on ante nna-in package design and integration for mm-wave imaging and communicatio n systems including Ka-band\, V-band and W-band phased-array modules. He h as also worked on 3D electrical packaging and signal/power integrity analy sis for high-speed I/O subsystems including on-chip and off-chip interconn ects. He has been involved in developing novel TSV and interposer technolo gies for heterogeneous system integration.\n\nDr. Gu has authored over 90 peer-reviewed publications\, 2 book chapters and holds 9 issued patents. H e was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world's first reported sil icon-based 5G mmWave phased array antenna module operating at 28GHz). He w as a co-recipient of the 2017 Pat Goldberg Memorial Award to the best pape r in computer science\, electrical engineering\, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2 019 and Outstanding Technical Achievement Award in 2016\, four IBM Plateau Invention Awards in 2012 ~ 2016\, the IEEE EMC Symposium Best Paper Award in 2013\, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 201 2 and 2014\, the Best Conference Paper Award at IEEE EPEPS in 2011\, IEC D esignCon Paper Awards in 2008 and 2010\, the Best Interactive Session Pape r Award at IEEE DATE in 2008\, and the Best Session Paper Award at IEEE EC TC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC ) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different program committees for MTT-S\, EPEPS\, ECTC\, E DAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose\, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 20 19-2020 and is currently an Associate Editor for IEEE Transactions on\nCom ponent\, Packaging and Manufacturing Technology.\n\nSpeaker(s): Dr. Xiaoxi ong Gu\, \n\nGebze Technical University\, Gebze\, Istanbul\, Türkiye LOCATION:Gebze Technical University\, Gebze\, Istanbul\, Türkiye ORGANIZER:ozergul@metu.edu.tr SEQUENCE:0 SUMMARY:IEEE AP/MTT/EMC/ED TURKEY CHAPTER DISTINGUISHED LECTURER SEMINAR BY DR. XIAOXIONG GU URL;VALUE=URI:https://events.vtools.ieee.org/m/239984 X-ALT-DESC:Description: <br /><p>Title: Opportunities\, Challenges and Impl ementations of Silicon Integration and Packaging in mmWave Radar and Commu nication Applications</p>\n<p><br />Summary: Co-design and integration of RFIC\, package\, and antennas are critical to enable multiple aspects of 5 G communications (backhaul\, last mile\, mobile access) and are particular ly challenging at mmWave frequencies. This talk will cover various importa nt aspects of mmWave antenna module packaging and integration for base sta tion\, backhaul\, and user equipment applications\, respectively. We will first present a historical perspective on Si-based mmWave modules and appr oaches for antenna and IC integration including trade-offs. We will focus on the challenges\, implementation\, and characterization of a 28-GHz phas ed-array module with 64 dual polarized antennas for 5G base station applic ations. We will then introduce a software-defined phased array radio based on the 28-GHz hardware. The highly re-configurable phased array radio fea tures beam shaping/steering control as well as data TX/RX function control from a single Python-based software interface. Second\, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilay er organic chip-carrier package and a 16-element phased-array TX IC or a 3 2-element RX IC chipset. Third\, we will describe a compact\, low-power\, 60-GHz switched-beam transceiver module suitable for handset integration i ncorporating 4 antennas that supports both normal and end-fire directions for a wide link spatial coverage.</p>\n<p>Bio: Xiaoxiong Gu received the P h.D. in electrical engineering from the University of Washington\, Seattle \, USA\, in 2006. He joined IBM Research as a Research Staff Member in Jan uary 2007. His research activities are focused on 5G radio access technolo gies\, optoelectronic and mm-wave packaging\, electrical designs\, modelin g and characterization of communication\, imaging radar and computation sy stems. He has recently worked on antenna-in package design and integration for mm-wave imaging and communication systems including Ka-band\, V-band and W-band phased-array modules. He has also worked on 3D electrical packa ging and signal/power integrity analysis for high-speed I/O subsystems inc luding on-chip and off-chip interconnects. He has been involved in develop ing novel TSV and interposer technologies for heterogeneous system integra tion.</p>\n<p>Dr. Gu has authored over 90 peer-reviewed publications\, 2 b ook chapters and holds 9 issued patents. He was a co-recipient of IEEE ISS CC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best P aper Award (the world's first reported silicon-based 5G mmWave phased arra y antenna module operating at 28GHz). He was a co-recipient of the 2017 Pa t Goldberg Memorial Award to the best paper in computer science\, electric al engineering\, and mathematics published by IBM Research. He received IB M Outstanding Research Accomplishment in 2019 and Outstanding Technical Ac hievement Award in 2016\, four IBM Plateau Invention Awards in 2012 ~ 2016 \, the IEEE EMC Symposium Best Paper Award in 2013\, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and 2014\, the Best Conference Paper Award at IEEE EPEPS in 2011\, IEC DesignCon Paper Awards in 2008 an d 2010\, the Best Interactive Session Paper Award at IEEE DATE in 2008\, a nd the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-cha ir of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different progr am committees for MTT-S\, EPEPS\, ECTC\, EDAPS and DesignCon. Dr. Gu was t he General Chair of IEEE EPEPS 2018 in San Jose\, CA. He is also a Disting uished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Asso ciate Editor for IEEE Transactions on<br />Component\, Packaging and Manuf acturing Technology.</p> END:VEVENT END:VCALENDAR