BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Canada/Eastern BEGIN:DAYLIGHT DTSTART:20200308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20201101T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20210120T034105Z UID:63E8A6CF-702F-4859-8A17-75F0F8A2689E DTSTART;TZID=Canada/Eastern:20201015T120000 DTEND;TZID=Canada/Eastern:20201015T134500 DESCRIPTION:Have you experienced delays or re-spins from discovering therma l issues late stage? Or faced challenges in developing accurate simulation models to make an important decision? Or simply struggled with finding th ermal data to use in simulation studies? Please join this upcoming in-dept h online seminar\, for engineers who are seeking to improve their processe s and develop robust thermal management solutions faster. Please register for our complimentary 1.5 hour educational online seminar combining therma l design process insight and exploration of how test and simulation tools are applied\, presented by subject matter experts from Laird Performance M aterials and Siemens Digital Industries Software. The session offers a uni que insight through a worked power electronics example on the process of e valuating device and package thermal properties\; thermal interface materi al decision making\, right through to achieving highest order accuracy for a package thermal model within a 3D electronics cooling system level simu lation. You will learn methods common to any application on predicting tem perature with higher fidelity\, and earlier\, with confidence so you can a chieve thermal design goals. Key topics - Emerging thermal challenges in e lectronics applications - Thermal Interface Material design considerations - How to perform thermal transient testing (using Simcenter T3STER techno logy) - Comparing thermal interface materials’ thermal properties - Pack age thermal characterization and detailed thermal model calibration - 3D e lectronics cooling simulation studies vs design stage (using Simcenter Flo therm)\n\nPlease register here: https://register.gotowebinar.com/register/ 8335576180057344523?source=McMaster+IEEE\n\nVirtual: https://events.vtools .ieee.org/m/240338 LOCATION:Virtual: https://events.vtools.ieee.org/m/240338 ORGANIZER:narimanm@mcmaster.ca SEQUENCE:3 SUMMARY:Thermal Design Decision Making\, Using Test & Simulation URL;VALUE=URI:https://events.vtools.ieee.org/m/240338 X-ALT-DESC:Description: <br /><p><span class="registration-description" dat a-bind="expander:{'expandText': moreButtonText()\, 'userCollapseText': les sButtonText()\, 'text':getWebinarInfo().description}">Have you experienced delays or re-spins from discovering thermal issues late stage? Or faced c hallenges in developing accurate simulation models to make an important de cision? Or simply struggled with finding thermal data to use in simulation studies? Please join this upcoming in-depth online seminar\, for engineer s who are seeking to improve their processes and develop robust thermal ma nagement solutions faster. Please register for our complimentary 1.5 hour educational online seminar combining thermal design process insight and ex ploration of how test and simulation tools are applied\, presented by subj ect matter experts from Laird Performance Materials and Siemens Digital In dustries Software. The session offers a unique insight through a worked po wer electronics example on the process of evaluating device and package th ermal properties\; thermal interface material decision making\, right thro ugh to achieving highest order accuracy for a package thermal model within a 3D electronics cooling system level simulation. You will learn methods common to any application on predicting temperature with higher fidelity\, and earlier\, with confidence so you can achieve thermal design goals. Ke y topics - Emerging thermal challenges in electronics applications - Therm al Interface Material design considerations - How to perform thermal trans ient testing (using Simcenter T3STER technology) - Comparing thermal inter face materials&rsquo\; thermal properties - Package thermal characterizati on and detailed thermal model calibration - 3D electronics cooling simulat ion studies vs design stage (using Simcenter Flotherm)</span></p>\n<p><spa n class="registration-description" data-bind="expander:{'expandText': more ButtonText()\, 'userCollapseText': lessButtonText()\, 'text':getWebinarInf o().description}">Please register here:&nbsp\; https://register.gotowebina r.com/register/8335576180057344523?source=McMaster+IEEE </span></p>\n<p>&n bsp\;</p> END:VEVENT END:VCALENDAR