BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Pacific BEGIN:DAYLIGHT DTSTART:20200308T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20201101T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20210829T214103Z UID:21B8FB4C-512B-4D2F-B290-7C4E76EE59F0 DTSTART;TZID=US/Pacific:20201015T114000 DTEND;TZID=US/Pacific:20201015T130000 DESCRIPTION:The rapid development of solid state lighting applications is d riving the need for innovative approaches in LED packaging. While the majo rity of high-power emitters are still using conventional packaging methods \, there are next-generation LED technologies and applications that requir es integration of existing approaches with IC packaging knowhow. The LED i ndustry is also driving low-cost solutions to the design\, materials and p rocesses in order to be market-competitive due to the emergence of LED sup pliers in Asia\, particularly in China. This talk will discuss the challen ges in the LED integration structure from die to package\, package to boar d and system\, focusing in identifying challenges that need to be overcome in optical design\, materials\, and manufacturing processes. Comparison o f similarities and opportunities in both LED and IC packaging will be disc ussed.\n\nSpeaker(s): TY Hin\, \n\nSanta Clara\, California\, United State s\, Virtual: https://events.vtools.ieee.org/m/241025 LOCATION:Santa Clara\, California\, United States\, Virtual: https://events .vtools.ieee.org/m/241025 ORGANIZER:anmalik@ieee.org SEQUENCE:5 SUMMARY:Design & Materials Challenges For Cost-Effective High-Performance L EDs URL;VALUE=URI:https://events.vtools.ieee.org/m/241025 X-ALT-DESC:Description: <br /><p><span data-slate-fragment="JTdCJTIyb2JqZWN 0JTIyJTNBJTIyZG9jdW1lbnQlMjIlMkMlMjJkYXRhJTIyJTNBJTdCJTdEJTJDJTIybm9kZXMlM jIlM0ElNUIlN0IlMjJvYmplY3QlMjIlM0ElMjJibG9jayUyMiUyQyUyMnR5cGUlMjIlM0ElMjJ wYXJhZ3JhcGglMjIlMkMlMjJkYXRhJTIyJTNBJTdCJTIyY2xhc3NOYW1lJTIyJTNBbnVsbCU3R CUyQyUyMm5vZGVzJTIyJTNBJTVCJTdCJTIyb2JqZWN0JTIyJTNBJTIydGV4dCUyMiUyQyUyMmx lYXZlcyUyMiUzQSU1QiU3QiUyMm9iamVjdCUyMiUzQSUyMmxlYWYlMjIlMkMlMjJ0ZXh0JTIyJ TNBJTIyVGhlJTIwcmFwaWQlMjBkZXZlbG9wbWVudCUyMG9mJTIwc29saWQlMjBzdGF0ZSUyMGx pZ2h0aW5nJTIwYXBwbGljYXRpb25zJTIwaXMlMjBkcml2aW5nJTIwdGhlJTIwbmVlZCUyMGZvc iUyMGlubm92YXRpdmUlMjBhcHByb2FjaGVzJTIwaW4lMjBMRUQlMjBwYWNrYWdpbmcuJTIwV2h pbGUlMjB0aGUlMjBtYWpvcml0eSUyMG9mJTIwaGlnaC1wb3dlciUyMGVtaXR0ZXJzJTIwYXJlJ TIwc3RpbGwlMjB1c2luZyUyMGNvbnZlbnRpb25hbCUyMHBhY2thZ2luZyUyMG1ldGhvZHMlMkM lMjB0aGVyZSUyMGFyZSUyMG5leHQtZ2VuZXJhdGlvbiUyMExFRCUyMHRlY2hub2xvZ2llcyUyM GFuZCUyMGFwcGxpY2F0aW9ucyUyMHRoYXQlMjByZXF1aXJlcyUyMGludGVncmF0aW9uJTIwb2Y lMjBleGlzdGluZyUyMGFwcHJvYWNoZXMlMjB3aXRoJTIwSUMlMjBwYWNrYWdpbmclMjBrbm93a G93LiUyMFRoZSUyMExFRCUyMGluZHVzdHJ5JTIwaXMlMjBhbHNvJTIwZHJpdmluZyUyMGxvdy1 jb3N0JTIwc29sdXRpb25zJTIwdG8lMjB0aGUlMjBkZXNpZ24lMkMlMjBtYXRlcmlhbHMlMjBhb mQlMjBwcm9jZXNzZXMlMjBpbiUyMG9yZGVyJTIwdG8lMjBiZSUyMG1hcmtldC1jb21wZXRpdGl 2ZSUyMGR1ZSUyMHRvJTIwdGhlJTIwZW1lcmdlbmNlJTIwb2YlMjBMRUQlMjBzdXBwbGllcnMlM jBpbiUyMEFzaWElMkMlMjBwYXJ0aWN1bGFybHklMjBpbiUyMENoaW5hLiUyMFRoaXMlMjB0YWx rJTIwd2lsbCUyMGRpc2N1c3MlMjB0aGUlMjBjaGFsbGVuZ2VzJTIwaW4lMjB0aGUlMjBMRUQlM jBpbnRlZ3JhdGlvbiUyMHN0cnVjdHVyZSUyMGZyb20lMjBkaWUlMjB0byUyMHBhY2thZ2UlMkM lMjBwYWNrYWdlJTIwdG8lMjBib2FyZCUyMGFuZCUyMHN5c3RlbSUyQyUyMGZvY3VzaW5nJTIwa W4lMjBpZGVudGlmeWluZyUyMGNoYWxsZW5nZXMlMjB0aGF0JTIwbmVlZCUyMHRvJTIwYmUlMjB vdmVyY29tZSUyMGluJTIwb3B0aWNhbCUyMGRlc2lnbiUyQyUyMG1hdGVyaWFscyUyQyUyMGFuZ CUyMG1hbnVmYWN0dXJpbmclMjBwcm9jZXNzZXMuJTIwQ29tcGFyaXNvbiUyMG9mJTIwc2ltaWx hcml0aWVzJTIwYW5kJTIwb3Bwb3J0dW5pdGllcyUyMGluJTIwYm90aCUyMExFRCUyMGFuZCUyM ElDJTIwcGFja2FnaW5nJTIwd2lsbCUyMGJlJTIwZGlzY3Vzc2VkLiUyMiUyQyUyMm1hcmtzJTI yJTNBJTVCJTVEJTdEJTVEJTdEJTVEJTdEJTVEJTdE">The rapid development of solid state lighting applications is driving the need for innovative approaches in LED packaging. While the majority of high-power emitters are still usin g conventional packaging methods\, there are next-generation LED technolog ies and applications that requires integration of existing approaches with IC packaging knowhow. The LED industry is also driving low-cost solutions to the design\, materials and processes in order to be market-competitive due to the emergence of LED suppliers in Asia\, particularly in China. Th is talk will discuss the challenges in the LED integration structure from die to package\, package to board and system\, focusing in identifying cha llenges that need to be overcome in optical design\, materials\, and manuf acturing processes. Comparison of similarities and opportunities in both L ED and IC packaging will be discussed.</span></p> END:VEVENT END:VCALENDAR