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DTSTART:20210314T030000
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DTSTAMP:20201117T221657Z
UID:30F631C6-B4AB-419C-A860-17BEDCF93084
DTSTART;TZID=America/Los_Angeles:20201117T120000
DTEND;TZID=America/Los_Angeles:20201117T131600
DESCRIPTION:The future's more connected societies are in sore need of high-
 speed point-to-point wireless links with a data rate comparable to wirelin
 e links in both indoor short-range and outdoor long-range scenarios. Enabl
 ing applications include: optical fiber replacement\, high-capacity backha
 uls\, close-proximity wireless data transfer\, etc. High-speed communicati
 on relies on two major factors: bandwidth and modulation format. The vastl
 y under-utilized mm-wave to sub-THz band is very attractive for this appli
 cation. However\, the abundance of bandwidth in mm-wave/sub-THz bands cann
 ot be easily utilized with commercially available low-cost Silicon-based f
 abrication technologies. Meanwhile\, increasing modulation order puts stri
 ngent requirement on the high-speed mixed-signal interface design\, i.e. a
 nalog-to-digital converters\, digital-to-analog-converters and digital sig
 nal processors. In short\, conventional transceiver architectures encounte
 r serious bottleneck that limits achievable data rate and posts significan
 t concerns on system cost and efficiency. The state-of-the-art solutions w
 ill be presented and discussed first\, followed by our proposed way of imp
 lementing highly integrated ultra-high-speed wireless transceivers.\n\nJoi
 n in at https://cpp.zoom.us/j/98062834595\n\nSpeaker(s): Dr. Huan Wang\, \
 n\nAgenda: \nJoin in at https://cpp.zoom.us/j/98062834595\n\nVirtual: http
 s://events.vtools.ieee.org/m/241099
LOCATION:Virtual: https://events.vtools.ieee.org/m/241099
ORGANIZER:zhenyu@cpp.edu
SEQUENCE:1
SUMMARY:Toward 100Gbps Fully Integrated Wireless Communication Transceivers
URL;VALUE=URI:https://events.vtools.ieee.org/m/241099
X-ALT-DESC:Description: <br /><p>The future's more connected societies are 
 in sore need of high-speed point-to-point wireless links with a data rate 
 comparable to wireline links in both indoor short-range and outdoor long-r
 ange scenarios. Enabling applications include: optical fiber replacement\,
  high-capacity backhauls\, close-proximity wireless data transfer\, etc. H
 igh-speed communication relies on two major factors: bandwidth and modulat
 ion format. The vastly under-utilized mm-wave to sub-THz band is very attr
 active for this application. However\, the abundance of bandwidth in mm-wa
 ve/sub-THz bands cannot be easily utilized with commercially available low
 -cost Silicon-based fabrication technologies. Meanwhile\, increasing modul
 ation order puts stringent requirement on the high-speed mixed-signal inte
 rface design\, i.e. analog-to-digital converters\, digital-to-analog-conve
 rters and digital signal processors. In short\, conventional transceiver a
 rchitectures encounter serious bottleneck that limits achievable data rate
  and posts significant concerns on system cost and efficiency. The state-o
 f-the-art solutions will be presented and discussed first\, followed by ou
 r proposed way of implementing highly integrated ultra-high-speed wireless
  transceivers.</p>\n<p>Join in at&nbsp\;<a href="https://cpp.zoom.us/j/980
 62834595" target="_blank" rel="noopener">https://cpp.zoom.us/j/98062834595
 </a></p><br /><br />Agenda: <br /><p>Join in at&nbsp\;<a href="https://cpp
 .zoom.us/j/98062834595" target="_blank" rel="noopener">https://cpp.zoom.us
 /j/98062834595</a></p>
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