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DTSTART:20200308T030000
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DTSTART:20201101T010000
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DTSTAMP:20201014T164403Z
UID:E7C31F55-997A-47ED-81B9-93839448A61F
DTSTART;TZID=Canada/Eastern:20201008T100000
DTEND;TZID=Canada/Eastern:20201008T114500
DESCRIPTION:Recent progress in semiconductor devices on compound semiconduc
 tor or silicon substrates has made it possible to produce more power and r
 eceive a signal with less noise at THz frequencies. Various integrated cir
 cuits for the THz radio front-end functional blocks\, including power and 
 low-noise amplifiers\, modulators and demodulators\, and oscillators\, hav
 e been demonstrated in the last decade. In the first experimental demonstr
 ation conducted in 2004\, bulky instruments originally developed for THz s
 pectroscopy were used to transmit pulsed THz signals carrying a 7-kHz band
 width audio signal across a short free space. However\, recently\, there h
 ave been several successful demonstrations of multi-Gbps data transmission
 s at THz frequencies with state-of-the art devices and components. In this
  talk\, the first prototype of a THz wireless communications system design
 ed under the ‘touch-and-go’ scenario will be presented. I clarify the 
 concept of the KIOSK data downloading system\, cover some considerations i
 n this work\, and present a brief link-budget plan. We will then overview 
 technologies for implementing THz components operating at 300 GHz and thei
 r performance\, followed by preliminary investigation of the channel respo
 nses and the experimental demonstration results. At the end of the present
 ation\, we will discuss several issues that need to be addressed for the f
 uture of the THz communications systems\, in terms of system architectures
 \, packaging and potential applications.\n\nCo-sponsored by: MTT-S\, STARa
 Com\, IEEE section Montréal \n\nSpeaker(s): Ho-Jin Song\, \n\nVirtual: ht
 tps://events.vtools.ieee.org/m/241768
LOCATION:Virtual: https://events.vtools.ieee.org/m/241768
ORGANIZER:djerafi@emt.inrs.ca
SEQUENCE:2
SUMMARY:TERAHERTZ COMMUNICATIONS AT 300 GHZ: DEVICES\, PACKAGES AND SYSTEM
URL;VALUE=URI:https://events.vtools.ieee.org/m/241768
X-ALT-DESC:Description: &lt;br /&gt;&lt;div class=&quot;h4 profile__title profile__title-
 -presentation&quot;&gt;Recent progress in semiconductor devices on compound semico
 nductor or silicon substrates has made it possible to produce more power a
 nd receive a signal with less noise at THz frequencies. Various integrated
  circuits for the THz radio front-end functional blocks\, including power 
 and low-noise amplifiers\, modulators and demodulators\, and oscillators\,
  have been demonstrated in the last decade. In the first experimental demo
 nstration conducted in 2004\, bulky instruments originally developed for T
 Hz spectroscopy were used to transmit pulsed THz signals carrying a 7-kHz 
 bandwidth audio signal across a short free space. However\, recently\, the
 re have been several successful demonstrations of multi-Gbps data transmis
 sions at THz frequencies with state-of-the art devices and components. In 
 this talk\, the first prototype of a THz wireless communications system de
 signed under the &amp;lsquo\;touch-and-go&amp;rsquo\; scenario will be presented. 
 I clarify the concept of the KIOSK data downloading system\, cover some co
 nsiderations in this work\, and present a brief link-budget plan. We will 
 then overview technologies for implementing THz components operating at 30
 0 GHz and their performance\, followed by preliminary investigation of the
  channel responses and the experimental demonstration results. At the end 
 of the presentation\, we will discuss several issues that need to be addre
 ssed for the future of the THz communications systems\, in terms of system
  architectures\, packaging and potential applications.&lt;/div&gt;
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