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VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
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TZID:ROC
BEGIN:STANDARD
DTSTART:19790930T230000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
TZNAME:CST
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BEGIN:VEVENT
DTSTAMP:20210208T023230Z
UID:20764E54-48E3-4347-B3FD-E08AC385B935
DTSTART;TZID=ROC:20201030T133000
DTEND;TZID=ROC:20201030T160000
DESCRIPTION:1.Introduction to Unimicron\n\n2.Advanced Substrates and PCBs\n
 \nlTechnology roadmap\n\n3.Key Technologies and Challenges\n\n4.Thermal Ma
 nagement\n\n5.Summary\n\nCo-sponsored by: Department of Electrical Enginee
 ring\, Department of Communications Engineering\, Advanced institute of ma
 nufacturing with high-tech innovations (aim-hi)\, Center for Telcommunicat
 ion Research\, National Chung Cheng University\n\nSpeaker(s): Dr. WANG\, J
 IN-SHENG\, \n\nAgenda: \n30 Oct 2020 01:30 PM ~ 30 Oct 2020 01:30 PM Acade
 mic Speech &amp; Discussion\n\nVirtual: https://events.vtools.ieee.org/m/24557
 9
LOCATION:Virtual: https://events.vtools.ieee.org/m/245579
ORGANIZER:jwwu@ccu.edu.tw
SEQUENCE:1
SUMMARY:Technical Talk on Advanced Substrate and PCB for High Frequency and
  High Speed Applications
URL;VALUE=URI:https://events.vtools.ieee.org/m/245579
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;1.&lt;strong&gt;Introduction to &lt;/strong&gt;&lt;strong
 &gt;Unimicron&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;2.&lt;strong&gt;Advanced Substrates and PCBs&lt;/strong
 &gt;&lt;/p&gt;\n&lt;p&gt;l&lt;strong&gt;Technology roadmap&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;3.&lt;strong&gt;Key Techn
 ologies and Challenges&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;4.&lt;strong&gt;Thermal Management&lt;/stro
 ng&gt;&lt;/p&gt;\n&lt;p&gt;5.&lt;strong&gt;Summary&lt;/strong&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;30 
 Oct 2020 01:30 PM ~ 30 Oct 2020 01:30 PM Academic Speech &amp;amp\; Discussion
 &lt;/p&gt;
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