BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Zurich BEGIN:DAYLIGHT DTSTART:20190331T030000 TZOFFSETFROM:+0100 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:CEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20191027T020000 TZOFFSETFROM:+0200 TZOFFSETTO:+0100 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:CET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20201113T170604Z UID:1854B95A-9FDF-4BD2-9A78-54AE68220E1B DTSTART;TZID=Europe/Zurich:20191024T143000 DTEND;TZID=Europe/Zurich:20191024T190000 DESCRIPTION:As part of continuing education program\, EPS Switzerland chapt er in collaboration with Swiss Photonics Packaging Lab (SPPL)\, is organiz ing a lecture about ‘Electro-optical 3D Hetero-integration of multifunct ional systems’ by Prof. Dr. Karlheinz Bock. The goal of this program is to provide a platform where people can get an in-depth knowledge about the current trends in electronic packaging field\, and to enable information exchange about their activities and interests.\n\n3D Heterointegration gai ns relevance for high-density integration of electro-optical systems to be applied in highly performant 3D integrated communication systems in the f uture for tactile internet and 5G mobile networks. Co-integration of elect rical and optical devices and wave-guides is a consequence in order to cop e with the demand of increasing the bandwidth efficiency in communication systems and for electrical and optical RF integration on interposer for ne twork nodes of the future. Electronics packaging develops towards a generi c part of the systems concept and we may see much more process concepts wh ere we need to consider “packaging first” in order to meet the perform ance\, reliability\, energy and cost requirements of 3D integrated high-pe rformant electro-optical systems.\nThis lecture focusses on the chances an d challenges of packaging at hand of research examples aiming for: electri cal and optical wave guide integration for interposer\, electrical RF wave guide integration and combination with patch antenna as well as mm wave I Cs embedding.\n\nCo-sponsored by: Swiss Photonics Group\n\nAgenda: \nProgr am\n14:30 – 14:40 Introduction to Electronic Packaging Society\nRony Jos e James\, IEEE EPS chapter chairman\, CSEM SA\n14:40 – 14:50 Introductio n to Swiss Photonics Packaging Lab\nStefan Mohrdiek\, CSEM SA\n14:50 – 1 5:00 Introduction to EMPA\nPierangelo Gröning\, Member of the Board of Di rectors / Department Head\, Empa\n15:00 – 16:30 Electro-optical 3D Heter o-integration of multifunctional systems\nProf. Dr.-Ing. Dr. h.c. Karlhein z Bock\, Chair of electronics packaging and director of the institute for electronics packaging (IAVT) at TU Dresden\n3D Heterointegration gains rel evance for high-density integration of electro-optical systems to be appli ed in highly performant 3D integrated communication systems in the future for tactile internet and 5G mobile networks. Co-integration of electrical and optical devices and wave-guides is a consequence in order to cope with the demand of increasing the bandwidth efficiency in communication system s and for electrical and optical RF integration on interposer for network nodes of the future. Electronics packaging develops towards a generic part of the systems concept and we may see much more process concepts where we need to consider “packaging first” in order to meet the performance\, reliability\, energy and cost requirements of 3D integrated high-performa nt electro-optical systems.\nThis lecture focusses on the chances and chal lenges of packaging at hand of research examples aiming for: electrical an d optical wave guide integration for interposer\, electrical RF wave guide integration and combination with patch antenna as well as mm wave ICs emb edding.\n16:30 – 17:30 Lab tour of EMPA (Advanced Joining Technologies & Printed Electronics)\nLars Jeurgens\, Laboratory Head "Joining Technologi es & Corrosion"\, Empa\n17:30 – 19:00 Apéro\n\nBldg: Eawag Forum Chries bach (next to EMPA)\, EMPA\, Überlandstrasse 133\, Dübendorf\, Switzerla nd\, Switzerland\, 8600 LOCATION:Bldg: Eawag Forum Chriesbach (next to EMPA)\, EMPA\, Überlandstra sse 133\, Dübendorf\, Switzerland\, Switzerland\, 8600 ORGANIZER:rony.josejames@csem.ch SEQUENCE:0 SUMMARY:Electro-optical 3D Hetero-integration of multifunctional systems URL;VALUE=URI:https://events.vtools.ieee.org/m/247996 X-ALT-DESC:Description: <br /><p>As part of continuing education program\, EPS Switzerland chapter in collaboration with Swiss Photonics Packaging La b (SPPL)\, is organizing a lecture about &lsquo\;Electro-optical 3D Hetero -integration of multifunctional systems&rsquo\; by Prof. Dr. Karlheinz Boc k. The goal of this program is to provide a platform where people can get an in-depth knowledge about the current trends in electronic packaging fie ld\, and to enable information exchange about their activities and interes ts.</p>\n<p>3D Heterointegration gains relevance for high-density integrat ion of electro-optical systems to be applied in highly performant 3D integ rated communication systems in the future for tactile internet and 5G mobi le networks. Co-integration of electrical and optical devices and wave-gui des is a consequence in order to cope with the demand of increasing the ba ndwidth efficiency in communication systems and for electrical and optical RF integration on interposer for network nodes of the future. Electronics packaging develops towards a generic part of the systems concept and we m ay see much more process concepts where we need to consider &ldquo\;packag ing first&rdquo\; in order to meet the performance\, reliability\, energy and cost requirements of 3D integrated high-performant electro-optical sys tems.<br />This lecture focusses on the chances and challenges of packagin g at hand of research examples aiming for: electrical and optical wave gui de integration for interposer\, electrical RF wave guide integration and c ombination with patch antenna as well as mm wave ICs embedding.</p><br />< br />Agenda: <br /><p>Program<br />14:30 &ndash\; 14:40 Introduction to El ectronic Packaging Society<br />Rony Jose James\, IEEE EPS chapter chairma n\, CSEM SA<br />14:40 &ndash\; 14:50 Introduction to Swiss Photonics Pack aging Lab<br />Stefan Mohrdiek\, CSEM SA<br />14:50 &ndash\; 15:00 Introdu ction to EMPA<br />Pierangelo Gr&ouml\;ning\, Member of the Board of Direc tors / Department Head\, Empa<br />15:00 &ndash\; 16:30 Electro-optical 3D Hetero-integration of multifunctional systems<br />Prof. Dr.-Ing. Dr. h.c . Karlheinz Bock\, Chair of electronics packaging and director of the inst itute for electronics packaging (IAVT) at TU Dresden<br />3D Heterointegra tion gains relevance for high-density integration of electro-optical syste ms to be applied in highly performant 3D integrated communication systems in the future for tactile internet and 5G mobile networks. Co-integration of electrical and optical devices and wave-guides is a consequence in orde r to cope with the demand of increasing the bandwidth efficiency in commun ication systems and for electrical and optical RF integration on interpose r for network nodes of the future. Electronics packaging develops towards a generic part of the systems concept and we may see much more process con cepts where we need to consider &ldquo\;packaging first&rdquo\; in order t o meet the performance\, reliability\, energy and cost requirements of 3D integrated high-performant electro-optical systems.<br />This lecture focu sses on the chances and challenges of packaging at hand of research exampl es aiming for: electrical and optical wave guide integration for interpose r\, electrical RF wave guide integration and combination with patch antenn a as well as mm wave ICs embedding.<br />16:30 &ndash\; 17:30 Lab tour of EMPA (Advanced Joining Technologies &amp\; Printed Electronics)<br />Lars Jeurgens\, Laboratory Head "Joining Technologies &amp\; Corrosion"\, Empa< br />17:30 &ndash\; 19:00 Ap&eacute\;ro</p> END:VEVENT END:VCALENDAR