BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Montreal BEGIN:DAYLIGHT DTSTART:20210314T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20211107T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20210813T145945Z UID:DA68F69C-0604-45F8-93EA-6BEC5E3C9171 DTSTART;TZID=America/Montreal:20210408T130000 DTEND;TZID=America/Montreal:20210408T143000 DESCRIPTION:There is an increasing demand for low-cost millimeter-wave (mmW ave) systems that operate in the 60\, 77 GHz\, and recently 28 GHz bands f or Gbps data rate communication and imaging applications. Typical applicat ions in the 60 GHz band demanding Gbps data rates include wireless gigabit Ethernet and wireless uncompressed high-definition video. Large available spectrums\, short wavelengths\, and the ability to operate in dusty and f oggy conditions have made mmWave frequencies at 77 and 94 GHz attractive f or radar and imaging applications. Significant momentum has started to bui ld around the 5G wireless communication technologies. The objectives for d eveloping 5G cellular networks include higher capacity\, higher data rate\ , lower end-to-end latency\, massive device connectivity\, reduced cost an d consistent Quality of Experience provisioning. For 5G radio access infra structure such as base stations\, a key enabling technology is mmWave beam -forming at 28 GHz\; this band has emerged as one of the main bands being deployed for this new mode of mobile communications.. Many of the above-me ntioned mmWave systems require phased arrays.\n\nRecent advances in silico n technologies have enabled single chip solutions\, making these technolog ies more commercially attractive. However\, for the mmWave market to flour ish\, not only are low-cost device solutions required\, but also low-cost antenna and packaging solutions. The short wavelength at mmWave frequencie s allows antennas to be embedded within a package or integrated on a chip. Antenna-in-package (AiP) solutions have been recognized to have advantage s over antenna-on-chip solutions in bandwidth\, radiation efficiency\, and low cost due to RFIC die area usage and design flexibility. The realizati on of robust\, radiation-efficient\, and broadband mmWave antennas within a multilayer organic (MLO) substrate is difficult due to assembly\, materi al selection\, and manufacturing tolerance challenges.\n\nWhen designing m mWave AiP for practical applications\, one has to consider trade-offs amon g antenna performance (such as bandwidth\, radiation patterns\, gains\, co upling between antenna elements for array applications\, and port isolatio n for dual-polarized antennas)\, integration with RF transceivers\, packag es size that relates to array size\, package substrate properties (such as electrical properties and thermo-mechanical compatibility)\, flexibility of interconnects (antenna feed line and routine\, power suppliers\, and si gnal controls)\, and package material\, manufacture and assembly cost. The refore\, the process requires codesign of AiP\, RFIC\, application board\, and even heat sink for relatively large phased arrays.\n\nThis talk will discuss the challenges and some solutions related to AiP designs based on 18 years of mmWave research at IBM. More specifically\, the talk will cove r three design examples. First\, a switched beam AiP design at 60 GHz for mobile devices or a dangle for laptop applications. The antenna beam can b e pointed to either the broadside direction or end-fire direction. Second\ , a 64-element dual-polarized AiP design for 94 GHz imaging and communicat ion applications is discussed. The antenna array design enables the tiling of multiple AiP modules to form larger antenna arrays. Finally\, a 64-ele ment dual-polarized AiP design at 28 GHz for 5G applications is presented. \n\nIt is expected that these AiP design technologies for mmWave phased-ar ray applications will not only impact mmWave 5G mobile communication syste ms\, but also open new opportunities and advance development for imaging a nd other adaptive multi-function systems.\n\nCo-sponsored by: Staracom\; P olytechnique Montréal\n\nSpeaker(s): Dr. Duixian Liu\, \n\nMontreal\, Que bec\, Canada\, Virtual: https://events.vtools.ieee.org/m/261585 LOCATION:Montreal\, Quebec\, Canada\, Virtual: https://events.vtools.ieee.o rg/m/261585 ORGANIZER:mohammad.sharawi@polymtl.ca SEQUENCE:9 SUMMARY:Organic Antenna-in-Package Designs for Millimeter Wave Applications URL;VALUE=URI:https://events.vtools.ieee.org/m/261585 X-ALT-DESC:Description: <br /><p>There is an increasing demand for low-cost millimeter-wave (mmWave) systems that operate in the 60\, 77 GHz\, and re cently 28 GHz bands for Gbps data rate communication and imaging applicati ons. Typical applications in the 60 GHz band demanding Gbps data rates inc lude wireless gigabit Ethernet and wireless uncompressed high-definition v ideo. Large available spectrums\, short wavelengths\, and the ability to o perate in dusty and foggy conditions have made mmWave frequencies at 77 an d 94 GHz attractive for radar and imaging applications. Significant moment um has started to build around the 5G wireless communication technologies. The objectives for developing 5G cellular networks include higher capacit y\, higher data rate\, lower end-to-end latency\, massive device connectiv ity\, reduced cost and consistent Quality of Experience provisioning. For 5G radio access infrastructure such as base stations\, a key enabling tech nology is mmWave beam-forming at 28 GHz\; this band has emerged as&nbsp\; one of the main bands being deployed for this new mode of mobile communica tions.. Many of the above-mentioned mmWave systems require phased arrays.< /p>\n<p>Recent advances in silicon technologies have enabled single chip s olutions\, making these technologies more commercially attractive. However \, for the mmWave market to flourish\, not only are low-cost device soluti ons required\, but also low-cost antenna and packaging solutions. The shor t wavelength at mmWave frequencies allows antennas to be embedded within a package or integrated on a chip. Antenna-in-package (AiP) solutions have been recognized to have advantages over antenna-on-chip solutions in bandw idth\, radiation efficiency\, and low cost due to RFIC die area usage and design flexibility. The realization of robust\, radiation-efficient\, and broadband mmWave antennas within a multilayer organic (MLO) substrate is d ifficult due to assembly\, material selection\, and manufacturing toleranc e challenges.</p>\n<p>When designing mmWave AiP for practical applications \, one has to consider trade-offs among antenna performance (such as bandw idth\, radiation patterns\, gains\, coupling between antenna elements for array applications\, and port isolation for dual-polarized antennas)\, int egration with RF transceivers\, packages size that relates to array size\, package substrate properties (such as electrical properties and thermo-me chanical compatibility)\, flexibility of interconnects (antenna feed line and routine\, power suppliers\, and signal controls)\, and package materia l\, manufacture and assembly cost. Therefore\, the process requires codesi gn of AiP\, RFIC\, application board\, and even heat sink for relatively l arge phased arrays.</p>\n<p>This talk will discuss the challenges and some solutions related to AiP designs based on 18 years of mmWave research at IBM. More specifically\, the talk will cover three design examples. First\ , a switched beam AiP design at 60 GHz for mobile devices or a dangle for laptop applications. The antenna beam can be pointed to either the broadsi de direction or end-fire direction. Second\, a 64-element dual-polarized A iP design for 94 GHz imaging and communication applications is discussed. The antenna array design enables the tiling of multiple AiP modules to for m larger antenna arrays. Finally\, a 64-element dual-polarized AiP design at 28 GHz for 5G applications is presented.</p>\n<p>It is expected that th ese AiP design technologies for mmWave phased-array applications will not only impact mmWave 5G mobile communication systems\, but also open new opp ortunities and advance development for imaging and other adaptive multi-fu nction systems.</p> END:VEVENT END:VCALENDAR