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DTSTAMP:20210617T182703Z
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DESCRIPTION:PHIX offers assembly services for all major photonic integrated
  circuit (PIC) technology platforms (such as Indium Phosphide\, Silicon Ph
 otonics\, Silicon Nitride\, and Planar Lightwave Circuit) and is specializ
 ed in hybrid integration of chip-to-chip and fiber-to-chip modules. PHIX p
 rovides a one-stop-shop for PIC assembly\, from design to volume productio
 n\, supporting the global industrial development of PIC-enabled modules fr
 om our facilities in The Netherlands.\nIn this talk\, we will discuss some
  of the advanced photonics packaging work that we have been performing in 
 the EU Horizon 2020 projects TERAWAY and POETICS. In both projects\, a clo
 se integration of many dissimilar components from multiple platforms intro
 duces new challenges in hybrid integration and especially thermal manageme
 nt. These platforms include those of our project partners Fraunhofer HHI (
 PolyBoard [polymer on Si carrier]\, InP) and LioniX (TriPleX [SiN]) along 
 with CMOS chips from commercial suppliers and custom designs in MPW runs.\
 nThe photonic integration in these projects realizes parallel chip-to-chip
  integration to a photonic motherboard as well as fiber-to-chip coupling f
 or system I/O. The optical interconnects are supported by electrical circu
 its operating both in the DC and RF regimes targeting symbol rates of 100 
 Gbaud and beyond. In the case of the TERAWAY project\, all of this needs t
 o be realized in the form factor of an unpiloted drone. Particular attenti
 on will be given to the packaging design rules that enable this integratio
 n as well as the thermal design process and trade-offs associated with var
 ious cooling strategies.\n\nSpeaker(s): Jeroen Duis\, Bradley Snyder\n\nVi
 rtual: https://events.vtools.ieee.org/m/267913
LOCATION:Virtual: https://events.vtools.ieee.org/m/267913
ORGANIZER:p.wesling@ieee.org
SEQUENCE:3
SUMMARY:Scalable Highly-Integrated Photonics Packaging for the 5G World: Fr
 om Datacenters to Drones
URL;VALUE=URI:https://events.vtools.ieee.org/m/267913
X-ALT-DESC:Description: <br /><p>PHIX offers assembly services for all majo
 r photonic integrated circuit (PIC) technology platforms (such as Indium P
 hosphide\, Silicon Photonics\, Silicon Nitride\, and Planar Lightwave Circ
 uit) and is specialized in hybrid integration of chip-to-chip and fiber-to
 -chip modules. PHIX provides a one-stop-shop for PIC assembly\, from desig
 n to volume production\, supporting the global industrial development of P
 IC-enabled modules from our facilities in The Netherlands.<br />In this ta
 lk\, we will discuss some of the advanced photonics packaging work that we
  have been performing in the EU Horizon 2020 projects TERAWAY and POETICS.
  In both projects\, a close integration of many dissimilar components from
  multiple platforms introduces new challenges in hybrid integration and es
 pecially thermal management. These platforms include those of our project 
 partners Fraunhofer HHI (PolyBoard [polymer on Si carrier]\, InP) and Lion
 iX (TriPleX [SiN]) along with CMOS chips from commercial suppliers and cus
 tom designs in MPW runs.<br />The photonic integration in these projects r
 ealizes parallel chip-to-chip integration to a photonic motherboard as wel
 l as fiber-to-chip coupling for system I/O. The optical interconnects are 
 supported by electrical circuits operating both in the DC and RF regimes t
 argeting symbol rates of 100 Gbaud and beyond. In the case of the TERAWAY 
 project\, all of this needs to be realized in the form factor of an unpilo
 ted drone. Particular attention will be given to the packaging design rule
 s that enable this integration as well as the thermal design process and t
 rade-offs associated with various cooling strategies.</p>
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