BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Eastern BEGIN:DAYLIGHT DTSTART:20210314T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20211107T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20210511T221155Z UID:68900691-2FC5-4070-B6B6-50F035718254 DTSTART;TZID=US/Eastern:20210511T160000 DTEND;TZID=US/Eastern:20210511T173000 DESCRIPTION:Abstract: By 2030\, it is expected that 80% of all electric pow er will flow through power electronics systems. (Ultra)Wide bandgap (WBG) power modules that can tolerate higher voltages and currents than silicon- based modules are the most promising solution to reducing the size and wei ght of power electronics systems. These WBG power modules constitute power ful building blocks for power electronics systems\, and WBG-based converte r/power electronics building blocks are envisaged to be widely used in pow er grids in low- and medium-voltage applications and possibly in high-volt age applications for high-voltage direct current (HVDC) and flexible alter nating current transmission systems (FACTS) as well as for use in the next generation of more and all-electric aircraft\, ships\, trains\, and vehic les. Insulation materials and systems that are currently working well for Si-based power devices will be insufficient for the envisioned high voltag e\, high-density WBG power modules and high power density WBG-based conver ters due to accelerated insulation aging and degradation. Reasons for this accelerated insulation aging and degradation are due to a combination of 1) a high electric field\, 2) exposure to high slew rates () (ranging from tens to hundreds of kV/μs) and repetitive (frequencies ranging from hund reds of kHz to MHz) voltage pulses\, and 3) operation at high temperatures up to 500°C. These working conditions create an extremely high electrica l and thermal stress working environment for dielectrics in next-generatio n WBG-based power devices that is not experienced in Si-based power device s. Thus\, there is a vital need to develop new dielectrics and design nove l insulation systems for WBG power devices.\n\nOn the other hand\, acceler ated aging and degradation of insulation systems in other electrification components such as electrical machines\, cables\, transformers\, etc. as a consequence of exposure to the high slew rates and repetitive voltage pul ses that originate from emerging WBG-based power electronics systems are o ne of the most significant barriers for the acceptance and utilization of WBG power modules. Thus\, although WBG devices are revolutionizing power e lectronics\, electrical insulating systems are not prepared for such a rev olution\; without addressing insulation issues\, the electronic power revo lution will fail due to dramatically increased failure rates of electrific ation components.\n\nIn this talk\, challenges concerning insulation degra dation when benefitting from WBG-based conversion systems are reviewed and technical gaps and future research needs are identified. I particularly s how that the investigations carried out to date in dielectrics and electri cal insulation are in their infancy in interaction with next-generation WB G power electronics. Thus\, there is a vital need to develop new dielectri cs and design novel insulation systems. This talk will provide a useful fr amework and point of reference for future research.\n\nSpeaker(s): Prof. M ona Ghassemi\, \n\nAgenda: \nPELS Section Update 4:00-4:05PM\n\nAttendee I ntroductions 4:05-4:15PM\n\nPresentation 4:15-5:15PM\n\nQ&A 5:15-5:30PM\n\ nRaleigh\, North Carolina\, United States\, Virtual: https://events.vtools .ieee.org/m/270492 LOCATION:Raleigh\, North Carolina\, United States\, Virtual: https://events .vtools.ieee.org/m/270492 ORGANIZER:jjshea@ieee.org SEQUENCE:1 SUMMARY:Electrical Insulation Challenges for High Voltage\, High Power Dens ity Wide-Bandgap Power Electronics URL;VALUE=URI:https://events.vtools.ieee.org/m/270492 X-ALT-DESC:Description: <br /><p><strong>Abstract:</strong> By 2030\, it is expected that 80% of all electric power will flow through power electroni cs systems. (Ultra)Wide bandgap (WBG) power modules that can tolerate high er voltages and currents than silicon-based modules are the most promising solution to reducing the size and weight of power electronics systems. Th ese WBG power modules constitute powerful building blocks for power electr onics systems\, and WBG-based converter/power electronics building blocks are envisaged to be widely used in power grids in low- and medium-voltage applications and possibly in high-voltage applications for high-voltage di rect current (HVDC) and flexible alternating current transmission systems (FACTS) as well as for use in the next generation of more and all-electric aircraft\, ships\, trains\, and vehicles. Insulation materials and system s that are currently working well for Si-based power devices will be insuf ficient for the envisioned high voltage\, high-density WBG power modules a nd high power density WBG-based converters due to accelerated insulation a ging and degradation. Reasons for this accelerated insulation aging and de gradation are due to a combination of 1) a high electric field\, 2) exposu re to high slew rates () (ranging from tens to hundreds of kV/&mu\;s) and repetitive (frequencies ranging from hundreds of kHz to MHz) voltage pulse s\, and 3) operation at high temperatures up to 500&deg\;C. These working conditions create an extremely high electrical and thermal stress working environment for dielectrics in next-generation WBG-based power devices tha t is not experienced in Si-based power devices. Thus\, there is a vital ne ed to develop new dielectrics and design novel insulation systems for WBG power devices.</p>\n<p>On the other hand\, accelerated aging and degradati on of insulation systems in other electrification components such as elect rical machines\, cables\, transformers\, etc. as a consequence of exposure to the high slew rates and repetitive voltage pulses that originate from emerging WBG-based power electronics systems are one of the most significa nt barriers for the acceptance and utilization of WBG power modules. Thus\ , although WBG devices are revolutionizing power electronics\, electrical insulating systems are not prepared for such a revolution\; without addres sing insulation issues\, the electronic power revolution will fail due to dramatically increased failure rates of electrification components.</p>\n< p>In this talk\, challenges concerning insulation degradation when benefit ting from WBG-based conversion systems are reviewed and technical gaps and future research needs are identified. I particularly show that the invest igations carried out to date in dielectrics and electrical insulation are in their infancy in interaction with next-generation WBG power electronics . Thus\, there is a vital need to develop new dielectrics and design novel insulation systems. This talk will provide a useful framework and point o f reference for future research.</p><br /><br />Agenda: <br /><p>PELS Sect ion Update&nbsp\; &nbsp\; 4:00-4:05PM</p>\n<p>Attendee Introductions&nbsp\ ;4:05-4:15PM</p>\n<p>Presentation&nbsp\;&nbsp\; &nbsp\; &nbsp\; &nbsp\; &n bsp\; &nbsp\; &nbsp\; &nbsp\;4:15-5:15PM</p>\n<p>Q&amp\;A&nbsp\; &nbsp\; & nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nb sp\; &nbsp\; &nbsp\;5:15-5:30PM</p>\n<p>&nbsp\;</p> END:VEVENT END:VCALENDAR