BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Canada/Eastern BEGIN:DAYLIGHT DTSTART:20210314T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20211107T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20211004T033741Z UID:633A76F4-D199-499C-9C31-E1B30F74632E DTSTART;TZID=Canada/Eastern:20210604T160000 DTEND;TZID=Canada/Eastern:20210604T170000 DESCRIPTION:Abstract: In this talk\, we present our recent research involvi ng the development of low profile antennas that are used to replace wired interconnects in multi-chip modules in electronic packaging. This presenta tion will discuss the evolution of chip-compatible pattern adaptable mm-wa ve antenna modules to be used in massively multicore computers. The result is an enabling technology that overcomes technology bottlenecks that are prevalent when wired lines are used in interconnect busses. While device t echnologies have scaled\, the interconnection layers have not. The limits are in the pitch of the input and output (I/O) for chip-to-chip communicat ions and losses due to physical transmission lines. This is a unique type of pattern adaptable antenna array in that the antenna patterns are in the same plane as the antenna elements. This is quite a departure from many o ther types of reconfigurable antennas where the patterns are broadside (90 degree angle) to the antennas. The approach is new in that it leverages m m-wave technology (60GHz) so that the antenna size is small. 60GHz allows the work to leverage the already-developed transceiver work done for WPAN technologies. 60GHz also has a natural attenuation at large transmission d istances\, which means sufficient isolation and elimination of interferenc e outside of the MCMC system. The research impacts antenna technology\, pa ckaging technology (circuit stacking and advanced packaging)\, and wireles s systems testing on an experimental testbed. The talk will focus on the s tory behind how the technology progresses and how the research unfolded al ong the way.\n\nSpeaker: Dr. Kathleen L. Melde is a Professor of Electrica l and Computer Engineering at the University of Arizona. She is also an As sociate Dean in the College of Engineering. She started her academic caree r in 1996 as an Assistant Professor\, after a 12-year career industry at H ughes Electronics in Southern California. She received her Ph.D. in electr ical engineering from UCLA in 1996. Her research encompasses tunable anten nas and the integration of small antennas in electronics packaging. She is a Fellow of the IEEE and has many positions in the IEEE Antennas and Prop agation Society.\n\nToronto\, Ontario\, Canada\, Virtual: https://events.v tools.ieee.org/m/272106 LOCATION:Toronto\, Ontario\, Canada\, Virtual: https://events.vtools.ieee.o rg/m/272106 ORGANIZER:pz.naseri@gmail.com SEQUENCE:6 SUMMARY:[AP-S Seminar Series] Low Profile Antennas for Chip-to-Chip Data Co mmunications: A Research Story\, Prof. Kathleen Melde URL;VALUE=URI:https://events.vtools.ieee.org/m/272106 X-ALT-DESC:Description: <br /><p><strong>Abstract:</strong>&nbsp\;In this t alk\, we present our recent research involving the development of low prof ile antennas that are used to replace wired interconnects in multi-chip mo dules in electronic packaging. This presentation will discuss the evolutio n of chip-compatible pattern adaptable mm-wave antenna modules to be used in massively multicore computers. The result is an enabling technology tha t overcomes technology bottlenecks that are prevalent when wired lines are used in interconnect busses. While device technologies have scaled\, the interconnection layers have not. The limits are in the pitch of the input and output (I/O) for chip-to-chip communications and losses due to physica l transmission lines. This is a unique type of pattern adaptable antenna a rray in that the antenna patterns are in the same plane as the antenna ele ments. This is quite a departure from many other types of reconfigurable a ntennas where the patterns are broadside (90 degree angle) to the antennas . The approach is new in that it leverages mm-wave technology (60GHz) so t hat the antenna size is small. 60GHz allows the work to leverage the alrea dy-developed transceiver work done for WPAN technologies. 60GHz also has a natural attenuation at large transmission distances\, which means suffici ent isolation and elimination of interference outside of the MCMC system. The research impacts antenna technology\, packaging technology (circuit st acking and advanced packaging)\, and wireless systems testing on an experi mental testbed. The talk will focus on the story behind how the technology progresses and how the research unfolded along the way.</p>\n<p><strong>S peaker: </strong>Dr. Kathleen L. Melde is a Professor of Electrical and Co mputer Engineering at the University of Arizona. She is also an Associate Dean in the College of Engineering. She started her academic career in 199 6 as an Assistant Professor\, after a 12-year career industry at Hughes El ectronics in Southern California. She received her Ph.D. in electrical eng ineering from UCLA in 1996. Her research encompasses tunable antennas and the integration of small antennas in electronics packaging. She is a Fello w of the IEEE and has many positions in the IEEE Antennas and Propagation Society.</p> END:VEVENT END:VCALENDAR