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BEGIN:VEVENT
DTSTAMP:20211001T065721Z
UID:4DC15FB7-1792-4F95-B3FA-646B306BB240
DTSTART;TZID=Europe/Zurich:20210930T160000
DTEND;TZID=Europe/Zurich:20210930T173000
DESCRIPTION:As miniaturization trend for semiconductor chips continues\, po
 wer density is increasing rapidly. So it has become very important\, espec
 ially for high power semiconductors or high power lasers to remove the hea
 t away from the chip efficiently and rapidly\, to ensure a long life time 
 for the chips. This webinar will focus on usage of high thermal conductivi
 ty materials as die attach and substrate materials for efficient heat remo
 val.\n\nAgenda:\n\n16:00 - 16:05 : Welcome and Introduction\n\n16:05 - 16:
 30 : "Advanced Thermal Management Solutions based on Diamond Composites"\,
  Dr. Erich Neubauer\, Managing Director\, RHP technology GmbH\, Austria\n\
 n16:30 - 16:55 : "Improving the Thermal Performance Through Silver Sinteri
 ng in Power Electronics"\, Michiel de Monchy\, Applications manager die at
 tach and preforms Europe\, Macdermid Alpha Assembly Solutions\, The Nether
 lands\n\n16:55 - 17:20 : "FEM modeling and experimental validation for adv
 anced packaging and thermal management"\, Guido Spinola Durante\, Expert\,
  CSEM SA\, Switzerland\n\n17:20 - 17:30 : General discussions and closure\
 n\nPlease Join at 16:00 [CET]\, please mute your microphone.\n\nVirtual: h
 ttps://events.vtools.ieee.org/m/277838
LOCATION:Virtual: https://events.vtools.ieee.org/m/277838
ORGANIZER:rony.josejames@csem.ch
SEQUENCE:4
SUMMARY:SWISS IEEE EPS EVENT (WEBINAR)- High Thermal Conductivity Materials
  towards Efficient Thermal Management of Electronic Devices : Application 
 and Modelling
URL;VALUE=URI:https://events.vtools.ieee.org/m/277838
X-ALT-DESC:Description: <br /><p>As miniaturization trend&nbsp\; for semico
 nductor chips continues\, power density is increasing rapidly. So it has b
 ecome very important\, especially for high power semiconductors or high po
 wer lasers to remove the heat away from the chip efficiently and rapidly\,
  to ensure a long life time for the chips. This webinar will focus on usag
 e of high thermal conductivity materials as die attach and substrate mater
 ials for efficient heat removal.</p>\n<p>Agenda:</p>\n<p>16:00 - 16:05 : W
 elcome and Introduction</p>\n<p>16:05 - 16:30 : "Advanced Thermal Manageme
 nt Solutions based on Diamond Composites"\, Dr. Erich Neubauer\, Managing 
 Director\, RHP technology GmbH\, Austria</p>\n<p>16:30 - 16:55 : "Improvin
 g the Thermal Performance Through Silver Sintering in Power Electronics"\,
 &nbsp\;Michiel de Monchy\, Applications manager die attach and preforms Eu
 rope\, Macdermid Alpha Assembly Solutions\,&nbsp\;The Netherlands</p>\n<p>
 16:55 - 17:20 : "FEM modeling and experimental validation for advanced pac
 kaging and thermal management"\, Guido Spinola Durante\,&nbsp\; Expert\, C
 SEM SA\, Switzerland</p>\n<p>17:20 - 17:30 : General discussions and closu
 re&nbsp\;</p>\n<p>&nbsp\;</p>\n<p>Please Join at 16:00 [CET]\, please mute
  your microphone.</p>
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