BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Australia/Brisbane BEGIN:STANDARD DTSTART:19920301T020000 TZOFFSETFROM:+1100 TZOFFSETTO:+1000 TZNAME:AEST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20210813T070650Z UID:3659AC93-6887-4188-A718-F47C30E6C18E DTSTART;TZID=Australia/Brisbane:20210813T160000 DTEND;TZID=Australia/Brisbane:20210813T170000 DESCRIPTION:At high mmWave frequencies all antenna features are smaller tha n even before. This means that the RF base material for antenna printed ci rcuit boards (PCBs) have to have tighter tolerances at lowest loss. Differ ent PCB solutions require different RF laminates: hybrid multilayers (RF l aminate + FR4)\, all-RF multilayers\, and double-sided PCBs. From electric al and mechanical reliability points of view\, ceramic filled PTFE base ma terials provide a leading edge over thermoset resin system base materials. \n\nThe high consistency of dielectric constant and loss factor of the the rmoplastic material PTFE over the required operating temperature range at resonance frequency of the antennas\, has been recognized by the RF and mi crowave industry for a long time. This technical presentation discusses th e main reasons why such types of base materials are being used. All-RF mul tilayers are the main PCB type for phased array radar PCBs. There\, the th in RF laminate must also show a very high dimensional stability in order t o get combined with a suitable lowest loss prepreg\, which is provided by engineered selection of suitable glass fabrics.\n\nHybrid multilayer PCBs are widely used for 77/79 GHz automotive radar PCBs. Tested electrical and reliability data confirm that very thin ceramic-filled non-reinforced PTF E laminates\, are most suitable in order to meet the requirements of next generation ADAS sensors. Double-sided PCBs for mmWave systems usually cons ist of relatively thin (10 mil / 0.25 mm) thick laminates. There\, the com bination of PTFE resin\, woven glass fabric\, ceramic filler systems and u ltra-low profile copper foil provide lowest loss at highest dimensional st ability. The market introduction of an ultra-low profile ED copper foil pr ovides an even improved insertion loss over rolled annealed copper foil\, in addition to its lower cost. The higher the frequency\, the better the v alue. Only PTFE laminates result in high enough copper peel strength even at repeated rework cycles.\n\nAlmost all PCB manufacturers capable of maki ng mmWave PCBs have processing experience of PTFE laminates\; and several of these also use PTFE laminates together with lowest loss RF prepregs.\n\ nSpeaker(s): Manfred Huschka\, \n\nVirtual: https://events.vtools.ieee.org /m/278272 LOCATION:Virtual: https://events.vtools.ieee.org/m/278272 ORGANIZER:h.espinosa@griffith.edu.au SEQUENCE:14 SUMMARY:Laminates for mmWave PCBs: Different Solutions for All-RF Multilaye r\, Hybrid Multilayer\, and Double-Sided PCBs URL;VALUE=URI:https://events.vtools.ieee.org/m/278272 X-ALT-DESC:Description: <br /><p>At high mmWave frequencies all antenna fea tures are smaller than even before. This means that the RF base material f or antenna printed circuit boards (PCBs) have to have tighter tolerances a t lowest loss. Different PCB solutions require different RF laminates: hyb rid multilayers (RF laminate + FR4)\, all-RF multilayers\, and double-side d PCBs. From electrical and mechanical reliability points of view\, cerami c filled PTFE base materials provide a leading edge over thermoset resin s ystem base materials.</p>\n<p>The high consistency of dielectric constant and loss factor of the thermoplastic material PTFE over the required opera ting temperature range at resonance frequency of the antennas\, has been r ecognized by the RF and microwave industry for a long time. This technical presentation discusses the main reasons why such types of base materials are being used. All-RF multilayers are the main PCB type for phased array radar PCBs. There\, the thin RF laminate must also show a very high dimens ional stability in order to get combined with a suitable lowest loss prepr eg\, which is provided by engineered selection of suitable glass fabrics.< /p>\n<p>Hybrid multilayer PCBs are widely used for 77/79 GHz automotive ra dar PCBs. Tested electrical and reliability data confirm that very thin ce ramic-filled non-reinforced PTFE laminates\, are most suitable in order to meet the requirements of next generation ADAS sensors. Double-sided PCBs for mmWave systems usually consist of relatively thin (10 mil / 0.25 mm) t hick laminates. There\, the combination of PTFE resin\, woven glass fabric \, ceramic filler systems and ultra-low profile copper foil provide lowest loss at highest dimensional stability. The market introduction of an ultr a-low profile ED copper foil provides an even improved insertion loss over rolled annealed copper foil\, in addition to its lower cost. The higher t he frequency\, the better the value. Only PTFE laminates result in high en ough copper peel strength even at repeated rework cycles.</p>\n<p>Almost a ll PCB manufacturers capable of making mmWave PCBs have processing experie nce of PTFE laminates\; and several of these also use PTFE laminates toget her with lowest loss RF prepregs.</p> END:VEVENT END:VCALENDAR