BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20210314T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:PDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20211107T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:PST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20211024T171513Z
UID:1B09C74E-A26F-4E98-8CA1-C35BEFB79BD1
DTSTART;TZID=America/Los_Angeles:20211022T080000
DTEND;TZID=America/Los_Angeles:20211022T093000
DESCRIPTION:Semiconductor process technology will be a key enabler for the 
 industry to meet the later generation 5G and eventually 6G requirements. T
 his overview will describe the demands from these advanced wireless genera
 tions and current challenges facing the semiconductor Industry. Various co
 mponents of the wireless system such as the digital modem\, transceivers a
 nd radio frequency front-end chips each have unique requirements along the
  filters that route the traffic into different channels. The semiconductor
  industry innovations required for each of these components and the system
  integration as a whole will be summarized.\n\nCo-sponsored by: San Diego 
 Relibility Chapter\n\nSpeaker(s): Chidi Chidambaram (Qualcomm Technologies
  Inc.\, San Diego\, CA)\, \n\nVirtual: https://events.vtools.ieee.org/m/28
 5340
LOCATION:Virtual: https://events.vtools.ieee.org/m/285340
ORGANIZER:jfshi@ieee.org
SEQUENCE:2
SUMMARY:Semiconductor Challenges in Realizing the Full Benefit of 5G mmWave
  and Extending the Roadmap into 6G
URL;VALUE=URI:https://events.vtools.ieee.org/m/285340
X-ALT-DESC:Description: <br /><p>Semiconductor process technology will be a
  key enabler for the industry to meet the later generation 5G and eventual
 ly 6G requirements. This overview will describe the demands from these adv
 anced wireless generations and current challenges facing the semiconductor
  Industry. Various components of the wireless system such as the digital m
 odem\, transceivers and radio frequency front-end chips each have unique r
 equirements along the filters that route the traffic into different channe
 ls. The semiconductor industry innovations required for each of these comp
 onents and the system integration as a whole will be summarized.</p>\n<div
 >&nbsp\;</div>
END:VEVENT
END:VCALENDAR