BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Eastern BEGIN:DAYLIGHT DTSTART:20220313T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20211107T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20220201T221619Z UID:67B55898-3C46-449A-92C4-1311367CB43D DTSTART;TZID=US/Eastern:20211118T120000 DTEND;TZID=US/Eastern:20211118T130000 DESCRIPTION:The Washington/Northern VA Jt. Sections Chapter PHO36\, with co -sponsor Electron Devices Society Chapter ED15\, is pleased to host a lect ure presented by Dr. Alexander Brown\, U. S. Army CCDC C51SR Center.\n\nPl ease register to receive the WebEx link.\n\nXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\n\nABSTRACT: High performance thermal i magers are increasingly tasked with providing more information to downstre am user electronics at even faster speeds in an effort to do more with tra ditional scene and target information. Additionally\, infrared sensors are moving towards multi-use capability\, meaning a single sensor is now task ed with simultaneously performing the requirements of a collection of past camera systems. In order to deliver on requirements such as field of view \, resolution\, and frame rate\, focal plan arrays (FPAs) and digital read -out integrated circuits (ROICs) are being asked to generate\, move\, and process massive data outputs across parallel outputs currently running ove r electrical wire. To meet increasing data rate demands\, conversion of di gital pixel data to optical-out data transmission using photonic elements is being explored to provide data management solutions for future sensors with excellent energy efficiency. Photonic integrated circuits are gradual ly becoming more commonplace on foundry process lines\, which opens the do or to design and develop alongside stacked ROIC technologies. Although pho tonics data transmission has matured significantly in the telecom industry \, harnessing this capability in the cryogenic environment of a FPA remain s a challenge. This talk will outline the increasing need to provide more data at less energy per bit\, the potential formats to implement optical m odulation\, and the challenges associated with maturing a cryogenic optica l-link for future thermal sensor technologies.\n\nCo-sponsored by: CH02099 - Northern Virginia/Washington Jt Chapter\, ED15/Tony Guo\n\nAgenda: \n12 :00 PM Introductory remarks/ Introduce Speaker - Dr. John Lee\n\n12:05 PM Presentation - Dr. Alexander Brown\n\n12:45 PM Open for questions\n\n1:00 PM Closure\n\nVirtual: https://events.vtools.ieee.org/m/286618 LOCATION:Virtual: https://events.vtools.ieee.org/m/286618 ORGANIZER:mtobin@ieee.org SEQUENCE:12 SUMMARY: Photonics Chapter Lecture "Cryogenic Optical Data Output for IR Fo cal Plane Arrays" Sponsored by Washington/Northern VA Jt. Sections (co-spo nsored by Electron Devices Chapter.) URL;VALUE=URI:https://events.vtools.ieee.org/m/286618 X-ALT-DESC:Description: <br /><p>The Washington/Northern VA Jt. Sections Ch apter PHO36\, with co-sponsor Electron Devices Society Chapter ED15\, is p leased to host a lecture presented by Dr. Alexander Brown\, U. S. Army CCD C C51SR Center.</p>\n<p>Please register to receive the WebEx link.</p>\n<p >XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX</p>\n<p> ABSTRACT: High performance thermal imagers are increasingly tasked with pr oviding more information to downstream user electronics at even faster spe eds in an effort to do more with traditional scene and target information. Additionally\, infrared sensors are moving towards multi-use capability\, meaning a single sensor is now tasked with simultaneously performing the requirements of a collection of past camera systems. In order to deliver o n requirements such as field of view\, resolution\, and frame rate\, focal plan arrays (FPAs) and digital read-out integrated circuits (ROICs) are b eing asked to generate\, move\, and process massive data outputs across pa rallel outputs currently running over electrical wire. To meet increasing data rate demands\, conversion of digital pixel data to optical-out data t ransmission using photonic elements is being explored to provide data mana gement solutions for future sensors with excellent energy efficiency. Phot onic integrated circuits are gradually becoming more commonplace on foundr y process lines\, which opens the door to design and develop alongside sta cked ROIC technologies. Although photonics data transmission has matured s ignificantly in the telecom industry\, harnessing this capability in the c ryogenic environment of a FPA remains a challenge. This talk will outline the increasing need to provide more data at less energy per bit\, the pote ntial formats to implement optical modulation\, and the challenges associa ted with maturing a cryogenic optical-link for future thermal sensor techn ologies.</p><br /><br />Agenda: <br /><p>12:00 PM Introductory remarks/ In troduce Speaker - Dr. John Lee</p>\n<p>12:05 PM Presentation - Dr. Alexand er Brown</p>\n<p>12:45 PM Open for questions</p>\n<p>1:00 PM Closure</p> END:VEVENT END:VCALENDAR