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DTSTART:20220313T030000
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DTSTAMP:20211205T200623Z
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DTSTART;TZID=US/Pacific:20211130T160000
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DESCRIPTION:Join us for our Tech Talk on IEEE 3003.2 Ground and Bonding. Fi
 nd out more about:\n\nAC Substation Grounding Grid Design Basics\nLow Resi
 stance Vs. High Resistance Vs. Solidly Grounded DC Equipment Enclosures\nG
 rounding Methods for Passenger Station Platform Screen Doors\n\nCo-sponsor
 ed by: IEEE Power and Energy Society\n\nSpeaker(s): Raymond Strittmatter\,
  \n\nAgenda: \n4:00 pm PST IEEE Annnouncements\n4:02 pm PST Introduction o
 f speaker Raymond Strittmatter\n4:04 pm PST Presentation\n4:40 pm Q&A\n\nV
 irtual: https://events.vtools.ieee.org/m/289812
LOCATION:Virtual: https://events.vtools.ieee.org/m/289812
ORGANIZER:mike.brisbois@ieee.org
SEQUENCE:18
SUMMARY:IEEE Std 3003.2 Grounding and Bonding - Tech Talk 
URL;VALUE=URI:https://events.vtools.ieee.org/m/289812
X-ALT-DESC:Description: <br /><p>Join us for our Tech Talk on IEEE 3003.2 G
 round and Bonding. Find out more about:</p>\n<p>AC Substation Grounding Gr
 id Design Basics&nbsp\;<br />Low Resistance Vs. High Resistance Vs. Solidl
 y Grounded DC Equipment Enclosures<br />Grounding Methods for Passenger St
 ation Platform Screen Doors<br />&nbsp\;</p><br /><br />Agenda: <br /><p>4
 :00 pm PST IEEE Annnouncements<br />4:02 pm PST Introduction of speaker Ra
 ymond Strittmatter<br />4:04 pm PST Presentation<br />4:40 pm Q&amp\;A</p>
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