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VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
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TZID:US/Eastern
BEGIN:DAYLIGHT
DTSTART:20220313T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
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DTSTART:20211107T010000
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BEGIN:VEVENT
DTSTAMP:20211201T010047Z
UID:EA12A9D9-16EE-4F01-ACA9-FC12C672C60A
DTSTART;TZID=US/Eastern:20211130T190000
DTEND;TZID=US/Eastern:20211130T200000
DESCRIPTION:The event is free but pre-registration is requested. You can fi
 nd more information and the Registration Form at the following link: https
 ://events.vtools.ieee.org/m/289812 (copy the link and posted it into your 
 browser)\n\n*** Access Codes will be sent out the day before the event\, o
 nce register let me know that you will be attending ***\n\nThe grounding a
 nd bonding of equipment in industrial and commercial power systems is cove
 red in this recommended practice. The interconnection and grounding of the
  non‐electrical metallic elements of a system are covered first. This is
  followed by a discussion of the objectives of equipment grounding and bon
 ding\, including minimizing electric shock hazard to personnel\, providing
  adequate current carrying capability for ground faults\, and ensuring the
  timely\noperation of overcurrent protection. Our Tech Talk we will be dis
 cussing:\n• AC Substation Grounding Grid Design Basics\n• Low Resistan
 ce Vs. High Resistance Vs. Solidly Grounded DC Equipment Enclosures\n• G
 rounding Methods for Passenger Station Platform Screen Doors\n\nSpeaker(s)
 : Raymond Strittmatter\, \n\nPittsfield\, Massachusetts\, United States\, 
 01201
LOCATION:Pittsfield\, Massachusetts\, United States\, 01201
ORGANIZER:rkolod@ieee.org
SEQUENCE:5
SUMMARY:IEEE Std 3003.2‐2014 IEEE Recommended Practice for Equipment Grou
 nding and Bonding in Industrial and Commercial Power Systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/291736
X-ALT-DESC:Description: <br /><p>The event is free but pre-registration is 
 requested. You can find more information and the Registration Form at the 
 following link: <strong>https://events.vtools.ieee.org/m/289812</strong> &
 nbsp\;(copy the link and posted it into your browser)</p>\n<p>*** Access C
 odes will be sent out the day before the event\, once register let me know
  that you will be attending ***</p>\n<p>The grounding and bonding of equip
 ment in industrial and commercial power systems is covered in this recomme
 nded practice. The interconnection and grounding of the non‐electrical m
 etallic elements of a system are covered first. This is followed by a disc
 ussion of the objectives of equipment grounding and bonding\, including mi
 nimizing electric shock hazard to personnel\, providing adequate current c
 arrying capability for ground faults\, and ensuring the timely<br />operat
 ion of overcurrent protection. Our Tech Talk we will be discussing:<br />&
 bull\; AC Substation Grounding Grid Design Basics<br />&bull\; Low Resista
 nce Vs. High Resistance Vs. Solidly Grounded DC Equipment Enclosures<br />
 &bull\; Grounding Methods for Passenger Station Platform Screen Doors</p>
END:VEVENT
END:VCALENDAR