BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Zurich BEGIN:DAYLIGHT DTSTART:20220327T030000 TZOFFSETFROM:+0100 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:CEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20211031T020000 TZOFFSETFROM:+0200 TZOFFSETTO:+0100 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:CET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20220317T153046Z UID:CE635EA1-824A-4388-B2C6-4512C8F420CA DTSTART;TZID=Europe/Zurich:20220224T101500 DTEND;TZID=Europe/Zurich:20220224T183000 DESCRIPTION:During this workshop\, which will be conducted as a joint event between [IEEE EPS chapter Switzerland](https://ieee.ch/chapters/electroni cs-packaging-society/)\, Swiss photonics and [CSEM](https://www.csem.ch/Ho me?lg=)\, we will will take a deeper look at precision assembly solutions from the industry and from development partners. Whether it be an active o r a passive assembly of photonics components\, it requires in many cases p recision alignment of e.g. lasers\, waveguides\, detectors and lenses.\n\n Worldwide initiatives are underway to standardize assembly and integrate f unctionalities into photonic circuits. However\, given the large diversity of materials used in photonics applications\, in still many cases packagi ng solutions often necessitate custom hybrid packages. We are looking forw ard to bring topics to the discussion\, like about common assembly strateg ies and e.g. trade-offs between active vs. passive alignment\, hermetic vs . non-hermetic\, etc. Participants will have the opportunity to submit req uests and specific questions before the workshop.\n\nAgenda: \n10:15 Regis trations\, Welcome Coffee\n10:30 Lab/Showroomtour CSEM in Groups (max. 60 participants)\n11:30 Lunch until 12:45\n13:00 Opening & welcome\nDr.-Ing. Stefan Mohrdiek\nRony Jose James\nDr. Christian Bosshard\n13:15 Photonics Packaging\nPhotonics Packaging Concepts Dr. Christoph Harder\nLandscape fo r photonics packaging services Dr.-Ing. Stefan Mohrdiek\n13:45 Requirement s and examples from industry\nPhotonic Integrated Circuits requirements on integration and assembly Dr. Thomas Hessler\nLaser Diode Assembly - from Single Emitter VCSEL to High Power Laser Bars Stefan Weiß\nAutomating in Photonics Dr. Guido Bonati\n14:45 Networking Break\n15:15 Solutions and ap proaches\nLaser induced soldering Dr. Andreas Walser\nMicrotechnology asse mbly approaches Prof. Dr. Tobias Lamprecht\nSub-micron assembly of photoni c components Dr. Ivan-Lazar Bundalo\n16:15 Discussion of topics\, all pres enters & moderator\n16:45 Apéro\n\nmicroPark Pilatus (C/O CSEM SA)\, Indu striestrasse 23\, Alpnach Dorf\, Switzerland\, Switzerland\, 6055 LOCATION:microPark Pilatus (C/O CSEM SA)\, Industriestrasse 23\, Alpnach Do rf\, Switzerland\, Switzerland\, 6055 ORGANIZER:rony.josejames@csem.ch SEQUENCE:8 SUMMARY:IEEE EPS Switzerland- Workshop: Precision Assembly in Photonics Pac kaging URL;VALUE=URI:https://events.vtools.ieee.org/m/295437 X-ALT-DESC:Description: <br /><p>During this workshop\, which will be condu cted as a joint event between <a href="https://ieee.ch/chapters/electronic s-packaging-society/" target="_blank" rel="noopener">IEEE EPS chapter Swit zerland</a>\, Swiss photonics and <a href="https://www.csem.ch/Home?lg=" t arget="_blank" rel="noopener">CSEM</a>\, we will will take a deeper look a t precision assembly solutions from the industry and from development part ners. Whether it be an active or a passive assembly of photonics component s\, it requires in many cases precision alignment of e.g. lasers\, wavegui des\, detectors and lenses.</p>\n<p>Worldwide initiatives are underway to standardize assembly and integrate functionalities into photonic circuits. However\, given the large diversity of materials used in photonics applic ations\, in still many cases packaging solutions often necessitate custom hybrid packages. We are looking forward to bring topics to the discussion\ , like about common assembly strategies and e.g. trade-offs between active vs. passive alignment\, hermetic vs. non-hermetic\, etc. Participants wil l have the opportunity to submit requests and specific questions before th e workshop.</p><br /><br />Agenda: <br /><table border="1" cellspacing="1" cellpadding="1">\n<tbody>\n<tr>\n<td><strong>10:15</strong></td>\n<td><st rong>Registrations\, Welcome Coffee</strong></td>\n</tr>\n<tr>\n<td><stron g>10:30</strong></td>\n<td><strong>Lab/Showroomtour CSEM in Groups (max. 6 0 participants)</strong></td>\n</tr>\n<tr>\n<td><strong>11:30</strong></td >\n<td><strong>Lunch</strong>&nbsp\;until 12:45</td>\n</tr>\n<tr>\n<td><st rong>13:00</strong></td>\n<td><strong>Opening &amp\; welcome</strong></td> \n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td>Dr.-Ing. Stefan Mohrdiek</td>\n</tr>\ n<tr>\n<td>&nbsp\;</td>\n<td>Rony Jose James</td>\n</tr>\n<tr>\n<td>&nbsp\ ;</td>\n<td>Dr. Christian Bosshard</td>\n</tr>\n<tr>\n<td><strong>13:15</s trong></td>\n<td><strong>Photonics Packaging</strong></td>\n</tr>\n<tr>\n< td>&nbsp\;</td>\n<td><em>Photonics Packaging Concepts</em>&nbsp\;Dr. Chris toph Harder</td>\n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td><em>Landscape for pho tonics packaging services</em>&nbsp\;Dr.-Ing. Stefan Mohrdiek</td>\n</tr>\ n<tr>\n<td><strong>13:45</strong></td>\n<td><strong>Requirements and examp les from industry</strong></td>\n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td><em>Ph otonic Integrated Circuits requirements on integration and assembly</em>&n bsp\;Dr. Thomas Hessler</td>\n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td><em>Laser Diode Assembly - from Single Emitter VCSEL to High Power Laser Bars</em>& nbsp\;Stefan Wei&szlig\;</td>\n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td><em>Auto mating in Photonics</em>&nbsp\;Dr. Guido Bonati</td>\n</tr>\n<tr>\n<td><st rong>14:45</strong></td>\n<td><strong>Networking Break</strong></td>\n</tr >\n<tr>\n<td><strong>15:15</strong></td>\n<td><strong>Solutions and approa ches</strong></td>\n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td><em>Laser induced s oldering</em>&nbsp\;Dr. Andreas Walser</td>\n</tr>\n<tr>\n<td>&nbsp\;</td> \n<td><em>Microtechnology assembly approaches</em>&nbsp\;Prof. Dr. Tobias Lamprecht</td>\n</tr>\n<tr>\n<td>&nbsp\;</td>\n<td><em>Sub-micron assembly of photonic components</em>&nbsp\;Dr. Ivan-Lazar Bundalo</td>\n</tr>\n<tr >\n<td><strong>16:15</strong></td>\n<td><strong>Discussion of topics\, all presenters &amp\; moderator</strong></td>\n</tr>\n<tr>\n<td><strong>16:45 </strong></td>\n<td><strong>Ap&eacute\;ro</strong></td>\n</tr>\n</tbody>\n </table> END:VEVENT END:VCALENDAR