BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Israel BEGIN:DAYLIGHT DTSTART:20220325T030000 TZOFFSETFROM:+0200 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=-1FR;BYMONTH=3 TZNAME:IDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20211031T010000 TZOFFSETFROM:+0300 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:IST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20221230T130918Z UID:7143E425-014C-4060-BA6B-56F17C89F320 DTSTART;TZID=Israel:20211103T090000 DTEND;TZID=Israel:20211103T163000 DESCRIPTION:Comcas is an international conference happening every 2 years. In 2021 we had 3 seesions of EPS in COMCAS where 21 lectuerers came and ga ve their knowlwdge in the fileld of electronic packaging. most of the pres entors were from the industry and some of them from the academy.\n\nThe ro om of the EPS sessions were full of people and it was a great conference a lthough the COVID.\n\nAgenda: \n9:00 - 9:15 1 Rafael Ayelet Belous Israel ayeletb1@rafael.co.il Sealing Challenges of the Hi-End MEMS Sensors\n\n9:1 5 - 9:30 2 Elbit - Elop Yuval Ulman Israel Yuval.Ullman@elbitsystems.com D esign and optimization of Phase Change Material cooling solutions by utili zing 3D printing technologies\n\n9:30 - 9:45 3 NVIDIA Marisa Sheffer Israe l msheffer@nvidia.com XL Flip Chip Ball Grid Array (FCBGA) package develop ment\, challenges and solutions\n\n9:45 - 10:00 4 Phononics Shye Shapira I srael shyesh@towersemi.com Performance Enhancement of Integrated Circuits and Power Devices via Embedded Diamond Heat Management\n\n10:00 - 10:15 5 PCB Yaniv Maydar Israel yaniv@pcb-technologies.com SiP (System in Package) - More than Moore\n\n10:15 - 10:30 6 ANSYS Omri Yannay Israel omri.yannay @ansys.com Process Simulation in Micro-Electrical Mechanical Systems. Stru ctural and Thermal State During Photo-Lithography Layup of a Pirani Sensor \n\n10:30 - 10:50 7 BGU Gennady Ziskind Israel gziskind@bgu.ac.il In memor iam - Prof. Avi Bar-Cohen\n\n11:10 - 11:25 8 Elbit - Elop Galit Zilberman Israel galit.zilberman@elbitsystems.com From Nano to Bio - Eco Friendly co atings\n\n11:25 - 11:40 9 Copprint Ofer Shohat Israel ofer@copprint.com Co nductive Copper ink printing for the additive manufacturing of low cost an d sustainable electric circuits and antennas\n\n11:40 - 11:55 10 Nano Dime nsion Ziv Cohen Israel ziv@nano-di.com Additively Manufactured Electronics (AME) for multilayers applications\n\n11:55 - 12:10 11 Rafael Ronen Maimo n Israel ronenma@rafael.co.il The impact of adhesives mechanical propertie s on the behavior of a closed loop MEMS accelerometer\n\n12:10 - 12:25 12 Rafael Jonathan Rothschild Israel yonathanr@rafael.co.il An empirical meth od for determining the reliability of die-attach joints in hybrid modules\ n\n12:25 - 12:40 13 Bar-Ilan University Doron Naveh Israel Doron.Naveh@biu .ac.il Graphene in thermal management\n\n12:40 - 13:00 14 Technion Eilam Y alon Israel eilamy@gmail.com Sub-micron spatially resolved thermometry\n\n 14:20 - 14:35 15 BGU Oren Regev Israel oregev@bgu.ac.il Enhanced thermal m anagement of composite materials\n\n14:35 - 14:50 16 Mizur Technology Shay Kaplan Israel shay@mizur.com Digital Loudspeaker packaging challenges\n\n 14:50 - 15:05 17 PV Nano Cell Hanan Marcovitch Israel hanan@pvnanocell.com Digital Printed Electronics: Mass-Production Technologies & Application\n \n15:05 - 15:20 18 ANSYS\, MARVELL\, INTEL Shai Sayfan-Altman Israel shai. sayfan-altman@ansys.com The Hidden Challenges in Manufacturing variations\ n\n15:20 - 15:35 19 ACT Adam F. Say USA Adam.Say@1-ACT.com A Comparison of Advanced Passive and Active Cooling Solutions on the Basis of Size\, Weig ht and Power (SWaP)\n\n15:35 - 15:50 20 Rafael Elad Dor Israel ELADDOR@raf ael.co.il Thermal design and analysis for RPV's avionic box - challenges a nd solutions\n\n15:50 - 16:10 21 Elta Michael Kedem Israel mkedem@elta.co. il Miniaturization SiP and MCM Motivation\, hurdles & Implementation"\n\nV irtual: https://events.vtools.ieee.org/m/298846 LOCATION:Virtual: https://events.vtools.ieee.org/m/298846 ORGANIZER:aviv76@gmail.com SEQUENCE:1 SUMMARY:COMCAS 2021 - EPS sessions URL;VALUE=URI:https://events.vtools.ieee.org/m/298846 X-ALT-DESC:Description: <br /><p>Comcas is an international conference happ ening every 2 years. In 2021 we had 3 seesions of EPS in COMCAS where 21 l ectuerers came and gave their knowlwdge in the fileld of electronic packag ing. most of the presentors were from the industry and some of them from t he academy.</p>\n<p>The room of the EPS sessions were full of people and i t was a great conference although the COVID.</p>\n<p>&nbsp\;</p><br /><br />Agenda: <br /><p>9:00 - 9:15 1 Rafael Ayelet Belous Israel ayeletb1@rafa el.co.il Sealing Challenges of the Hi-End MEMS Sensors</p>\n<p>9:15 - 9:30 2 Elbit - Elop Yuval Ulman Israel Yuval.Ullman@elbitsystems.com Design an d optimization of Phase Change Material cooling solutions by utilizing 3D printing technologies</p>\n<p>9:30 - 9:45 3 NVIDIA Marisa Sheffer Israel m sheffer@nvidia.com XL Flip Chip Ball Grid Array (FCBGA) package developmen t\, challenges and solutions</p>\n<p>9:45 - 10:00 4 Phononics Shye Shapira Israel shyesh@towersemi.com Performance Enhancement of Integrated Circuit s and Power Devices via Embedded Diamond Heat Management</p>\n<p>10:00 - 1 0:15 5 PCB Yaniv Maydar Israel yaniv@pcb-technologies.com SiP (System in P ackage) - More than Moore</p>\n<p>10:15 - 10:30 6 ANSYS Omri Yannay Israel omri.yannay@ansys.com Process Simulation in Micro-Electrical Mechanical S ystems. Structural and Thermal State During Photo-Lithography Layup of a P irani Sensor</p>\n<p>10:30 - 10:50 7 BGU Gennady Ziskind Israel gziskind@b gu.ac.il In memoriam - Prof. Avi Bar-Cohen</p>\n<p>11:10 - 11:25 8 Elbit - Elop Galit Zilberman Israel galit.zilberman@elbitsystems.com From Nano to Bio - Eco Friendly coatings</p>\n<p>11:25 - 11:40 9 Copprint Ofer Shohat Israel ofer@copprint.com Conductive Copper ink printing for the additive m anufacturing of low cost and sustainable electric circuits and antennas</p >\n<p>11:40 - 11:55 10 Nano Dimension Ziv Cohen Israel ziv@nano-di.com Add itively Manufactured Electronics (AME) for multilayers applications</p>\n< p>11:55 - 12:10 11 Rafael Ronen Maimon Israel ronenma@rafael.co.il The imp act of adhesives mechanical properties on the behavior of a closed loop ME MS accelerometer</p>\n<p>12:10 - 12:25 12 Rafael Jonathan Rothschild Israe l yonathanr@rafael.co.il An empirical method for determining the reliabili ty of die-attach joints in hybrid modules</p>\n<p>12:25 - 12:40 13 Bar-Ila n University Doron Naveh Israel Doron.Naveh@biu.ac.il Graphene in thermal management</p>\n<p>12:40 - 13:00 14 Technion Eilam Yalon Israel eilamy@gma il.com Sub-micron spatially resolved thermometry</p>\n<p>14:20 - 14:35 15 BGU Oren Regev Israel oregev@bgu.ac.il Enhanced thermal management of comp osite materials</p>\n<p>14:35 - 14:50 16 Mizur Technology Shay Kaplan Isra el shay@mizur.com Digital Loudspeaker packaging challenges</p>\n<p>14:50 - 15:05 17 PV Nano Cell Hanan Marcovitch Israel hanan@pvnanocell.com Digita l Printed Electronics: Mass-Production Technologies &amp\; Application</p> \n<p>15:05 - 15:20 18 ANSYS\, MARVELL\, INTEL Shai Sayfan-Altman Israel sh ai.sayfan-altman@ansys.com The Hidden Challenges in Manufacturing variatio ns</p>\n<p>15:20 - 15:35 19 ACT Adam F. Say USA Adam.Say@1-ACT.com A Compa rison of Advanced Passive and Active Cooling Solutions on the Basis of Siz e\, Weight and Power (SWaP)</p>\n<p>15:35 - 15:50 20 Rafael Elad Dor Israe l ELADDOR@rafael.co.il Thermal design and analysis for RPV's avionic box - challenges and solutions</p>\n<p>15:50 - 16:10 21 Elta Michael Kedem Isra el mkedem@elta.co.il Miniaturization SiP and MCM Motivation\, hurdles &amp \; Implementation"</p> END:VEVENT END:VCALENDAR