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PRODID:IEEE vTools.Events//EN
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TZID:Israel
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DTSTART:20210326T030000
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TZOFFSETTO:+0300
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TZNAME:IDT
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DTSTART:20211031T010000
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BEGIN:VEVENT
DTSTAMP:20220103T090949Z
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DTSTART;TZID=Israel:20211019T110000
DTEND;TZID=Israel:20211019T140000
DESCRIPTION:A new course with a collaboration between IEEE EPS Israel and t
 he dept. of mechanuck enguneering in Ben Gurion University. The agenda of 
 the course includes subjects such as: system engineering\, specs\, envirom
 ental conditions\, adhesives\, soldering\, PCB\, thermal management\, dyna
 mic design of electronic systems\, FEA\, screws and nuts\, microelectronic
  packaging and more...\n\nVirtual: https://events.vtools.ieee.org/m/298848
LOCATION:Virtual: https://events.vtools.ieee.org/m/298848
ORGANIZER:aviv76@gmail.com
SEQUENCE:0
SUMMARY:"Introduction to Electronic & Microelectronic Packaging" course
URL;VALUE=URI:https://events.vtools.ieee.org/m/298848
X-ALT-DESC:Description: <br /><p>A new course with a collaboration between 
 IEEE EPS Israel and the dept. of mechanuck enguneering in Ben Gurion Unive
 rsity. The agenda of the course includes subjects such as: system engineer
 ing\, specs\, enviromental conditions\, adhesives\, soldering\, PCB\, ther
 mal management\, dynamic design of electronic systems\, FEA\, screws and n
 uts\, microelectronic packaging and more...</p>
END:VEVENT
END:VCALENDAR