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DTSTART:20220313T030000
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DTSTAMP:20220511T165749Z
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DTSTART;TZID=US/Eastern:20220506T130000
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DESCRIPTION:Advanced Packaging technologies including Silicon and Silicon p
 hotonics are key enablers for scaling Hyperscale Data Center. This talk wi
 ll discuss the roadmap of technology building blocks with a focus on incre
 asing in performance while reducing power per Gbps. Challenges toward devi
 ce integration\, reliability and industry eco-system collaboration will al
 so be elaborated.\n\nSpeaker(s): Dr Jie Xue\, \n\nVirtual: https://events.
 vtools.ieee.org/m/311290
LOCATION:Virtual: https://events.vtools.ieee.org/m/311290
ORGANIZER:chanb@binghamton.edu
SEQUENCE:3
SUMMARY:Advanced Packaging in Hyperscale Data Center Applications
URL;VALUE=URI:https://events.vtools.ieee.org/m/311290
X-ALT-DESC:Description: <br /><p>Advanced Packaging technologies including 
 Silicon and Silicon photonics are key enablers for scaling Hyperscale Data
  Center. This talk will discuss the roadmap of technology building blocks 
 with a focus on increasing in performance while reducing power per Gbps. C
 hallenges toward device integration\, reliability and industry eco-system 
 collaboration will also be elaborated.</p>
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