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TZID:Europe/Riga
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DTSTART:20220327T040000
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DTSTAMP:20220520T074220Z
UID:ABE7ECBE-9080-4C17-9524-479F931E249D
DTSTART;TZID=Europe/Riga:20220512T163000
DTEND;TZID=Europe/Riga:20220512T183000
DESCRIPTION:In this Microwave Distinguished Lecture Prof. Jasmin Grosinger 
 will present radio frequency (RF) design solutions for wireless sensor nod
 es to solve sustainability issues in the Internet of things (IoT)\, which 
 arise due to the massive deployment of wireless IoT nodes on environmental
  and economic levels. Engineers can apply these RF design solutions to imp
 rove the ultra-low-power operation of IoT nodes\, avoid batteries’ eco-t
 oxicity\, and decrease maintenance costs due to battery replacement. The p
 resented solutions offer high integration levels based on system-on-chip a
 nd system-in-package concepts in low-cost complementary metal-oxide-semico
 nductor technologies to limit costs and carbon footprints of these nodes.\
 n\nSpeaker(s): Prof. Jasmin Grosinger \, \n\nRoom: 201\, Bldg: 12\, Street
  Azenes\, Riga\, Latvia\, Latvia\, Virtual: https://events.vtools.ieee.org
 /m/313444
LOCATION:Room: 201\, Bldg: 12\, Street Azenes\, Riga\, Latvia\, Latvia\, Vi
 rtual: https://events.vtools.ieee.org/m/313444
ORGANIZER:aboltins@ieee.org
SEQUENCE:4
SUMMARY:RF Design for Ultra-Low-Power Wireless Communication Systems: Effic
 iently Miniaturizing and Passively Sensing
URL;VALUE=URI:https://events.vtools.ieee.org/m/313444
X-ALT-DESC:Description: <br /><p>In this Microwave Distinguished Lecture Pr
 of. Jasmin Grosinger will present radio frequency (RF) design solutions fo
 r wireless sensor nodes to solve sustainability issues in the Internet of 
 things (IoT)\, which arise due to the massive deployment of wireless IoT n
 odes on environmental and economic levels. Engineers can apply these RF de
 sign solutions to improve the ultra-low-power operation of IoT nodes\, avo
 id batteries&rsquo\; eco-toxicity\, and decrease maintenance costs due to 
 battery replacement. The presented solutions offer high integration levels
  based on system-on-chip and system-in-package concepts in low-cost comple
 mentary metal-oxide-semiconductor technologies to limit costs and carbon f
 ootprints of these nodes.</p>
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