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DTSTART:20220313T030000
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DTSTAMP:20220611T230004Z
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DTSTART;TZID=America/New_York:20220610T100000
DTEND;TZID=America/New_York:20220610T140000
DESCRIPTION:The University of Windsor has recently procured several machine
 s capable of fabricating dual layer PCBs complete with through-hole platin
 g\, solder mask\, silk screen and solder paste deposition. The newly const
 ructed PCB Fabrication lab s a valuable asset for engineering student club
 s\, capstone students\, researchers and electrical hobbyists. This lab is 
 located in CEI2205 and is available to all undergraduate engineering stude
 nts free of charge.\n\nThe purpose of this event is to introduce and famil
 iarize all attendees with the PCB fabrication equipment to advance their c
 ircuit design and fabrication skillset. Drop by CEI2205 any time between 1
 0:00am and 2:00pm to learn about this exciting new lab equipment.\n\nCo-sp
 onsored by: OACETT\n\nSpeaker(s): Aya Abu-Libdeh\, Dora Strelkova\n\nWinds
 or\, Ontario\, Canada
LOCATION:Windsor\, Ontario\, Canada
ORGANIZER:abulibd1@uwindsor.ca
SEQUENCE:7
SUMMARY:PCB Fabrication Lab Tutorial
URL;VALUE=URI:https://events.vtools.ieee.org/m/315169
X-ALT-DESC:Description: <br /><p>The University of Windsor has recently pro
 cured several machines capable of fabricating dual layer PCBs complete wit
 h through-hole plating\, solder mask\, silk screen and solder paste deposi
 tion. The newly constructed PCB Fabrication lab s a valuable asset for eng
 ineering student clubs\, capstone students\, researchers and electrical ho
 bbyists. This lab is located in CEI2205 and is available to all undergradu
 ate engineering students free of charge.&nbsp\;&nbsp\;</p>\n<p>The purpose
  of this event is to introduce and familiarize all attendees with the PCB 
 fabrication equipment to advance their circuit design and fabrication skil
 lset. Drop by CEI2205 any time between 10:00am and 2:00pm to learn about t
 his exciting new lab equipment.&nbsp\;</p>
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