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TZOFFSETFROM:-0500
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TZNAME:EST
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DTSTAMP:20220617T164043Z
UID:F40BAE70-504C-4C41-B736-F4D3391DF680
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DTEND;TZID=America/New_York:20220615T130000
DESCRIPTION:The electrical design of computer systems\, which is often call
 ed signal integrity and power integrity\, is a cross-discipline engineerin
 g effort essential to reliable operation of complex systems. This presenta
 tion will cover the development of electrical techniques\, tools\, and met
 hodologies as applied to the design of systems. These concepts have become
  the fundamentals on which today’s electrical design methodologies are b
 uilt. Currently\, heterogeneous integration driving the advancement of sys
 tems and increased integration of special processor cores and accelerators
  has created a challenge as well as a great opportunity for the electrical
  packaging engineer. Advancing the existing design practices to include co
 -design of chips and packages\, multi-physics analysis with thermal-electr
 ical analysis is a current focus of academic and industry development to a
 chieve a higher level of integration.\n\nCo-sponsored by: Binghamton Unive
 rsity IEEC\n\nSpeaker(s): Dr Dale Becker\, \n\nRoom: Fountain Room\, Smart
  Energy\, Bldg: Smart Energy Building\, Binghamton University \, 85 Murray
  Hill Road\, Vestal \, New York\, United States\, 13850
LOCATION:Room: Fountain Room\, Smart Energy\, Bldg: Smart Energy Building\,
  Binghamton University \, 85 Murray Hill Road\, Vestal \, New York\, Unite
 d States\, 13850
ORGANIZER:chanb@binghamton.edu
SEQUENCE:3
SUMMARY:Electrical Design of Advanced Packaging in Computing Systems 
URL;VALUE=URI:https://events.vtools.ieee.org/m/315358
X-ALT-DESC:Description: <br /><p>The electrical design of computer systems\
 , which is often called signal integrity and power integrity\, is a cross-
 discipline engineering effort essential to reliable operation of complex s
 ystems. This presentation will cover the development of electrical techniq
 ues\, tools\, and methodologies as applied to the design of systems.&nbsp\
 ; These concepts have become the fundamentals on which today&rsquo\;s elec
 trical design methodologies are built. Currently\, heterogeneous integrati
 on driving the advancement of systems and increased integration of special
  processor cores and accelerators has created a challenge as well as a gre
 at opportunity for the electrical packaging engineer. Advancing the existi
 ng design practices to include co-design of chips and packages\, multi-phy
 sics analysis with thermal-electrical analysis is a current focus of acade
 mic and industry development to achieve a higher level of integration.</p>
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