BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20220313T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:PDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20221106T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:PST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20220721T160803Z
UID:732F37F8-A815-4394-85B6-38CC6C3D1430
DTSTART;TZID=America/Los_Angeles:20220721T080000
DTEND;TZID=America/Los_Angeles:20220721T090000
DESCRIPTION:Current development in automotive electronics is driven by four
  major trends: Connectivity\, Automation\, Sharing and Electrification\, o
 r CASE. To fulfill the expectation of society\, electronic components and 
 systems are becoming more complex with a significant increase in functiona
 lity. All these trends create new technical challenges\, such as new use-c
 ase conditions\, extended usage due to driving and charging\, transferring
  consumer-based technologies into an automotive harsh environment\, etc. T
 hese challenges are consequently solved during the design and development 
 phase of novel electronics products using the physics of failure reliabili
 ty approach supported by simulations. The typical reliability approach is 
 divided into the component-\, board- and system level. Numerical simulatio
 ns are used in a similar multi-stage fashion\, transferring the informatio
 n about loading conditions to specific testing scenarios. To fully rely on
  the simulation\, validation of the numerical model is an important step. 
 In this webinar\, I will present an application of the piezoresistive stre
 ss sensor to monitor the stress state during different stages of reliabili
 ty assessment\, from component to ECU level.\n\nSpeaker(s): Przemyslaw Gro
 mala\, \n\nAgenda: \n— automotive electronics\, harsh environment\, stre
 ss sensor\, design\, functionality\, use cases\, simulations\, validation 
 …\n\nVirtual: https://events.vtools.ieee.org/m/315447
LOCATION:Virtual: https://events.vtools.ieee.org/m/315447
ORGANIZER:p.wesling@ieee.org
SEQUENCE:2
SUMMARY:In-situ Monitoring of Thermo-mechanical Induced Stress in ASICs and
  Electronic Control Units for Automotive
URL;VALUE=URI:https://events.vtools.ieee.org/m/315447
X-ALT-DESC:Description: <br /><p>Current development in <strong>automotive 
 electronics</strong> is driven by four major trends:<strong> Connectivity\
 , Automation\, Sharing and Electrification</strong>\, or CASE. To fulfill 
 the expectation of society\, electronic components and systems are becomin
 g more complex with a significant increase in functionality. All these tre
 nds create new technical challenges\, such as new use-case conditions\, ex
 tended usage due to driving and charging\, transferring consumer-based tec
 hnologies into an automotive harsh environment\, etc. These challenges are
  consequently solved during the design and development phase of novel elec
 tronics products using the physics of failure reliability approach support
 ed by simulations. The typical reliability approach is divided into the co
 mponent-\, board- and system level. <strong>Numerical simulations </strong
 >are used in a similar multi-stage fashion\, transferring the information 
 about loading conditions to specific testing scenarios. To fully rely on t
 he simulation\, <strong>validation</strong> of the numerical model is an i
 mportant step. In this webinar\, I will present an application of the piez
 oresistive stress sensor to monitor the stress state during different stag
 es of reliability assessment\, from component to ECU level.</p><br /><br /
 >Agenda: <br /><p><em>&mdash\; automotive electronics\, harsh environment\
 , stress sensor\, design\, functionality\, use cases\, simulations\, valid
 ation &hellip\;</em></p>
END:VEVENT
END:VCALENDAR