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DTSTART:20220313T030000
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DTSTAMP:20220929T193448Z
UID:A320F682-4EBA-431D-886D-FC10B2576603
DTSTART;TZID=America/New_York:20220811T081500
DTEND;TZID=America/New_York:20220811T123000
DESCRIPTION:Various speakers will give talks on advanced technologies for i
 nter-chiplet connectivity\n\nSpeaker(s): Various speakers\, \n\nAgenda: \n
 Vineet Pancholi\, Sr Director\, Test Technology\, Amkor Technology\, Inc.\
 , Topic: Advanced Technologies for Inter- Chiplet Connectivity\n\nDr. Ning
 -Cheng Lee \, ShinePure Hi-Tech\, Topic: Material Considerations for high 
 Reliability Pb-Free Solder Joints\n\nDr. Tanja Braun\, Fraunhofer IZM\, De
 pt. System Integration and Interconnection Technologies\, Topic: Advanced 
 Packaging – Key for Heterogeneous Integration\n\nDr. Junghyun Cho\, Prof
 essor\, SUNY Binghamton\, Topic: Bonding Technologies toward Ultra Fine Pi
 tch 3D Interconnection\n\nBldg: NFS auditorium\, 255 Fuller Rd\, Albany\, 
 New York\, United States\, 12203-3603
LOCATION:Bldg: NFS auditorium\, 255 Fuller Rd\, Albany\, New York\, United 
 States\, 12203-3603
ORGANIZER:sathya.r@ibm.com
SEQUENCE:11
SUMMARY:Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivi
 ty
URL;VALUE=URI:https://events.vtools.ieee.org/m/320609
X-ALT-DESC:Description: <br /><p>Various speakers will give talks on advanc
 ed technologies for inter-chiplet connectivity</p><br /><br />Agenda: <br 
 /><p><span style="font-size: 12pt\;">Vineet Pancholi\,&nbsp\;Sr Director\,
  Test Technology\, Amkor Technology\, Inc.\, Topic: <strong>Advanced Techn
 ologies for Inter- Chiplet Connectivity</strong>&nbsp\;</span></p>\n<p><sp
 an style="font-size: 12pt\;">Dr. Ning-Cheng Lee \, ShinePure Hi-Tech\, Top
 ic: <strong>Material Considerations for high Reliability Pb-Free Solder Jo
 ints</strong>&nbsp\;</span></p>\n<p><span style="font-size: 12pt\;">Dr. Ta
 nja Braun\, Fraunhofer IZM\, Dept. System Integration and Interconnection 
 Technologies\, Topic: <strong>Advanced Packaging &ndash\; Key for Heteroge
 neous Integration</strong></span></p>\n<p><span style="font-size: 12pt\;">
 Dr. Junghyun Cho\, Professor\, SUNY Binghamton\, Topic: <strong>Bonding Te
 chnologies toward Ultra Fine Pitch 3D Interconnection</strong></span></p>
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