BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20220313T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20221106T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20220921T153638Z UID:E0BAEFC9-D394-4CC2-BA0C-C5ED59C4AB31 DTSTART;TZID=America/New_York:20220907T080000 DTEND;TZID=America/New_York:20220909T170000 DESCRIPTION:This year’s symposium was organized by Binghamton University\ , GE Research and IBM. We are having an electronic packaging symposium at Binghamton University on September 7th\, and 8th. Detailed information is below.\n\nThe agenda is packed and contains timely technical talks and wor kshops. A highlight of the conference will be our keynote speaker Frank Ga yle\, Deputy Director of the Office of Advanced Manufacturing at the Natio nal Institute of Standards and Technology\, and also Deputy Director of th e Advanced Manufacturing National Program Office.\n\nThe keynote will disc uss the unique opportunity to bolster the U.S. integrated circuit and pack aging production supply chain. Furthermore\, with $11 billion in appropria ted funds for both research and development\, and education and workforce development\, we can prepare for long-term U.S. leadership in microelectro nics. This keynote talk will present the opportunities described in the CH IPS ACT legislation and the approach that NIST and the Department of Comme rce are taking for implementation\n\nThis symposium brings together leader s in academia\, industry and government to discuss electronics packaging t opics of:\n\n- Future of Computing for HPC and AI\n- mm Wave\, 5G and 6G i n Packaging\n- Power Electronics\n- Thermal Challenges / Harsh Environment s\n- Flexible & Additive Electronics\n- Heterogeneous Integration\n- Advan ce Substrates\n- Wearable and Flexible Electronics for Medical Application s\n\nAgenda : https://www.binghamton.edu/ieec/eps/agenda.html\n\nThis year 's program includes keynotes\, 8 sessions with technical presentations\, a student poster session with students from local Universities\, and exhibi ts from leading companies.\n\nA special panel titled "Building the North A merican Ecosystem for Advanced Packaging: What Comes Next" will be held to discuss the state of the Electronics Industry Ecosystem with industry and government leaders.\n\nWe will be hosting an update to the Heterogeneous Integration Roadmap and discuss the challenges that we will face in the co ming years in advance packaging. We aim to share quality\, up-to-date info rmation through different lenses on trending electronics packaging topics\ , and provide opportunities to network\, share one’s expertise\, learn\, and build partnerships.\n\nGeneral conference Information including speak er info and exhibitor opportunities:\n\nhttps://www.binghamton.edu/ieec/ep s/index.htm\n\nInformation on Travel and hotels may be found here:\n\nhttp s://www.binghamton.edu/ieec/eps/travel.html\n\nWe hope that you will join us in September.\n\nAgenda: \nhttps://www.binghamton.edu/ieec/eps/agenda.h tml\n\nRoom: Symposium Hall\, Bldg: Center of Excellence\, Binghamton Univ ersity State University of New York \, 85 Murray Hill Road\, Vestal \, New York\, United States\, 13850 LOCATION:Room: Symposium Hall\, Bldg: Center of Excellence\, Binghamton Uni versity State University of New York \, 85 Murray Hill Road\, Vestal \, Ne w York\, United States\, 13850 ORGANIZER:chanb@binghamton.edu SEQUENCE:3 SUMMARY:GE/BU/IBM Electronics Packaging Symposium URL;VALUE=URI:https://events.vtools.ieee.org/m/322286 X-ALT-DESC:Description: <br /><p>This year&rsquo\;s symposium was organized by Binghamton University\, GE Research and IBM.&nbsp\; We are having an e lectronic packaging symposium at Binghamton University on September 7<sup> th</sup>\, and 8<sup>th</sup>.&nbsp\; Detailed information is below.&nbsp\ ;&nbsp\;</p>\n<p>The agenda is packed and contains timely technical talks and workshops. &nbsp\;A &nbsp\;highlight of the conference will be our <st rong>keynote speaker Frank Gayle\,</strong> Deputy Director of the Office of Advanced Manufacturing at the National Institute of Standards and Techn ology\, and also Deputy Director of the Advanced Manufacturing National Pr ogram Office.</p>\n<p><em>The keynote will discuss the unique opportunity to bolster the U.S. integrated circuit and packaging production supply cha in.&nbsp\; Furthermore\, with $11 billion in appropriated funds for both r esearch and development\, and education and workforce development\, we can prepare for long-term U.S. leadership in microelectronics.&nbsp\; This ke ynote talk will present the opportunities described in the CHIPS ACT legis lation and the approach that NIST and the Department of Commerce are takin g for implementation</em></p>\n<p>This symposium brings together leaders i n academia\, industry and government to discuss electronics packaging topi cs of:</p>\n<ul>\n<li>Future of Computing for HPC and AI</li>\n<li>mm Wave \, 5G and 6G in Packaging</li>\n<li>Power Electronics</li>\n<li>Thermal Ch allenges / Harsh Environments</li>\n<li>Flexible &amp\; Additive Electroni cs</li>\n<li>Heterogeneous Integration</li>\n<li>Advance Substrates</li>\n <li>Wearable and Flexible Electronics for Medical Applications</li>\n</ul> \n<p>Agenda : <a href="https://www.binghamton.edu/ieec/eps/agenda.html">ht tps://www.binghamton.edu/ieec/eps/agenda.html</a></p>\n<p>This year's prog ram includes keynotes\, 8 sessions with technical presentations\, a studen t poster session with students from local Universities\, and exhibits from leading companies.</p>\n<p><strong><em>A special panel titled "Building t he North American Ecosystem for Advanced Packaging: What Comes Next"</em>< /strong> will be held to discuss the state of the Electronics Industry Eco system with industry and government leaders.</p>\n<p>We will be hosting an update to the <strong>Heterogeneous Integration Roadmap</strong> and disc uss the challenges that we will face in the coming years in advance packag ing. We aim to share quality\, up-to-date information through different le nses on trending electronics packaging topics\, and provide opportunities to network\, share one&rsquo\;s expertise\, learn\, and build partnerships .</p>\n<p>General conference Information including speaker info and exhibi tor opportunities:</p>\n<p><a href="https://www.binghamton.edu/ieec/eps/in dex.htm">https://www.binghamton.edu/ieec/eps/index.htm</a></p>\n<p>Informa tion on Travel and hotels may be found here:</p>\n<p><a href="https://www. binghamton.edu/ieec/eps/travel.html">https://www.binghamton.edu/ieec/eps/t ravel.html</a></p>\n<p>We hope that you will join us in September.</p><br /><br />Agenda: <br /><p><a title="2022 Electronics Packaging Symposium Pr ogram" href="https://www.binghamton.edu/ieec/eps/agenda.html">https://www. binghamton.edu/ieec/eps/agenda.html</a></p> END:VEVENT END:VCALENDAR