BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT DTSTART:20230312T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20221106T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20221207T025933Z UID:78BD270B-4401-48CD-9F86-684564D4138E DTSTART;TZID=America/Los_Angeles:20221109T080000 DTEND;TZID=America/Los_Angeles:20221110T170000 DESCRIPTION:This major Silicon Valley symposium will focus on quantified re liability\, accelerated testing and probabilistic assessments of the usefu l lifetime of electronic\, photonic\, MEMS and MOEMS materials\, assemblie s\, packages and systems in electronics and photonics packaging. This incl udes failure modes\, mechanisms\, testing schemes\, accelerated testing\, stress levels\, and environmental stresses.\nThe intent is to bring togeth er electrical\, reliability\, materials\, mechanical\, and computer engine ers and applied scientists to address the state-of-the-art in all the inte rconnected fields of electronic and photonic packaging\, with an emphasis on various reliability-related aspects: design-for-reliability\, manufactu ring\, reliability modeling and accelerated testing.\n\nSanta Clara\, Cali fornia\, United States\, Virtual: https://events.vtools.ieee.org/m/325054 LOCATION:Santa Clara\, California\, United States\, Virtual: https://events .vtools.ieee.org/m/325054 ORGANIZER:p.wesling@ieee.org SEQUENCE:4 SUMMARY:Symposium on Reliability for Electronics and Photonics Packaging URL;VALUE=URI:https://events.vtools.ieee.org/m/325054 X-ALT-DESC:Description: <br /><p>This major Silicon Valley symposium will f ocus on quantified reliability\, accelerated testing and probabilistic ass essments of the useful lifetime of electronic\, photonic\, MEMS and MOEMS materials\, assemblies\, packages and systems in electronics and photonics packaging. This includes failure modes\, mechanisms\, testing schemes\, a ccelerated testing\, stress levels\, and environmental stresses.<br />The intent is to bring together electrical\, reliability\, materials\, mechani cal\, and computer engineers and applied scientists to address the state-o f-the-art in all the interconnected fields of electronic and photonic pack aging\, with an emphasis on various reliability-related aspects: design-fo r-reliability\, manufacturing\, reliability modeling and accelerated testi ng.</p> END:VEVENT END:VCALENDAR